scholarly journals Dynamic ultrafast laser spatial tailoring for parallel micromachining of photonic devices in transparent materials

2009 ◽  
Vol 17 (5) ◽  
pp. 3531 ◽  
Author(s):  
C. Mauclair ◽  
G. Cheng ◽  
N. Huot ◽  
E. Audouard ◽  
A. Rosenfeld ◽  
...  
Keyword(s):  
Photonic Devices ◽  
Ultrafast Laser ◽  
Transparent Materials

Dynamic ultrafast laser beam tailoring for multispot photo-inscription of photonic devices in bulk transparent materials

2009 ◽  
Author(s):  
C. Mauclair ◽  
G. Cheng ◽  
N. Huot ◽  
E. Audouard ◽  
A. Rosenfeld ◽  
...  
Keyword(s):  
Laser Beam ◽  
Photonic Devices ◽  
Ultrafast Laser ◽  
Transparent Materials

Ultrafast laser direct writing and nanostructuring in transparent materials

2014 ◽  
Vol 6 (3) ◽  
pp. 293 ◽  
Author(s):  
Martynas Beresna ◽  
Mindaugas Gecevičius ◽  
Peter G. Kazansky
Keyword(s):  
Ultrafast Laser ◽  
Direct Writing ◽  
Laser Direct Writing ◽  
Transparent Materials

Phase Transitions Induced by Ultrafast Laser Writing in Transparent Materials

2011 ◽  
Author(s):  
Peter G. Kazansky ◽  
Martynas Beresna ◽  
Mindaugas Gecevicius ◽  
Costantino Corbari ◽  
Yasuhiko Shimotsuma ◽  
...  
Keyword(s):  
Phase Transitions ◽  
Ultrafast Laser ◽  
Laser Writing ◽  
Transparent Materials

scholarly journals SINGLE PASS CLEAVING OF ULTRAFAST LASER MODIFIED C-SHAPED GLASS EDGES

2021 ◽  
Author(s):  
Daniel Flamm ◽  
Myriam Kaiser ◽  
Jonas Kleiner ◽  
Tim Hesse
Keyword(s):  
Beam Splitter ◽  
Selective Etching ◽  
Ultrafast Laser ◽  
Full Thickness ◽  
Single Pass ◽  
Optical Head ◽  
Single Side ◽  
Transparent Materials ◽  
Shaped Glass ◽  
Edge Contours

We report on single-pass laser cleaving of transparent materials with C-shaped edges that exhibit 45-deg tangential angles to the surface. A holographic 3D beam splitter distributes several foci along the desired edge contours, including C-shaped edges. Single-pass, full thickness laser modifications are achieved requiring single-side access to the workpiece only without inclining the optical head. After having induced laser modifications with feed rates in the order of 100 mm/s actual separation is performed using a selective etching strategy.

Ultrafast laser processing of transparent materials

2004 ◽  
Author(s):  
Z. B. Wang ◽  
Ming Hui Hong ◽  
L. Yin ◽  
Tow Chong Chong
Keyword(s):  
Laser Processing ◽  
Ultrafast Laser ◽  
Transparent Materials
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