scholarly journals Properties of Cured Epoxy Resin/High Molecular Weight Phenoxy Resin Containing Phosphorus Blends for Halogen free Flame retardancy FPC Adhesives

2014 ◽  
Vol 50 (12) ◽  
pp. 435-441
Author(s):  
Naoki YOKOYAMA ◽  
Shigeaki TAUCH ◽  
Osamu AMESAWA ◽  
Hidenori NOZAWA ◽  
Katsuyuki AIDA
Keyword(s):  
Molecular Weight ◽  
Epoxy Resin ◽  
High Molecular Weight ◽  
Flame Retardancy ◽  
Halogen Free

Sensitization from epoxy resin powder of high molecular weight

1980 ◽  
Vol 6 (2) ◽  
pp. 144-144 ◽  
Author(s):  
F. Bokelund ◽  
S. Fregert ◽  
L. Trulsson
Keyword(s):  
Molecular Weight ◽  
Epoxy Resin ◽  
High Molecular Weight

scholarly journals Properties of Cured Epoxy Resin/Phenoxy Resin Containing Carboxylic Groups and Phosphorus Blends for Halogen-free Flame-retardancy FPC Adhesives

2013 ◽  
Vol 49 (1) ◽  
pp. 17-23
Author(s):  
Naoki YOKOYAMA ◽  
Osamu AMESAWA ◽  
Katsunori SEKIYA ◽  
Katsuyuki AIDA ◽  
Shigeaki TAUCHI
Keyword(s):  
Epoxy Resin ◽  
Flame Retardancy ◽  
Carboxylic Groups ◽  
Halogen Free

Flame-retardant halogen-free polymers using phosphorylated hexaglycidyl epoxy resin

2017 ◽  
Vol 30 (2) ◽  
pp. 202-210 ◽  
Author(s):  
Rasool Kheyrabadi ◽  
Hossein Rahmani ◽  
S Heydar Mahmoudi Najafi
Keyword(s):  
Flame Retardant ◽  
Epoxy Resin ◽  
Phosphine Oxide ◽  
Flame Retardancy ◽  
High Performance ◽  
Liquid Chromatography Mass Spectrometry ◽  
Scanning Calorimetry ◽  
Epoxy Monomer ◽  
Ul 94 ◽  
Halogen Free

Flame-retardant halogen-free epoxy resin, containing phosphorus and nitrogen atoms in the main chain, was synthesized through the curing of tris(3-(bis(oxiran-2-ylmethyl)amino)phenyl)phosphine oxide (HGE, hexaglycidyl epoxy monomer), starting from tris(3-aminophenyl) phosphine oxide (TAPO) and epichlorohydrin. The molecular structure of HGE with molecular weight 660 was confirmed using Fourier transform infrared, nuclear magnetic resonance, and liquid chromatography–mass spectrometry techniques. Epoxy equivalent weight determined by titration method was 120. The thermal curing behavior of the HGE/TAPO was investigated by differential scanning calorimetry. An intense exotherm due to curing reaction was observed in the temperature range from 123°C to 215°C. The HGE cured with TAPO, 4,4′-diaminodiphenylsulfone (DDS), and 1,5-diaminonaphthalene (DAN) and the thermal behaviors were studied by thermogravimetric analysis. The flame retardancy properties of the HGE/TAPO, DDS, and DAN were evaluated by vertical burning test (UL-94 V). The high performance cured epoxy resins showed high thermal stability and UL-94 V-0 flame retardancy rating.

Polymer alloys of high-molecular-weight benzoxazine and epoxy resin

2014 ◽  
Vol 26 (7) ◽  
pp. 846-855 ◽  
Author(s):  
Shoya Uchida ◽  
Takehiro Kawauchi ◽  
Nobuyuki Furukawa ◽  
Tsutomu Takeichi
Keyword(s):  
Molecular Weight ◽  
Epoxy Resin ◽  
High Molecular Weight
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