scholarly journals Tm3+: Bi4Si3O12 crystal as a promising diode pumped laser source near 2 μm: growth, spectroscopic properties and laser performance

2021 ◽  
Author(s):  
YAN ZHANG ◽  
Liwu Huang ◽  
Xiaoming Duan ◽  
Zheng Gong ◽  
Tian Tian ◽  
...  
Keyword(s):  
Spectroscopic Properties ◽  
Laser Source ◽  
Laser Performance ◽  
Diode Pumped

Spectroscopic properties and diode-pumped 1594 nm laser performance of Er:Yb:Li6Y(BO3)3 crystal

2008 ◽  
Vol 90 (3-4) ◽  
pp. 461-464 ◽  
Author(s):  
Y.W. Zhao ◽  
Y.F. Lin ◽  
Y.J. Chen ◽  
X.H. Gong ◽  
Z.D. Luo ◽  
...  
Keyword(s):  
Spectroscopic Properties ◽  
Laser Performance ◽  
Diode Pumped

Femtosecond and continuous-wave laser performance of a diode-pumped Yb^3+:CaYAlO_4 laser

2011 ◽  
Vol 36 (2) ◽  
pp. 259 ◽  
Author(s):  
W. D. Tan ◽  
D. Y. Tang ◽  
X. D. Xu ◽  
D. Z. Li ◽  
J. Zhang ◽  
...  
Keyword(s):  
Continuous Wave ◽  
Continuous Wave Laser ◽  
Laser Performance ◽  
Diode Pumped ◽  
Wave Laser

Compact diode-pumped 598-nm laser source

2002 ◽  
Author(s):  
Joshua Simons ◽  
Helen M. Pask ◽  
Peter Dekker ◽  
James A. Piper
Keyword(s):  
Laser Source ◽  
Diode Pumped

scholarly journals Comparison of the laser performance of various neodymium doped materials in a compact diode pumped cavity

1994 ◽  
Vol 04 (C4) ◽  
pp. C4-549-C4-552 ◽  
Author(s):  
C. BOREL ◽  
N. HERLET ◽  
R. TEMPLIER ◽  
C. CALVAT ◽  
C. WYON
Keyword(s):  
Laser Performance ◽  
Diode Pumped ◽  
Doped Materials

Laser-Based Target Preparation in 3D Integrated Electronic Packages

2009 ◽  
Vol 131 (3) ◽  
Author(s):  
Stefan Martens ◽  
Walter Mack ◽  
Frédéric Courtade ◽  
Philippe Perdu ◽  
Juergen Wilde ◽  
...  
Keyword(s):  
Cross Sections ◽  
Ultrashort Pulse ◽  
Electronic Packaging ◽  
Laser Wavelength ◽  
Laser Source ◽  
Preparation Methods ◽  
Target Preparation ◽  
Molding Compound ◽  
Ultrashort Pulse Lasers ◽  
Diode Pumped

The trend toward 3D integration in electronic packaging requires that failure analysis procedures and target preparation methods are adapted from conventional discrete packages to these emerging packaging technologies. This paper addresses the feasibility of laser-based target preparation in 3D integrated devices, especially stacked-die packages. Various laser technologies such as ultrashort-pulse lasers, excimer lasers, and diode-pumped solid-state (DPSS) lasers with different wavelengths and pulse durations were evaluated. In particular, it was found that ultrashort-pulse lasers with pulse durations in the femtosecond range were not suitable for ablation of the molding compound (MC). Picosecond lasers were applicable with certain constraints. It was found that for MCs with high filler content, DPSS lasers with pulse durations in the nanosecond range were the best choice. For the removal of stacked silicon dies, the laser wavelength was the most important factor in artifact-free thinning. Laser cross sections through several silicon dies with remarkably small heat-affected zones were also demonstrated. The distinct removal of the MC, silicon dies, and metal interconnected with a single laser source offers new opportunities for laser-based target preparation in 3D integrated electronic packaging devices.

Laser performance and thermal lensing in high-power diode-pumped Yb:KGW with athermal orientation

2006 ◽  
Vol 83 (1) ◽  
pp. 55-59 ◽  
Author(s):  
J.E. Hellström ◽  
S. Bjurshagen ◽  
V. Pasiskevicius
Keyword(s):  
High Power ◽  
Thermal Lensing ◽  
Laser Performance ◽  
Diode Pumped ◽  
Power Diode
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