An investigation on the bending and curl-forming process of leads in integrated circuit packaging by the finite element method
2006 ◽
Vol 41
(3)
◽
pp. 205-219
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Keyword(s):
1982 ◽
Vol 104
(3)
◽
pp. 305-311
◽
2012 ◽
Vol 498
◽
pp. 183-188
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2014 ◽
Vol 607
◽
pp. 112-117
1991 ◽
pp. 253-258
1982 ◽
Vol 2
(3)
◽
pp. 163-169
◽
1991 ◽
pp. 253-258
1995 ◽
Vol 55
(3-4)
◽
pp. 442-447
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Keyword(s):