A New Generation of Intrusion Detection Networks

2012 ◽  
pp. 589-633
Author(s):  
Jerry Krill ◽  
Michael O’Driscoll
Author(s):  
Paul Hyde ◽  
Cristian Ulianov ◽  
Jin Liu ◽  
Milan Banic ◽  
Milos Simonovic ◽  
...  

In this paper, the concept of Obstacle Detection and Track Intrusion Detection (OD&TID) systems related to the operation of trains is introduced, along with a potential concept for such a system. The main focus of the work presented here is the identification and description of system requirements and Use Cases (UC), their detailed classification, including general UCs for mainline railway and UCs specific to freight, as well as an analysis of the UCs and of the method used. The identified UCs have been organised with respect to the mode of operation, Grade of Automation (GoA), and operating conditions. The UCs were further analysed in different UC scenarios, including the pre-conditions, system response, actions made by OD&TID and associated systems and the post use conditions of the scenarios. The priority for implementation and complexity of each UC are discussed with respect to the probability of scenario occurrence and required interfaces. This work has been carried out as part of the process to evaluate implementation constraints, risks and requirements, and the operational scenarios of the OD&TID developed within the EU-funded Shift2Rail project SMART2, which aims to design and develop a prototype OD&TID system.


2020 ◽  
Vol 5 ◽  
pp. 107-118
Author(s):  
I.V. Kotenko ◽  
◽  
N.A. Komashinskiy ◽  
I.B. Saenko ◽  
A.V. Bashmakov ◽  
...  

Parallel event processing methods and tools needed for creating new generation systems of security monitoring are analyzed. Possibilities of data processing for intrusion detection based on functional approach are considered. Based on the results of the analysis, the specifi cation of the main stages of the parallel event processing and the scheme of their implementation as part of new generation intelligent systems of security monitoring are presented.


IEEE Access ◽  
2020 ◽  
Vol 8 ◽  
pp. 165130-165150 ◽  
Author(s):  
Abdullah Alsaedi ◽  
Nour Moustafa ◽  
Zahir Tari ◽  
Abdun Mahmood ◽  
Adnan Anwar

Author(s):  
Bo Zhou ◽  
Qi Shi ◽  
Madjid Merabti

An Intrusion Detection System (IDS) is a tool used to protect computer resources against malicious activities. Existing IDSs have several weaknesses that hinder their direct application to ubiquitous computing environments like smart home/office. These shortcomings are caused by their lack of considerations about the heterogeneity, flexibility and resource constraints of ubiquitous networks. Thus the evolution towards ubiquitous computing demands a new generation of resource-efficient IDSs to provide sufficient protections against malicious activities. In this chapter we proposed a Service-oriented and User-centric Intrusion Detection System (SUIDS) for ubiquitous networks. SUIDS keeps the special requirements of ubiquitous computing in mind throughout its design and implementation. It sets a new direction for future research and development.


2012 ◽  
pp. 589-633
Author(s):  
Jerry Krill ◽  
Michael O'Driscoll

Author(s):  
D. Cherns

The use of high resolution electron microscopy (HREM) to determine the atomic structure of grain boundaries and interfaces is a topic of great current interest. Grain boundary structure has been considered for many years as central to an understanding of the mechanical and transport properties of materials. Some more recent attention has focussed on the atomic structures of metalsemiconductor interfaces which are believed to control electrical properties of contacts. The atomic structures of interfaces in semiconductor or metal multilayers is an area of growing interest for understanding the unusual electrical or mechanical properties which these new materials possess. However, although the point-to-point resolutions of currently available HREMs, ∼2-3Å, appear sufficient to solve many of these problems, few atomic models of grain boundaries and interfaces have been derived. Moreover, with a new generation of 300-400kV instruments promising resolutions in the 1.6-2.0 Å range, and resolutions better than 1.5Å expected from specialist instruments, it is an appropriate time to consider the usefulness of HREM for interface studies.


Author(s):  
Jorge Perdigao

In 1955, Buonocore introduced the etching of enamel with phosphoric acid. Bonding to enamel was created by mechanical interlocking of resin tags with enamel prisms. Enamel is an inert tissue whose main component is hydroxyapatite (98% by weight). Conversely, dentin is a wet living tissue crossed by tubules containing cellular extensions of the dental pulp. Dentin consists of 18% of organic material, primarily collagen. Several generations of dentin bonding systems (DBS) have been studied in the last 20 years. The dentin bond strengths associated with these DBS have been constantly lower than the enamel bond strengths. Recently, a new generation of DBS has been described. They are applied in three steps: an acid agent on enamel and dentin (total etch technique), two mixed primers and a bonding agent based on a methacrylate resin. They are supposed to bond composite resin to wet dentin through dentin organic component, forming a peculiar blended structure that is part tooth and part resin: the hybrid layer.


Author(s):  
S. J. Krause ◽  
W.W. Adams ◽  
S. Kumar ◽  
T. Reilly ◽  
T. Suziki

Scanning electron microscopy (SEM) of polymers at routine operating voltages of 15 to 25 keV can lead to beam damage and sample image distortion due to charging. Imaging polymer samples with low accelerating voltages (0.1 to 2.0 keV), at or near the “crossover point”, can reduce beam damage, eliminate charging, and improve contrast of surface detail. However, at low voltage, beam brightness is reduced and image resolution is degraded due to chromatic aberration. A new generation of instruments has improved brightness at low voltages, but a typical SEM with a tungsten hairpin filament will have a resolution limit of about 100nm at 1keV. Recently, a new field emission gun (FEG) SEM, the Hitachi S900, was introduced with a reported resolution of 0.8nm at 30keV and 5nm at 1keV. In this research we are reporting the results of imaging coated and uncoated polymer samples at accelerating voltages between 1keV and 30keV in a tungsten hairpin SEM and in the Hitachi S900 FEG SEM.


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