Study on Thermal and Structural Stability of High Power Light-Emitting Diode Lighting System

2014 ◽  
Vol 14 (5) ◽  
pp. 3564-3568 ◽  
Author(s):  
Dong-Soon Kwag ◽  
Soo-Hyun So ◽  
Seung-Myeong Baek
Keyword(s):  
Structural Stability ◽  
High Power ◽  
Light Emitting Diode ◽  
Lighting System ◽  
Light Emitting

scholarly journals A Supervisory Control Strategy for Improving Energy Efficiency of Artificial Lighting Systems in Greenhouses

Energies ◽  
2021 ◽  
Vol 14 (1) ◽  
pp. 202
Author(s):  
Gianluca Serale ◽  
Luca Gnoli ◽  
Emanuele Giraudo ◽  
Enrico Fabrizio
Keyword(s):  
Control Strategy ◽  
Light Emitting Diode ◽  
Cost Savings ◽  
Energy Performance ◽  
Lighting System ◽  
Light Emitting ◽  
Artificial Lighting ◽  
Lighting Control ◽  
Lighting Systems ◽  
Power Densities

Artificial lighting systems are used in commercial greenhouses to ensure year-round yields. Current Light Emitting Diode (LED) technologies improved the system efficiency. Nevertheless, having artificial lighting systems extended for hectares with power densities over 50W/m2 causes energy and power demand of greenhouses to be really significant. The present paper introduces an innovative supervisory and predictive control strategy to optimize the energy performance of the artificial lights of greenhouses. The controller has been implemented in a multi-span plastic greenhouse located in North Italy. The proposed control strategy has been tested on a greenhouse of 1 hectare with a lighting system with a nominal power density of 50 Wm−2 requiring an overall power supply of 1 MW for a period of 80 days. The results have been compared with the data coming from another greenhouse of 1 hectare in the same conditions implementing a state-of-the-art strategy for artificial lighting control. Results outlines that potential 19.4% cost savings are achievable. Moreover, the algorithm can be used to transform the greenhouse in a viable source of energy flexibility for grid reliability.

Phosphor concentration and geometry for high power white light emitting diode

2010 ◽  
Author(s):  
Kyung-Mi Moon ◽  
Se-Hwan An ◽  
Hyung-Kun Kim ◽  
Jung-Hye Chae ◽  
Yong-Jo Park
Keyword(s):  
White Light ◽  
High Power ◽  
Light Emitting Diode ◽  
Light Emitting

High-Power CW Operation of GaInAsP/InP Superluminescent Light-Emitting Diode with Tapered Active Region

2001 ◽  
Vol 40 (Part 2, No. 7A) ◽  
pp. L678-L680 ◽  
Author(s):  
Takeshi Yamatoya ◽  
Shigeaki Sekiguchi ◽  
Fumio Koyama ◽  
Kenichi Iga
Keyword(s):  
Active Region ◽  
High Power ◽  
Light Emitting Diode ◽  
Light Emitting ◽  
Cw Operation

Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials

2010 ◽  
Vol 132 (3) ◽  
Author(s):  
Xin Li ◽  
Xu Chen ◽  
Guo-Quan Lu
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Temperature Cycling ◽  
Fluorescent Light ◽  
Light Sources ◽  
Light Emitting ◽  
Die Attach ◽  
Nanosilver Paste ◽  
Interconnection Material

As a solid electroluminescent source, white light emitting diode (LED) has entered a practical stage and become an alternative to replace incandescent and fluorescent light sources. However, due to the increasing integration and miniaturization of LED chips, heat flux inside the chip is also increasing, which puts the packaging into the position to meet higher requirements of heat dissipation. In this study, a new interconnection material—nanosilver paste is used for the LED chip packaging to pursue a better optical performance, since high thermal conductivity of this material can help improve the efficiency of heat dissipation for the LED chip. The bonding ability of this new die-attach material is evaluated by their bonding strength. Moreover, high-power LED modules connected with nanosilver paste, Sn3Ag0.5Cu solder, and silver epoxy are aged under hygrothermal aging and temperature cycling tests. The performances of these LED modules are tested at different aging time. The results show that LED modules sintered with nanosilver paste have the best performance and stability.

Thermal conduction characteristics of silicone composites including ultrasonic-treated graphite

2021 ◽  
pp. 002199832110595
Author(s):  
Weontae Oh ◽  
Jong-Seong Bae ◽  
Hyoung-Seok Moon
Keyword(s):  
Thermal Conductivity ◽  
Ultrasonic Treatment ◽  
Thermal Conduction ◽  
Light Emitting Diode ◽  
Thermal Interface Material ◽  
Ultrasonic Power ◽  
Lighting System ◽  
Thermal Interface ◽  
Light Emitting ◽  
Inorganic Oxides

The microstructural change of graphite was studied after ultrasonic treatment of the graphite. When the graphite solution was treated with varying ultrasonic power and time, the microstructure changed gradually, and accordingly, the thermal conductivity characteristics of the composite containing the as-treated graphite was also different with each other. Thermal conductivity showed the best result in the silicone composite containing graphite prepared under the optimum condition of ultrasonic treatment, and the thermal conductivity of the composite improved proportionally along with the particle size of graphite. When the silicone composite was prepared by using a mixture of inorganic oxides and graphite rather than graphite alone, the thermal conductivity of the silicone composite was further increased. A silicone composite containing graphite was used for LED (light emitting diode) lighting system as a thermal interface material (TIM), and the temperature elevation due to heat generated, while the lighting was actually operated, was analyzed.

Phosphor–silicone interaction effects in high power white light emitting diode packages

2017 ◽  
Vol 28 (23) ◽  
pp. 17557-17569 ◽  
Author(s):  
Jiajie Fan ◽  
Mengni Zhang ◽  
Xiao Luo ◽  
Cheng Qian ◽  
Xuejun Fan ◽  
...  
Keyword(s):  
White Light ◽  
High Power ◽  
Light Emitting Diode ◽  
Interaction Effects ◽  
Light Emitting
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