Product Development of the Japanese Electronics Industry

2011 ◽  
pp. 251-266
Keyword(s):  
Product Development ◽  
Electronics Industry

New Rapid Failure Analysis Techniques for Multilevel Metallization

MRS Bulletin ◽  
1995 ◽  
Vol 20 (11) ◽  
pp. 74-77
Author(s):  
Edward I. Cole ◽  
Richard E. Anderson
Keyword(s):  
Integrated Circuits ◽  
Product Development ◽  
Failure Analysis ◽  
New Product Development ◽  
New Product ◽  
Electronics Industry ◽  
New Techniques ◽  
Analysis Techniques ◽  
Advantages And Disadvantages ◽  
Failure Site

Open interconnections on integrated circuits (ICs) are a serious and ubiquitous problem throughout the micro-electronics industry. The efforts to understand the mechanisms responsible for producing open interconnections and to develop analytical methods to localize them demonstrate the concern manufacturers have for this problem. Multiple layers of metallization not only increase the probability that an open conductor or via will occur because of the increased number of interconnections and vias but also increase the difficulty in localizing the site of the failure because upper layers may mask the failure site.Rapid failure analysis of open-conductor defects is critical in new product development and reliability assessment of ICs where manufacturing and product development delays can cost millions of dollars a day. In this article, we briefly review some standard failure analysis approaches and then concentrate on new techniques to rapidly locate open-conductor defects that would have been difficult or impossible to identify using earlier methods. Each method is described in terms of the physics of signal generation, application, and advantages and disadvantages when compared to existing methods.

Innovation in product development within the electronics industry

Technovation ◽  
1998 ◽  
Vol 19 (2) ◽  
pp. 71-80 ◽  
Author(s):  
Alberto De Toni ◽  
Guido Nassimbeni ◽  
Stefano Tonchia
Keyword(s):  
Product Development ◽  
Electronics Industry

Nonlinear Econometric Model of Electronic Products and its Application

2014 ◽  
Vol 596 ◽  
pp. 114-118
Author(s):  
Hong Yan Zhou
Keyword(s):  
Product Development ◽  
Econometric Model ◽  
Economic Assessment ◽  
Electronics Industry ◽  
Electronic Products ◽  
Digital Product ◽  
Share Model ◽  
High Level ◽  
Economic Capacity ◽  
Industrial Economic

Digital product development is very rapid, this paper use engineering method to establish electronic product development model, and use Shift-share method to analysis decompose the economic capacity of the electronics industry, with the high level of industrial economic quantity Comparative analysis of the overall strength of the digital industry. Shift-share model with a comprehensive economic assessment, and put forward development proposals of corresponding electronic products.

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