scholarly journals Multipurpose Drivers for MEMS Devices Based on a Single ASIC Implemented in a Low-Cost HV CMOS Process without a Triple Well

2021 ◽  
Vol 2021 ◽  
pp. 1-22
Author(s):  
Paul Miresan ◽  
Marius Neag ◽  
Marina Topa ◽  
Istvan Kovacs ◽  
Laurentiu Varzaru

This paper presents a novel topology for multipurpose drivers for MEMS sensors and actuators, suitable for integration in low-cost high-voltage (HV) CMOS processes, without a triple well. The driver output voltage, V MEMS , can be programmed over a wide, symmetrical range of positive and negative values, with the maximum output voltage being limited only by the maximum drain-source voltage that the HV transistors can handle. The driver is also able to short its output to the ground line and to leave it floating. It comprises generators for large positive and negative voltages followed by an LDO for each polarity that ensures that V MEMS has a well-controlled level and a very low ripple. The LDOs also help implement the grounded- and floating-output operating modes. Most of the required circuitry is integrated within a HV CMOS ASIC: the drivers for the large voltage generators, the error amplifiers of the LDOs, the DAC used to program the V MEMS level, and their support circuits. Thus, only the power stages of the large voltage generators, the pass transistors of the LDOs and two resistors for the LDO feedback network are discrete. A suitable configuration was devised for the latter that allows for the external resistor network to be shared by the two LDOs and prevents negative voltages from developing at the ASIC pins. Two circuit implementations of the proposed topology, designed in a low-cost 0.18 μm HV CMOS process, are presented in some detail. Simulation results demonstrate that they realize the required operating modes and provide V MEMS voltages programmable with steps of 100 mV or 200 mV, between -20 V and +20 V or between −45 V and +45 V, respectively. The output voltage ripple is relatively small, just 3.4 mVpkpk for the first implementation and 17 mVpkpk for the second. Therefore, both circuits are suitable for biasing and controlling a wide range of MEMS devices, including MEMS mirrors used in applications such as endoscopic optical coherence tomography.

Micromachines ◽  
2021 ◽  
Vol 12 (12) ◽  
pp. 1554
Author(s):  
Na Zhou ◽  
Xuefeng Ding ◽  
Hongbo Li ◽  
Yue Ni ◽  
Yonglong Pu ◽  
...  

A thermopile detector with their thermocouples distributed in micro-bridges is designed and investigated in this work. The thermopile detector consists of 16 pairs of n-poly-Si/p-poly-Si thermocouples, which are fabricated using a low-cost, high-throughput CMOS process. The micro-bridges are realized by forming micro trenches at the front side first and then releasing the silicon substrate at the back side. Compared with a thermopile device using a continuous membrane, the micro-bridge-based one can achieve an improvement of the output voltage by 13.8% due to a higher temperature difference between the hot and cold junctions as there is a decrease in thermal conduction loss in the partially hollowed structure. This technique provides an effective way for developing high-performance thermopile detectors and other thermal devices.


2019 ◽  
Vol 28 (03) ◽  
pp. 1950043 ◽  
Author(s):  
M. Jahangiri ◽  
A. Farrokhi

A fast transient capacitor-less low-dropout regulator is presented in this study. The proposed LDO structure is based on Output Voltage Spike Reduction (OVSR) circuits and capacitance compensation circuits to enable a fast-transient response with ultra-low power dissipation and to make the LDO stable for a wide range of output load currents (0–50[Formula: see text]mA). The slew rate is improved with more slew current from the OVSR circuit and unity gain bandwidth is improved by a capacitor multiplayer circuit. The proposed LDO has been simulated with a standard 0.18[Formula: see text][Formula: see text]m CMOS process. The output voltage of the LDO was set to 1.2[Formula: see text]V for an input voltage of 1.4–2[Formula: see text]V. The Simulation results verify that the transient times are less than 2.8[Formula: see text][Formula: see text]s and the maximum undershoot and overshoot are 20[Formula: see text]mV while consuming only 26[Formula: see text][Formula: see text]A quiescent current. The proposed LDO is stable with an on-chip capacitor at the output node within the wide range of 1100[Formula: see text]PF.


2008 ◽  
Vol 2008 ◽  
pp. 1-8 ◽  
Author(s):  
P. Sanjeevikumar ◽  
K. Rajambal

This paper presents the topology of operating DC-DC buck converter in boost mode for extra-high-voltage applications. Traditional DC-DC boost converters are used in high-voltage applications, but they are not economical due to the limited output voltage, efficiency and they require two sensors with complex control algorithm. Moreover, due to the effect of parasitic elements the output voltage and power transfer efficiency of DC-DC converters are limited. These limitations are overcome by using the voltage lift technique, opens a good way to improve the performance characteristics of DC-DC converter. The technique is applied to DC-DC converter and a simplified control algorithm in this paper. The performance of the controller is studied for both line and load disturbances. These converters perform positive DC-DC voltage increasing conversion with high power density, high efficiency, low cost in simple structure, small ripples, and wide range of control. Simulation results along theoretical analysis are provided to verify its performance.


