Theromophysical Properties and Microstructure of Plasma-Sprayed Tungsten Coating on Low Activation Materials

2009 ◽  
Vol 56 (2) ◽  
pp. 1053-1057 ◽  
Author(s):  
Takuya Nagasaka ◽  
Ryuta Kasada ◽  
Akihiko Kimura ◽  
Yoshio Ueda ◽  
Takeo Muroga
2004 ◽  
Vol 70 (4) ◽  
pp. 341-349 ◽  
Author(s):  
X. Liu ◽  
L. Yang ◽  
S. Tamura ◽  
K. Tokunaga ◽  
N. Yoshida ◽  
...  

2019 ◽  
Vol 358 ◽  
pp. 276-281 ◽  
Author(s):  
Fan Wang ◽  
Guang-Nan Luo ◽  
Jianjun Huang ◽  
Ying Liu

2006 ◽  
Vol 81 (1-7) ◽  
pp. 133-138 ◽  
Author(s):  
K. Tokunaga ◽  
Y. Kubota ◽  
N. Noda ◽  
Y. Imamura ◽  
A. Kurumada ◽  
...  

2007 ◽  
Vol 363-365 ◽  
pp. 1299-1303 ◽  
Author(s):  
Xiang Liu ◽  
Fu Zhang ◽  
Shunyan Tao ◽  
Yunzhen Cao ◽  
Zengyu Xu ◽  
...  

2007 ◽  
Vol 546-549 ◽  
pp. 1809-1812
Author(s):  
Shu Xiang Song ◽  
Zhang Jian Zhou ◽  
Juan Du ◽  
Chang Chun Ge

Tungsten has the highest melting point among all metal, which makes it withstand thermal shock and erosion in high temperature environments. In this study, Tungsten coatings were sprayed onto the oxygen-free copper substrates by plasma spraying using inert gases protection. XRD, SEM and EDS were used to identify the phases, morphologies and compositions of the coatings. Vickers micro-hardness and bonding strength of the tungsten coatings were also measured. The results revealed that the hardness distribution of the tungsten coatings was different along the thickness direction. The tungsten coating without any interlayer showed higher bonding strength than that of the other two coatings with NiCrAl and W/Cu interlayers, respectively.


2014 ◽  
Vol 809-810 ◽  
pp. 750-756
Author(s):  
Fa Li Chong

Tungsten was considered a promising plasma facing material in fusion device due to its high sputtering threshold, the high melting point,and so on. Several technologies fabricated tungsten armor on copper substrate were introduced, which included plasma sprayed tungsten coating, W/Cu functionally gradient material and the dispersiion strengtheded W alloys (W-TiC, W-La2O3). Meanwhile, W-Cu mock-up with the different compliant interlayers was optimizated by means of ANSYS code.


2015 ◽  
Vol 98-99 ◽  
pp. 2080-2084 ◽  
Author(s):  
Hiroyasu Tanigawa ◽  
Kazumi Ozawa ◽  
Yoshiaki Morisada ◽  
Sanghoon Noh ◽  
Hidetoshi Fujii

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