scholarly journals The Curing Reaction and Glass Transition Temperature of Maleimide Resin Containing Epoxy Groups

1988 ◽  
Vol 20 (2) ◽  
pp. 125-130 ◽  
Author(s):  
Akira Nagai ◽  
Akio Takahashi ◽  
Motoyo Wajima ◽  
Kenji Tsukanishi
Author(s):  
Wenxin Wei ◽  
Guifeng Ma ◽  
Hongtao Wang ◽  
Jun Li

Objective: A new poly(ionic liquid)(PIL), poly(p-vinylbenzyltriphenylphosphine hexafluorophosphate) (P[VBTPP][PF6]), was synthesized by quaternization, anion exchange reaction, and free radical polymerization. Then a series of the PIL were synthesized at different conditions. Methods: The specific heat capacity, glass-transition temperature and melting temperature of the synthesized PILs were measured by differential scanning calorimeter. The thermal conductivities of the PILs were measured by the laser flash analysis method. Results: Results showed that, under optimized synthesis conditions, P[VBTPP][PF6] as the thermal insulator had a high glass-transition temperature of 210.1°C, high melting point of 421.6°C, and a low thermal conductivity of 0.0920 W m-1 K-1 at 40.0°C (it was 0.105 W m-1 K-1 even at 180.0°C). The foamed sample exhibited much low thermal conductivity λ=0.0340 W m-1 K-1 at room temperature, which was comparable to a commercial polyurethane thermal insulating material although the latter had a much lower density. Conclusion: In addition, mixing the P[VBTPP][PF6] sample into polypropylene could obviously increase the Oxygen Index, revealing its efficient flame resistance. Therefore, P[VBTPP][PF6] is a potential thermal insulating material.


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