A High-Performance D-Lithium Neutron Source for Fusion Technology Testing: Accelerator Driver Design

1989 ◽  
Vol 15 (2P2A) ◽  
pp. 289-294 ◽  
Author(s):  
George P. Lawrence ◽  
Thomas P. Wangler ◽  
Stanley O. Schriber ◽  
Edwin L. Kemp ◽  
Mahlon T. Wilson ◽  
...  
Author(s):  
G.P. Lawrence ◽  
T.S. Bhatia ◽  
B. Blind ◽  
F.W. Guy ◽  
R.A. Krakowski ◽  
...  

2020 ◽  
Vol 239 ◽  
pp. 23001
Author(s):  
Javier Praena ◽  
Francisco Garcia-Infantes ◽  
Rafael Rivera ◽  
Laura Fernandez-Maza ◽  
Fernando Arias de Saavedra ◽  
...  

The International Fusion Materials Irradiation Facility - Demo Oriented NEutron Source (IFMIF-DONES) is a single-sited novel Research Infrastructure for testing, validation and qualification of the materials to be used in a fusion reactor. Recently, IFMIF-DONES has been declared of interest by ESFRI (European Strategy Forum on Research Infrastructures) and its European host city would be Granada (Spain). In spite the first and most important application of IFMIF-DONES related to fusion technology, the unprecedented neutron flux available could be exploited without modifying the routine operation of IFMIF-DONES. Thus, it is already planned an experimental hall for a complementary program with neutrons. Also, a complementary program on the use of the deuteron beam could help IFMIF-DONES to be more sustainable. In the present work, we study radioisotope production with deuterons of 177Lu. The results show the viability of IFMIF-DONES for such production in terms of the needs of a territory of small-medium size. Also the study suggests that new nuclear data at higher deuteron energies are mandatory for an accurate study in this field.


2019 ◽  
Vol 26 ◽  
pp. 144
Author(s):  
T. Vasilopoulou ◽  
M. I. Savva ◽  
I. Michelakaki ◽  
K. Triantou ◽  
K. Mergia ◽  
...  

The intense collaborative effort for electricity generation through fusion is currently focused on the exploitation of the Joint European Torus (JET) as well as on the preparation of its successors ITER and DEMO. Within this frame, several experiments are carried out at JET aiming to study crucial aspects related to the construction and operation of ITER as well as to the design of future fusion power plants.Most important, a high-performance Deuterium-Tritium campaign is expected to take place at JET in 2020 providing unique neutron yields up to 1.7×1021 neutrons. This paper focuses on the participation of NCSRD fusion technology group in JET nuclear analysis and, in particular, on the implementation of activation experiments at JET and discusses the main achievements in the light of their significance for optimizing future fusion activities and studies.


1989 ◽  
Vol 8 (3-4) ◽  
pp. 201-227 ◽  
Author(s):  
G. P. Lawrence ◽  
G. L. Varsamis ◽  
T. S. Bhatia ◽  
B. Blind ◽  
F. W. Guy ◽  
...  

1990 ◽  
Vol 106 (2) ◽  
pp. 160-182 ◽  
Author(s):  
G. L. Varsamis ◽  
G. P. Lawrence ◽  
T. S. Bhatia ◽  
B. Blind ◽  
F. W. Guy ◽  
...  

2018 ◽  
Vol 2018 (HiTEC) ◽  
pp. 000051-000055
Author(s):  
Maciej Patelka ◽  
Nicholas Krasco ◽  
Sho Ikeda ◽  
Toshiyuki Sato ◽  
Miguel Goni ◽  
...  

Abstract High power semiconductor applications require a die attach material with high thermal conductivity to efficiently release the heat generated from these devices. Current die attach solutions such as eutectic solders and high thermal conductive silver epoxies and sintered silver adhesives have been industry standards, however may fall short in performance for high temperature or high stress applications. This presentation will focus on development of a reinforced, sintered silver die attach solution for high power semiconductor applications with focus on a pressure-less, low temperature sintering technology that offers high reliability for high temperature (250°C) applications. The electronic, optoelectronic, and semiconductor industries have the need for high performance adhesives, in particular, high power devices require low-stress, high thermal conductivity, thermally stable, and moisture resistant adhesives for the manufacture of high reliability devices. This paper introduces a new reinforced sintered silver adhesive based on the “resin-free” Conductive Fusion Technology. The high performance adhesive offers a robust solution for high temperature, high reliability applications. Conductive Fusion Technology consists of a high thermal conductivity silver component blended with a non-conductive, low-modulus powder component. The non-conductive powder component comprises an organically modified inorganic material that exhibits excellent thermal stability at temperatures exceeding 250°C. Properties of the sintered silver adhesive, such as storage modulus, can be modified by varying the content of the non-conductive component.


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