A novel vacuum-assisted method for fabricating flexible polyimide foams from 3,3′,4,4′-oxydiphthalic anhydride/4,4′-oxydianiline

2016 ◽  
Vol 29 (3) ◽  
pp. 272-278 ◽  
Author(s):  
Kuang-Min Ting ◽  
Jun Xu ◽  
Bao-Hua Guo
2013 ◽  
Vol 25 (4) ◽  
pp. 454-463 ◽  
Author(s):  
Hongling Zeng ◽  
Xueliang Pei ◽  
Guofei Chen ◽  
Lujie Cao ◽  
Liang Chen ◽  
...  

2010 ◽  
Vol 2010 ◽  
pp. 1-6 ◽  
Author(s):  
Oldrich Jirsak ◽  
Petr Sysel ◽  
Filip Sanetrnik ◽  
Jakub Hruza ◽  
Jiri Chaloupek

The polyimide precursor (polyamic acid) produced of4,4′-oxydiphthalic anhydride and4,4′-oxydianiline was electrospun using needleless electrospinning method. Nonwoven layers consisting of submicron fibers with diameters in the range about 143–470 nm on the polypropylene spunbond supporting web were produced. Filtration properties of these nanofiber layers on the highly permeable polypropylene support—namely filtration effectivity and pressure drop—were evaluated. Consequently, these polyamic acid fibers were heated to receive polyimide nanofibers. The imidization process has been studied using IR spectroscopy. Some comparisons with the chemically identical polyimide prepared as the film were made.


1994 ◽  
Vol 6 (3) ◽  
pp. 225-233 ◽  
Author(s):  
Amane Mochizuki ◽  
Kazuo Yamada ◽  
Tadashi Teranishi ◽  
Koichi Matsushita ◽  
Mitsuru Ueda

A positive-working photosensitive polyimide precursor based on polyisoimide (PFII) and nifedipine (1,4-dihydro-2,6-dimethyl-4-(nitrophenyl)-3,5-pyridinedicarboxylic acid dimethylester) (DHP) as a photosensitive compound has been developed. P11 was prepared by the ring-opening polyaddition of oxydiphthalic anhydride (ODPA) and 3,3' diamino diphenylsulphone (3,3'-DDS), followed by the treatment of trifluoroacetic anhydridetriethylamine in N-methyl-2-pyrrolidone (NMP). PII film showed excellent transparency at 365 nm and 436 nm. The dissolution behaviour of PII film containing 20 wt% of DHP after exposure and post-exposure bake (PEB) has been studied. It was found that the dissolution rate of the exposed area was about six times faster than that of the unexposed area due to the photochemical reaction of DHP in P11 film. The photosensitive polyimide precursor containing 20 wt% of DHP showed a sensitivity of 45 mJ cm- 2 and a contrast of 2.4 with 365 nm light when post-baked at 150C for 10 min and developed with cyclohexanone at 50C.


e-Polymers ◽  
2018 ◽  
Vol 18 (2) ◽  
pp. 105-110 ◽  
Author(s):  
Petr Sysel ◽  
Anna Patrova ◽  
Marek Lanc ◽  
Karel Friess

AbstractPoly(imide-siloxane)s differing in their composition were prepared and characterized. The starting polymer (control) was the hyperbranched polyimide based on 4,4′-oxydiphthalic anhydride and 4,4′,4″-triaminotriphenylmethane. In the poly(imide-siloxane)s, 10 or 40–50 mol% of the 4,4′,4″-triaminotriphenylmethane was theoretically substituted for by amine-terminated siloxane dimer or oligomers. 1,3-Bis(3-aminopropyl)-1,1,3,3-tetramethyldisiloxane, bis(3-aminopropyl)-terminated poly(dimethylsiloxane) with a theoretical number-average molar mass of 1000 g·mol−1 and bis(3-aminopropyl)-terminated poly(dimethylsiloxane) with a theoretical number-average molar mass of 2500 g·mol−1 were used for this purpose. The thermo-mechanical properties and gas separation characteristics for hydrogen, carbon dioxide and methane of these polymeric products were shown to be dependent on their composition.


RSC Advances ◽  
2015 ◽  
Vol 5 (47) ◽  
pp. 37837-37842 ◽  
Author(s):  
Zhonglun Li ◽  
Huawei Zou ◽  
Pengbo Liu

Porous polyimide (PI) synthesized from 4,4′-oxydiphthalic anhydride (ODPA) and 4,4′-diaminodiphenyl ether (ODA) monomers is a promising material with an ultralow-dielectric constant.


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