2016 ◽  
Vol 25 (11) ◽  
pp. 1650140 ◽  
Author(s):  
Ling-Feng Shi ◽  
Zhen-Bo Shi ◽  
Sen Chen ◽  
Jian-Hui Xun

Primary-side controlled pulse-width modulation (PWM) flyback converter has been widely used in low-power and low-voltage products for its simple structure and low cost. This paper presents a novel output voltage sampling circuit which considers the influence of the rectifier diode current on the output voltage sampling. The output voltage sampling circuit samples the output voltage at 85% of the secondary inductance discharge time [Formula: see text] of last cycle, which improves the accuracy of the output voltage sampling circuit. Besides, the circuit can also sample the secondary inductance discharge time [Formula: see text]. Finally, a chip has been fabricated in 0.6[Formula: see text][Formula: see text]m complementary metal-oxide semiconductor (CMOS) process, which is used in the presented output voltage sampling circuit in its internal circuit to simple output voltage and achieve constant output voltage.


Author(s):  
K. A. Peterson ◽  
P. Tangyunyong ◽  
D. L. Barton

Abstract Micro-Electrical Mechanical Systems (MEMS) is an emerging technology with demonstrated potential for a wide range of applications including sensors and actuators for medical, industrial, consumer, military, automotive and instrumentation products. Failure analysis (FA) of MEMS is critically needed for the successful design, fabrication, performance analysis and reliability assurance of this new technology. Many devices have been examined using techniques developed for integrated circuit analysis, including optical inspection, scanning laser microscopy (SLM), scanning electron microscopy (SEM), focused ion beam (FIB) techniques, atomic force microscopy (AFM), infrared (lR) microscopy, light emission (LE) microscopy, acoustic microscopy and acoustic emission analysis. For example, the FIB was used to microsection microengines that developed poor performance characteristics. Subsequent SEM analysis clearly demonstrated the absence of wear on gear, hub, and pin joint bearing surfaces, contrary to expectations. Another example involved the use of infrared microscopy for thermal analysis of operating microengines. Hot spots were located, which did not involve the gear or hub, but indicated contact between comb structures which drive microengines. Voltage contrast imaging proved useful on static and operating MEMS in both the SEM and the FIB and identified electrostatic clamping as a potentially significant contributor to failure mechanisms in microengines. This work describes MEMS devices, FA techniques, failure modes, and examples of FA of MEMS.


2019 ◽  
Vol 29 (01) ◽  
pp. 2050011
Author(s):  
Wen-Ming Zheng ◽  
Wen-Liang Zeng ◽  
Chi-Wa U ◽  
Chi-Seng Lam ◽  
Yan Lu ◽  
...  

A three-level buck (TLB) converter has the characteristics of higher voltage conversion efficiency, lower inductor current ripples, output voltage ripples and voltage stresses on switches when compared with the buck converters in continuous conduction mode (CCM). With a TLB converter integrated on a chip, we cannot avoid its discontinuous conduction mode (DCM) operation due to a smaller inductance and load variation. In this paper, we’ll present and discuss the analysis, design and control of a TLB converter under DCM operation, implemented in a 65[Formula: see text]nm CMOS process. Transistor level simulation results show that when the TLB converter operates at 100[Formula: see text]MHz with a 5[Formula: see text]nH on-chip inductor, a 10[Formula: see text]nF output capacitor and a 10[Formula: see text]nF flying capacitor, it can achieve an output conversion range of 0.7–1.2[Formula: see text]V from a 2.4[Formula: see text]V input supply, with a peak efficiency of 81.5%@120[Formula: see text]mW. The output load transient response is 100[Formula: see text]mV with 101[Formula: see text]ns for undershoot, and 86[Formula: see text]mV with 110[Formula: see text]ns for overshoot when [Formula: see text]–100[Formula: see text]mA. The maximum output voltage ripple is less than 19[Formula: see text]mV.


Author(s):  
Xianhao Le ◽  
Qiongfeng Shi ◽  
Philippe Vachon ◽  
Eldwin Jiaqiang Ng ◽  
Chengkuo Lee

Abstract The rapid development of the fifth-generation mobile networks (5G) and Internet of Things (IoT) is inseparable from a large number of miniature, low-cost, and low-power sensors and actuators. Piezoelectric micro-electromechanical system (MEMS) devices, fabricated by micromachining technologies, provide a versatile platform for various high-performance sensors, actuators, energy harvesters, filters and oscillators (main building blocks in radio frequency (RF) front-ends for wireless communication). In this paper, we provide a comprehensive review of the working mechanism, structural design, and diversified applications of piezoelectric MEMS devices. Firstly, various piezoelectric MEMS sensors are introduced, including contact and non-contact types, aiming for the applications in physical, chemical and biological sensing. This is followed by a presentation of the advances in piezoelectric MEMS actuators for different application scenarios. Meanwhile, piezoelectric MEMS energy harvesters, with the ability to power other MEMS devices, are orderly enumerated. Furthermore, as a representative of piezoelectric resonators, Lamb wave resonators are exhibited with manifold performance improvements. Finally, the development trends of wearable and implantable piezoelectric MEMS devices are discussed.


Author(s):  
E. T. Pereira ◽  
H. P. Paz ◽  
V. S. Silva ◽  
E. V. V. Cambero ◽  
I. R. S. Casella ◽  
...  

In this paper, a low-cost rectenna based on an antipodal Vivaldi antenna (AVA) with elliptical slots (AVA-ES) is developed and analyzed. The design of AVA-ES, when compared to a reference AVA, presents significant improvements in directivity and gain (58% at 2.45[Formula: see text]GHz for both), evidencing its advantages for using in rectennas. The proposed rectenna prototype presents satisfactory results at 2.45[Formula: see text]GHz, such as conversion efficiency for low-power input levels (27% at [Formula: see text]10[Formula: see text]dBm) and maximum output voltage (550[Formula: see text]mV), that supports its use for radio-frequency energy harvesting (RFEH).


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