scholarly journals Accurate estimation of the surface roughness on the rolling ring in a ball bearing by vibration analysis.

1986 ◽  
Vol 7 (6) ◽  
pp. 343-352 ◽  
Author(s):  
Hiroshi Kanai ◽  
Masato Abe ◽  
Ken'iti Kido
1987 ◽  
Vol 109 (1) ◽  
pp. 60-68 ◽  
Author(s):  
H. Kanai ◽  
M. Abe ◽  
K. Kido

This paper describes a vibration-based diagnostic method by estimating the surface roughness on the rotating ring or balls in ball bearings. The surface roughness has been measured by a stylus that directly traverses the surface of the ring or balls obtained by taking apart the ball bearing. We developed a new method to estimate accurately the surface roughness by analyzing the short-length vibration signal that is excited when balls encounter flaws on the rotating ring or when races encounter flaws on the balls in a ball bearing. Our experimental results confirm that the roughness estimated by the proposed method agrees with that measured directly by using a stylus even in the case of crack μm wide. We applied this new method to the diagnosis of surface roughness in small-sized ball bearings and inferior samples were detected with a 95.3 percent accuracy rate.


2006 ◽  
Vol 315-316 ◽  
pp. 641-645 ◽  
Author(s):  
Xin Wei ◽  
Rui Wei Huang ◽  
Shao Hui Lai ◽  
Z.H. Xie

ID (inner-diameter) slicing is widely used in cutting ingots currently. In this paper, the deflection (axial vibration) and vibration (radial vibration) signals in different slicing conditions of the silicon wafers were measured online and analyzed. The effects of the vibration signals on the machining accuracy and surface roughness of sliced wafers were investigated based on the measurement and analysis of the surface roughness, warpage and TTV (total thickness vibration) of the sliced wafers. The results show that the changes of surface roughness, warpage and TTV of the sliced wafers exhibit approximately consistence with the changes of the power spectrums of the acquired vibration signals in different working stage of the blade. The vibration and deflection signals can give evidence of the changes in the cutting forces and blade performance during slicing. The power spectrum of the signals is useful for monitoring the blade wear and tension condition and predicting the surface quality and machining accuracy of the sliced wafers.


2018 ◽  
Vol 121 ◽  
pp. 198-212 ◽  
Author(s):  
Wang Yunlong ◽  
Wang Wenzhong ◽  
Zhang Shengguang ◽  
Zhao Ziqiang

2016 ◽  
Vol 2016 (0) ◽  
pp. J0720204
Author(s):  
Masato KAWASHIMA ◽  
Seiya HIRAOKA ◽  
Masaru HIGA ◽  
Masayoshi ABO

Wear ◽  
2018 ◽  
Vol 406-407 ◽  
pp. 126-139 ◽  
Author(s):  
Chang-Fu Han ◽  
Hsiao-Yeh Chu ◽  
Ruei-Yang Luo ◽  
Neng-Tung Liao ◽  
Chin-Chung Wei ◽  
...  

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