Ultrashort-Pulse Lasers for Nonlinear Microscopies

2011 ◽  
Author(s):  
Frank Wise
Keyword(s):  
Ultrashort Pulse ◽  
Ultrashort Pulse Lasers

Precision machining using UV and ultrashort-pulse lasers

1999 ◽  
Author(s):  
Hans K. Toenshoff ◽  
Ferdinand von Alvensleben ◽  
Andreas Ostendorf ◽  
Guido Willmann ◽  
Thilo Wagner
Keyword(s):  
Ultrashort Pulse ◽  
Precision Machining ◽  
Ultrashort Pulse Lasers

Quantitative investigation of optical phase-measuring techniques for ultrashort pulse lasers

1996 ◽  
Vol 13 (9) ◽  
pp. 1965 ◽  
Author(s):  
A. Sullivan ◽  
W. E. White ◽  
K. C. Chu ◽  
J. P. Heritage ◽  
K. W. Delong ◽  
...  
Keyword(s):  
Ultrashort Pulse ◽  
Quantitative Investigation ◽  
Optical Phase ◽  
Measuring Techniques ◽  
Ultrashort Pulse Lasers

Laser-Based Target Preparation in 3D Integrated Electronic Packages

2009 ◽  
Vol 131 (3) ◽  
Author(s):  
Stefan Martens ◽  
Walter Mack ◽  
Frédéric Courtade ◽  
Philippe Perdu ◽  
Juergen Wilde ◽  
...  
Keyword(s):  
Cross Sections ◽  
Ultrashort Pulse ◽  
Electronic Packaging ◽  
Laser Wavelength ◽  
Laser Source ◽  
Preparation Methods ◽  
Target Preparation ◽  
Molding Compound ◽  
Ultrashort Pulse Lasers ◽  
Diode Pumped

The trend toward 3D integration in electronic packaging requires that failure analysis procedures and target preparation methods are adapted from conventional discrete packages to these emerging packaging technologies. This paper addresses the feasibility of laser-based target preparation in 3D integrated devices, especially stacked-die packages. Various laser technologies such as ultrashort-pulse lasers, excimer lasers, and diode-pumped solid-state (DPSS) lasers with different wavelengths and pulse durations were evaluated. In particular, it was found that ultrashort-pulse lasers with pulse durations in the femtosecond range were not suitable for ablation of the molding compound (MC). Picosecond lasers were applicable with certain constraints. It was found that for MCs with high filler content, DPSS lasers with pulse durations in the nanosecond range were the best choice. For the removal of stacked silicon dies, the laser wavelength was the most important factor in artifact-free thinning. Laser cross sections through several silicon dies with remarkably small heat-affected zones were also demonstrated. The distinct removal of the MC, silicon dies, and metal interconnected with a single laser source offers new opportunities for laser-based target preparation in 3D integrated electronic packaging devices.

Ultrashort-pulse lasers

2001 ◽  
Vol 31 (2) ◽  
pp. 95-119 ◽  
Author(s):  
P G Kryukov
Keyword(s):  
Ultrashort Pulse ◽  
Ultrashort Pulse Lasers

Interaction of intense ultrashort pulse lasers with clusters

2008 ◽  
Vol 15 (5) ◽  
pp. 056705 ◽  
Author(s):  
G. M. Petrov ◽  
J. Davis
Keyword(s):  
Ultrashort Pulse ◽  
Ultrashort Pulse Lasers
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