Mechanically Flexible Interconnects and TSVs

Novel Advances in Microsystems Technologies and Their Applications ◽

10.1201/b15283-3 ◽

2017 ◽

pp. 45-68

Author(s):

Hyung Suk Yang ◽

Paragkumar Thadesar ◽

Chaoqi Zhang ◽

Muhannad Bakir

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