Laser direct-write process for fabrication of VLSI gate-array interconnects

Author(s):  
Bruce M. McWilliams
1983 ◽  
Vol 29 ◽  
Author(s):  
D. J. Silversmith ◽  
D. J. Ehrlich ◽  
J. Y. Tsao ◽  
R. W. Mountain ◽  
J. H. C. Sedlacek

ABSTRACTUsing CMOS, poly-Si gate, single-level metal, gate-array chips, techniques have been developed to reconfigure the interconnect metallization on individual circuits without degradation of device or circuit performance. These techniques involve a laser-assisted capillary wet-etch process for highly selective removal of Al-alloy interconnects and laser CVD of doped poly-Si links. This technique may be useful for prototyping, testing and optimization of gate-array and standard-cell designs and layouts.


2006 ◽  
Vol 29 (1) ◽  
pp. 184-189
Author(s):  
Chengping Zhang ◽  
R. Bartholomew ◽  
P.C. Karulkar

2002 ◽  
Vol 18 (5) ◽  
pp. 1126-1129 ◽  
Author(s):  
B.R. Ringeisen ◽  
P.K. Wu ◽  
H. Kim ◽  
A. Pique ◽  
R.Y.C. Auyeung ◽  
...  

2004 ◽  
Vol 79 (4-6) ◽  
pp. 783-786 ◽  
Author(s):  
A. Piqué ◽  
C.B. Arnold ◽  
H. Kim ◽  
M. Ollinger ◽  
T.E. Sutto

Author(s):  
Andrew D. Dias ◽  
David M. Kingsley ◽  
Douglas B. Chrisey ◽  
David T. Corr

Microbeads are becoming popular tools in tissue engineering as 3D microstructure hydrogels. The gel nature of microbeads enables them to sequester soluble factors and mammalian cells, and their high surface area-to-volume ratio allows diffusion between the bead and the environment [1,2]. Microbeads are thus good systems for drug delivery and can serve as 3D microenvironments for cells. To fully maximize their potential as delivery systems and microenvironments, it is highly desirable to create spatially-precise hybrid cultures of microbeads and mammalian cells. Precise placement of microbeads in proximity to patterned cells will allow the study of spatial cellular interactions, paracrine signaling, and drug delivery.


2004 ◽  
Vol 850 ◽  
Author(s):  
Koji Sugioka ◽  
Ya Cheng ◽  
Katsumi Midorikawa

ABSTRACT3D microstructuring of photosensitive glass is demonstrated by femtosecond (fs) laser for lab-on-a-chip manufacture. True 3D hollow microstructures embedded in the glass are fabricated by the fs laser direct write followed by heat treatment and successive wet etching. A variety of microcomponents for a lab-on-a-chip device like a microfluidics, a microvalve, a microoptics, a microlaser, etc. are fabricated by using this technique. The fs laser direct write process is also applied for selective metallization of internal walls of the hollow microstructures embedded in the glass for electric control of movement of the micromechanical components in the lab-on-a-chip device.


1998 ◽  
Vol 70 (22) ◽  
pp. 4645-4652 ◽  
Author(s):  
B. A. Grzybowski ◽  
R. Haag ◽  
N. Bowden ◽  
G. M. Whitesides

Sign in / Sign up

Export Citation Format

Share Document