Localization of octadecyltrimethoxysilane self-assembled monolayers by a combination of bottom-up and top-down approaches

2007 ◽  
pp. 163-172
Keyword(s):  
Self Assembled Monolayers ◽  
Top Down ◽  
Bottom Up ◽  
Assembled Monolayers ◽  
Self Assembled

Integration of Top-Down and Bottom-Up Nanofabrication Schemes

2005 ◽  
Vol 901 ◽  
Author(s):  
Pascale Maury ◽  
Olga Crespo-Biel ◽  
Maria Peter ◽  
David N. Reinhoudt ◽  
Jurriaan Huskens
Keyword(s):  
Nanoimprint Lithography ◽  
Silicon Oxide ◽  
Hybrid Nanostructures ◽  
Self Assembled Monolayers ◽  
Layer By Layer ◽  
Top Down ◽  
Bottom Up ◽  
Lbl Assembly ◽  
Assembled Monolayers ◽  
20 Nm

AbstractThe fabrication of 3D nanostructures, which have tunable, sub-100 nm dimensions in all three directions, is a key issue of nanotechnology. Here we describe the integration of top-down nanoimprint lithography (NIL) and bottom-up layer-by-layer (LBL) assembly for the preparation of 3D hybrid nanostructures. NIL provided down to sub-100 nm poly(methylmethacrylate) (PMMA) structures. These were employed to fabricate patterned self-assembled monolayers of cyclodextrin (CD) host molecules on silicon oxide . The consecutive LBL assembly with adamantyl guest-functionalized dendrimers and CD-modified gold nanoparticles resulted in patterned multilayer structures with thicknesses of 3-30 nm. The x,y control by NIL and the z control by LBL assembly ultimately allowed the fabrication of circular structures with a radius of 25 nm and a thickness of 20 nm. The integration of the two methods has thus yielded a versatile 3D nanofabrication methodology comprising of 10-40 process steps.

Self-assembled monolayers of terminal acetylenes as replacements for thiols in bottom-up tunneling junctions

RSC Advances ◽  
2014 ◽  
Vol 4 (99) ◽  
pp. 56026-56030 ◽  
Author(s):  
Davide Fracasso ◽  
Sumit Kumar ◽  
Petra Rudolf ◽  
Ryan C. Chiechi
Keyword(s):  
Molecular Electronics ◽  
Self Assembled Monolayers ◽  
Bottom Up ◽  
Assembled Monolayers ◽  
Tunneling Junctions ◽  
Self Assembled ◽  
Terminal Acetylenes

Why use thiols in Molecular Electronics?

Bottom-Up Engineering of Subnanometer Copper Diffusion Barriers Using NH2-Derived Self-Assembled Monolayers

2010 ◽  
Vol 20 (7) ◽  
pp. 1125-1131 ◽  
Author(s):  
Arantxa Maestre Caro ◽  
Silvia Armini ◽  
Olivier Richard ◽  
Guido Maes ◽  
Gustaaf Borghs ◽  
...  
Keyword(s):  
Diffusion Barriers ◽  
Self Assembled Monolayers ◽  
Bottom Up ◽  
Copper Diffusion ◽  
Assembled Monolayers ◽  
Self Assembled

Electrochemical behavior of self-assembled monolayers based on functionalized oligothiophenes

1998 ◽  
Vol 95 (6) ◽  
pp. 1339-1342 ◽  
Author(s):  
R. Michalitsch ◽  
A. El Kassmi ◽  
P. Lang ◽  
A. Yassar ◽  
F. Garnier
Keyword(s):  
Electrochemical Behavior ◽  
Self Assembled Monolayers ◽  
Assembled Monolayers ◽  
Self Assembled

Imaging of patterned self-assembled monolayers by scanning photoelectron microscopy

2003 ◽  
Vol 104 ◽  
pp. 459-462 ◽  
Author(s):  
R. Klauser ◽  
M. Zharnikov ◽  
I.-H. Hong ◽  
S.-C. Wang ◽  
A. Gölzhäuser ◽  
...  
Keyword(s):  
Self Assembled Monolayers ◽  
Assembled Monolayers ◽  
Scanning Photoelectron Microscopy ◽  
Self Assembled
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