Application of Time Domain Reflectometry to Soilless Substrate Moisture Measurement

2003 ◽  
Author(s):  
David S. Ross ◽  
John D. Lea-Cox ◽  
Jason D. Murray
Keyword(s):  
Time Domain ◽  
Time Domain Reflectometry ◽  
Moisture Measurement ◽  
Substrate Moisture ◽  
Soilless Substrate

Noninvasive Time Domain Reflectometry Moisture Measurement Probe

1993 ◽  
Vol 57 (4) ◽  
pp. 934-936 ◽  
Author(s):  
John S. Selker ◽  
Lynette Graff ◽  
Tammo Steenhuis
Keyword(s):  
Time Domain ◽  
Time Domain Reflectometry ◽  
Moisture Measurement

scholarly journals Two- and three-parameter calibrations of time domain reflectometry for soil moisture measurement

1997 ◽  
Vol 33 (10) ◽  
pp. 2417-2421 ◽  
Author(s):  
C. Yu ◽  
A. W. Warrick ◽  
M. H. Conklin ◽  
M. H. Young ◽  
M. Zreda
Keyword(s):  
Soil Moisture ◽  
Time Domain ◽  
Time Domain Reflectometry ◽  
Moisture Measurement ◽  
Soil Moisture Measurement

Soil moisture measurement using portable dielectric probes and time domain reflectometry

1992 ◽  
Vol 28 (5) ◽  
pp. 1339-1346 ◽  
Author(s):  
B. Brisco ◽  
T. J. Pultz ◽  
R. J. Brown ◽  
G. C. Topp ◽  
M. A. Hares ◽  
...  
Keyword(s):  
Soil Moisture ◽  
Time Domain ◽  
Time Domain Reflectometry ◽  
Moisture Measurement ◽  
Soil Moisture Measurement

Advanced Non-Destructive Fault Isolation Techniques for PCB Substrates Using Magnetic Current Imaging and Terahertz Time Domain Reflectometry

2018 ◽  
Author(s):  
Daechul Choi ◽  
Yoonseong Kim ◽  
Jongyun Kim ◽  
Han Kim
Keyword(s):  
Time Domain ◽  
Quantum Interference ◽  
Flip Chip ◽  
Imaging System ◽  
Time Domain Reflectometry ◽  
Fault Isolation ◽  
Magnetic Current ◽  
Isolation Techniques ◽  
Super Conducting ◽  
Non Destructive

Abstract In this paper, we demonstrate cases for actual short and open failures in FCB (Flip Chip Bonding) substrates by using novel non-destructive techniques, known as SSM (Scanning Super-conducting Quantum Interference Device Microscopy) and Terahertz TDR (Time Domain Reflectometry) which is able to pinpoint failure locations. In addition, the defect location and accuracy is verified by a NIR (Near Infra-red) imaging system which is also one of the commonly used non-destructive failure analysis tools, and good agreement was made.

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