scholarly journals Thick-Film Non-Reciprocal Ferrite Elements and Gunn Hybrid Oscillators in Modified Thick-Film Technology

1984 ◽  
Vol 11 (2) ◽  
pp. 147-156
Author(s):  
Janusz J. Gondek ◽  
Jan Koprowski ◽  
Marek A. Wójcicki

In this paper are presented design and performance data on microwave Y–circulators and Gunn oscillators produced in thick-film technology. Y–circulators have been designed for central frequencies of 3, 5, and 10 GHz with a satisfactory accuracy. New Polish made ferrite substrates, G–32, G–84 K, and G–175 have been used.The Gunn oscillator was designed and corrected to the resonant frequencies 3, 5 and 6 GHz based on the integrated package diodes CXYP – 43 A and BXYP – 45 C (made in Poland). The results of the investigations are presented in tabular and graphical form.

2013 ◽  
Vol 2013 (CICMT) ◽  
pp. 000155-000161
Author(s):  
Christina Modes ◽  
Melanie Bawohl ◽  
Jochen Langer ◽  
Jessica Reitz ◽  
Anja Eisert ◽  
...  

Electronic circuits made by thick film technology are commonly used today in electronic circuitry for automotive applications. Densely packed multi-layer hybrid circuits are very well established for motor and transmission management in standard gasoline fuelled vehicles. As automotive technology shifts from mechanical systems to electrical systems and toward more electrically driven vehicles, such as hybrid electric vehicles and full electric vehicles, thick film systems need to be adapted to fit the challenges and needs of these new applications. The following is a description of a new set of thick film pastes, both precious and base metal, which have attributes and performance suitable for power electronics in automotive applications. The materials provide a means to use common thick film technology to build power circuits to meet the new needs, such as high current carrying capacity and thermal dissipation.


Author(s):  
G. Yadagiri ◽  
K. K. Goswami ◽  
K. S. Gurumurthy ◽  
Satyam ◽  
K. N. Shankara

The complexity and performance of the electronic components and systems is increasing and placing greater demands on compact packaging and interconnection technologies. Multilayer thick film technology is one of the important technologies adopted in the miniaturization of electronic systems. Normally only interconnections are made in the intermediate layers. The possibility of fabricating resistors along with interconnections in the intermediate layers using conventional thick film materials using co-firing process has been examined in this paper. Normally multilayer structures are fabricated by printing / drying / firing of each layer separately starting from the bottom most layer (sequential processing). In this process the bottom layers undergo sintering many times. To avoid many firing cycles and to save power and processing time, a study is taken up to examine the effects of co-firing on the multilayer structure with embedded resistors. The results of the study are presented in this paper.


2018 ◽  
Author(s):  
V.M. Alakin ◽  
G.S. Nikitin

Приведены результаты исследований экспериментального картофелекопателя с ротационной сепарирующей поверхностью. Особое внимание уделяется обоснованию конструктивных параметров и определению рабочих характеристик нового сепарирующего устройства. На основе анализа результатов экспериментальных исследований определены наиболее оптимальные режимы работы экспериментального картофелекопателя.Research results of an experimental potato digger with rotational separating web are published in this article. Special attention is paid to definition of design characteristics and performance data of the new separating device. Admissible operating modes are defined on the basis of the analysis of results of pilot studies of the experimental potato digger.


1976 ◽  
Vol 22 (11-12) ◽  
pp. 791
Author(s):  
R. Naylor

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