Characteristics of Carbon Nanowalls According to the Indium Tin Oxide Interlayer Thickness
Materials with low adhesion have a limited range of applications. To solve this problem, the stress can be alleviated by inserting an interlayer between the substrate and the semiconductor material. As such, the adhesion can also be improved by depositing an interlayer between the carbon nanowall (CNW) with a low adhesive force and the substrate. In this study, indium tin oxide (ITO), whose thickness was controlled via radio frequency (RF) magnetron sputtering on the substrate, was used as an interlayer, and CNWs were grown using microwaveplasma-enhanced chemical vapor deposition (MPECVD) with a mixture of methane (CH4) and hydrogen (H2) gases. To confirm the adhesion between the CNWs and the substrate according to the thickness of the ITO interlayer, the dissociation of the CNWs was confirmed using an ultrasonic washing machine. Hall measurement was used to investigate the electrical properties. Afterwards, to analyze the change in the surface structure, contact angle analysis and field emission scanning electron microscopy (FESEM) analysis performed.