A Cohesive Fatigue Model based on the S-N Diagram

2018 ◽  
Author(s):  
CARLOS DÁVILA
Keyword(s):  
Model Based ◽  
Fatigue Model

New Fatigue Model Based on Thermionic Field Emission Mechanism

2001 ◽  
Vol 40 (Part 1, No. 9B) ◽  
pp. 5590-5594 ◽  
Author(s):  
Masayuki Tajiri ◽  
Hiroshi Nozawa
Keyword(s):  
Field Emission ◽  
Emission Mechanism ◽  
Model Based ◽  
Fatigue Model ◽  
Thermionic Field Emission

Solders Fatigue Prediction Using Interfacial Boundary Volume Criterion

2003 ◽  
Vol 125 (4) ◽  
pp. 582-588 ◽  
Author(s):  
X. J. Zhao ◽  
G. Q. Zhang ◽  
J. F. J. M. Caers ◽  
L. J. Ernst
Keyword(s):  
Solder Joint ◽  
Wafer Level ◽  
Plastic Strain Range ◽  
Damage Criterion ◽  
Component Size ◽  
Model Based ◽  
Fatigue Model ◽  
Interfacial Boundary ◽  
Solder Fatigue ◽  
Solder Joint Fatigue

In this paper, an “interfacial boundary volume” based damage criterion was proposed in combination with the modified Coffin-Manson model to predict solder fatigue. This criterion assumes that mainly, the behavior of the thin solder layer at chip pad interface contributes to the solder fatigue, not the whole solder joint or the averaged strains from randomly selected elements. The damage parameter was thus calculated by averaging the visco-plastic strain range over the interfacial boundary layer volume in the solder and later related to the corresponding fatigue life of experimental test through least-squares curves fitting to determine the empirical coefficients in the Coffin-Manson equation. As a demonstrator, the solder joint fatigue in wafer level chip scale packaging under thermal shock loading was analyzed. An appropriate constitutive relation from Darveaux was used to model the inelastic deformation of the solder alloy, and the different stress-strain responses resulting from different designs were calculated. The analysis results were used to develop the empirical fatigue model based on the interfacial boundary volume damage criterion and then this fatigue model was used for prediction. The fatigue lives of chip scale packaging with variable solder land size and component size were analyzed using this model. The prediction results match well with those from experimental tests. For this demonstrator, it was also shown that the empirical model based on the interfacial boundary volume criterion was more accurate than the models obtained from other strain averaging methods.

An adaptive Cu trace fatigue model based on average cross-section strain

2012 ◽  
Vol 52 (11) ◽  
pp. 2763-2772
Author(s):  
D. Farley ◽  
Y. Zhou ◽  
A. Dasgupta ◽  
J.W.C. DeVries
Keyword(s):  
Cross Section ◽  
Average Cross Section ◽  
Model Based ◽  
Fatigue Model

scholarly journals A Fretting Fatigue Model Based On Self-Steered Cracks

2021 ◽  
pp. 103144
Author(s):  
Diego Erena ◽  
Jesús Vázquez ◽  
Carlos Navarro ◽  
Jaime Domínguez
Keyword(s):  
Fretting Fatigue ◽  
Model Based ◽  
Fatigue Model
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