Submerged Arc Spray Synthesis of TiO2 Nanoparticles with Desired Form Sphericity Using Process Characterization and Optimization

2008 ◽  
Vol 8 (2) ◽  
pp. 518-526 ◽  
Author(s):  
Liang-Chia Chen ◽  
Chie-Chan Ho
Keyword(s):  
Process Parameters ◽  
Particle Shape ◽  
Nanoparticle Synthesis ◽  
Metal Nanoparticle ◽  
Synthesis Process ◽  
Arc Spray ◽  
Process Characterization ◽  
Product And Process ◽  
Shape Characteristics ◽  
Submerged Arc

This article presents a study on process characterization and optimization of the metal nanoparticle fabrication process known as the submerged arc spray nanoparticle synthesis system (SANSS) for obtaining desired geometric sphericity of nanoparticles. The geometric shape characteristics of nanoparticles pose significant impact on innovative product and process design. The sphericity and surface roughness of prepared TiO2 nanoparticles can vary widely and are influenced by the process parameters being employed in the SANSS. To improve this, an in-situ nanofluid sampling and measurement approach was developed to analyze the particle shape characteristics and characterize the nanoparticle synthesis process. The particle shape contours obtained from FE-SEM and TEM were employed to quantify the TiO2 nanoparticle sphericity and analyze the effect of process parameters on particle roundness. The optimized process parameters were identified using the Taguchi method. Our results proved that the average sphericity of TiO2 particles prepared using the optimized process parameters was effectively improved up to three folds.

scholarly journals Characterization and Optimization of Arc Spray Process Parameters for Synthesis of TiO2 Nanoparticles

2004 ◽  
Vol 45 (10) ◽  
pp. 3011-3017 ◽  
Author(s):  
Liang-Chia Chen ◽  
Tsing-Tshih Tsung ◽  
Ho Chang ◽  
Jen-Yan Sun
Keyword(s):  
Process Parameters ◽  
Spray Process ◽  
Arc Spray

Process Characterization and the Effect of Process Defects on Flip Chip Reliability

1999 ◽  
Author(s):  
Brian J. Lewis ◽  
Hilary Sasso
Keyword(s):  
Process Parameters ◽  
Flip Chip ◽  
Failure Modes ◽  
Shock Testing ◽  
Fine Pitch ◽  
Process Characterization ◽  
Solder Bumps ◽  
Optimum Height ◽  
High Yields

Abstract Processing fine pitch flip chip devices continues to pose problems for packaging and manufacturing engineers. Optimizing process parameters such that defects are limited and long-term reliability of the assembly is increased can be a very tedious task. Parameters that effect the robustness of the process include the flux type and placement parameters. Ultimately, these process parameters can effect the long-term reliability of the flip chip assembly by either inhibiting or inducing process defects. Therefore, care is taken to develop a process that is robust enough to supply high yields and long term reliability, but still remains compatible with a standard surface mount technology process. This is where process optimization becomes most critical and difficult. What is the optimum height of the flux thin film used for a dip process? What force is required to insure that the solder bumps make contact with the pads? What are the limiting boundaries in which high yields and high reliabilities are achieved, while maintaining a streamlined, proven process? The following study evaluates a set of process parameters and their impact on process defects and reliability. The study evaluates process parameters including, flux type, flux application parameters, placement force and placement accuracy to determine their impact. Solder voiding, inadequate solder wetting, and crack propagation and delamination in the underfill layer are defects examined in the study. Assemblies will be subjected to liquid-to-liquid thermal shock testing (−55° C to 125°C) to determine failure modes due to the aforementioned defects. The results will show how changes in process parameters effect yield and reliability.

Analyzing the response of submerged arc welding process parameters on Form factor and dilution

2021 ◽  
Author(s):  
Sachin Mohal ◽  
Saurabh Chaitanya ◽  
Manjit Singh ◽  
Rachin Goyal ◽  
Amresh Kumar ◽  
...  
Keyword(s):  
Form Factor ◽  
Process Parameters ◽  
Arc Welding ◽  
Welding Process ◽  
Submerged Arc Welding ◽  
Arc Welding Process ◽  
Submerged Arc

scholarly journals Prediction Model of Minimum Void Ratio for Various Sizes/Shapes of Sandy Binary Mixture

2020 ◽  
Vol 2020 ◽  
pp. 1-19
Author(s):  
Chaojie Shen ◽  
Zhaoyang Xu ◽  
Jie Yin ◽  
Jinfeng Wu
Keyword(s):  
Particle Size ◽  
Binary Mixture ◽  
Particle Shape ◽  
Void Ratio ◽  
Soil Mechanics ◽  
Influence Factors ◽  
Natural Sand ◽  
Undetermined Coefficient ◽  
Shape Characteristics ◽  
Different Origins

The minimum void ratio is a fundamental physical index for evaluating particle properties in soil mechanics, ceramic processing, and concrete mixes. Previous research found that both particle size distribution and particle shape characteristics would affect minimum void ratio, while the current research generally uses a linear model to estimate the minimum void ratio of a binary mixture, ignoring quantitative effect of particle shape on the minimum void ratio. Based on a study of binary mixtures of natural sand from three different origins and iron particles of two different shapes, this paper analyzes the influence factors of the minimum void ratio, and a quadratic nonlinear model is proposed for estimating the minimum void ratio of binary mixture. The model contains only one undetermined coefficient, a, the value of which is correlated to the particle sphericity, particle size, and particle size ratio. A theoretical calculation formula for the coefficient a is proposed to quantitatively analyze the effects of these three factors on the size of the parameters. In the end, the model is used to estimate the minimum void ratios of sand and substitute particles from different producing areas; the average difference between the estimated values and the fitted values is about 2.03%, suggesting that the estimated values of the model fit well with the measured data.

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