scholarly journals Optimization of metallic microheaters for high-speed reconfigurable silicon photonics

2010 ◽  
Vol 18 (17) ◽  
pp. 18312 ◽  
Author(s):  
A. H. Atabaki ◽  
E. Shah Hosseini ◽  
A. A. Eftekhar ◽  
S. Yegnanarayanan ◽  
A. Adibi
Keyword(s):  
Silicon Photonics ◽  
High Speed

Silicon-photonics-based optical transceivers for high-speed interconnect applications

2016 ◽  
Author(s):  
P. De Dobbelaere ◽  
G. Armijo ◽  
J. Balardeta ◽  
B. Chase ◽  
Y. Chi ◽  
...  
Keyword(s):  
Silicon Photonics ◽  
High Speed ◽  
Optical Transceivers

Si Photonics Deployment Using Cu Pillar Interconnect and Chip On Wafer Platform

2016 ◽  
Vol 2016 (DPC) ◽  
pp. 001663-001681
Author(s):  
Miguel Jimarez
Keyword(s):  
Light Source ◽  
Silicon Photonics ◽  
High Speed ◽  
High Sensitivity ◽  
Optical Path ◽  
Clock Recovery ◽  
Wafer Scale ◽  
Si Photonics ◽  
Cu Pillar ◽  
Fine Pitch

We introduce a high-speed 4x25Gbps, MSA-compliant, QSFP transceiver built on a Silicon Photonics platform. The transceiver integrates high sensitivity receivers, CTLE, clock recovery, modulator drivers and BIST on a TSMC 28nm die connected to the photonic die thru a fine pitch (50um) Copper Pillar interface. A wafer-scale approach, Chip on Wafer, CoW, is used to assemble the electronic die and the light source on to the photonic die, so that the full optical path can be tested, at speed, in loopback configuration in wafer form, using a standard ATE solution. This presentation focuses on the CoW assembly development aspects of the transceiver. Wafer probe and bump, die processing services, CoW assembly and Back End of Line, BEOL, Test Services will be presented.

scholarly journals High speed analog-to-digital conversion with silicon photonics

2009 ◽  
Author(s):  
C. W. Holzwarth ◽  
R. Amatya ◽  
M. Araghchini ◽  
J. Birge ◽  
H. Byun ◽  
...  
Keyword(s):  
Silicon Photonics ◽  
High Speed ◽  
Digital Conversion ◽  
Analog To Digital ◽  
Analog To Digital Conversion

Progress in silicon platforms for integrated optics

Nanophotonics ◽  
2014 ◽  
Vol 3 (4-5) ◽  
pp. 205-214 ◽  
Author(s):  
Ari Novack ◽  
Matt Streshinsky ◽  
Ran Ding ◽  
Yang Liu ◽  
Andy Eu-Jin Lim ◽  
...  
Keyword(s):  
Silicon Photonics ◽  
High Speed ◽  
Passive Components ◽  
Development Costs ◽  
Silicon Photonic ◽  
Building Systems ◽  
Recent Developments ◽  
Process Risk ◽  
Further Development ◽  
Made In

AbstractRapid progress has been made in recent years repurposing CMOS fabrication tools to build complex photonic circuits. As the field of silicon photonics becomes more mature, foundry processes will be an essential piece of the ecosystem for eliminating process risk and allowing the community to focus on adding value through clever design. Multi-project wafer runs are a useful tool to promote further development by providing inexpensive, low-risk prototyping opportunities to academic and commercial researchers. Compared to dedicated silicon manufacturing runs, multi-project-wafer runs offer cost reductions of 100× or more. Through OpSIS, we have begun to offer validated device libraries that allow designers to focus on building systems rather than modifying device geometries. The EDA tools that will enable rapid design of such complex systems are under intense development. Progress is also being made in developing practical optical and electronic packaging solutions for the photonic chips, in ways that eliminate or sharply reduce development costs for the user community. This paper will provide a review of the recent developments in silicon photonic foundry offerings with a focus on OpSIS, a multi-project-wafer foundry service offering a silicon photonics platform, including a variety of passive components as well as high-speed modulators and photodetectors, through the Institute of Microelectronics in Singapore.

scholarly journals Silicon photonics devices for integrated analog signal processing and sampling

Nanophotonics ◽  
2014 ◽  
Vol 3 (4-5) ◽  
pp. 313-327 ◽  
Author(s):  
Steven Spector ◽  
Cheryl Sorace-Agaskar
Keyword(s):  
Signal Processing ◽  
Silicon Photonics ◽  
High Speed ◽  
Analog Signal Processing ◽  
Photonic Devices ◽  
Analog Signal ◽  
Optical Systems ◽  
Analog To Digital ◽  
And Performance ◽  
Analog Systems

AbstractSilicon photonics offers the possibility of a reduction in size weight and power for many optical systems, and could open up the ability to build optical systems with complexities that would otherwise be impossible to achieve. Silicon photonics is an emerging technology that has already been inserted into commercial communication products. This technology has also been applied to analog signal processing applications. MIT Lincoln Laboratory in collaboration with groups at MIT has developed a toolkit of silicon photonic devices with a focus on the needs of analog systems. This toolkit includes low-loss waveguides, a high-speed modulator, ring resonator based filter bank, and all-silicon photodiodes. The components are integrated together for a hybrid photonic and electronic analog-to-digital converter. The development and performance of these devices will be discussed. Additionally, the linear performance of these devices, which is important for analog systems, is also investigated.

scholarly journals Silicon photonics for high data rate applications -INVITED

2020 ◽  
Vol 238 ◽  
pp. 01005
Author(s):  
David J. Thomson ◽  
Weiwei Zhang ◽  
Ke Li ◽  
Kapil Debnath ◽  
Shenghao Liu ◽  
...  
Keyword(s):  
Silicon Photonics ◽  
High Speed ◽  
High Performance ◽  
High Efficiency ◽  
Electrical Signal ◽  
Electronic Components ◽  
High Data ◽  
Electro Optic ◽  
Optical Domain ◽  
Linear Modulation

The high speed conversion of signals between the optical and electrical domains is crucial for many key applications of silicon photonics. Electro-optic modulators integrated with electronic drive amplifiers are typically used to convert an electrical signal to the optical domain. Design of these individual elements is important to achieve high performance, however a true optimisation requires careful co-design of the photonic and electronic components considering the properties of each other. Here we present our recent results in this area together with a MOSCAP type modulator with the potential for high speed, high efficiency and highly linear modulation.

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