scholarly journals Cost-Sensitive Siamese Network for PCB Defect Classification

2021 ◽  
Vol 2021 ◽  
pp. 1-13
Author(s):  
Yilin Miao ◽  
Zhewei Liu ◽  
Xiangning Wu ◽  
Jie Gao

After the production of printed circuit boards (PCB), PCB manufacturers need to remove defected boards by conducting rigorous testing, while manual inspection is time-consuming and laborious. Many PCB factories employ automatic optical inspection (AOI), but this pixel-based comparison method has a high false alarm rate, thus requiring intensive human inspection to determine whether alarms raised from it resemble true or pseudo defects. In this paper, we propose a new cost-sensitive deep learning model: cost-sensitive siamese network (CSS-Net) based on siamese network, transfer learning and threshold moving methods to distinguish between true and pseudo PCB defects as a cost-sensitive classification problem. We use optimization algorithms such as NSGA-II to determine the optimal cost-sensitive threshold. Results show that our model improves true defects prediction accuracy to 97.60%, and it maintains relatively high pseudo defect prediction accuracy, 61.24% in real-production scenario. Furthermore, our model also outperforms its state-of-the-art competitor models in other comprehensive cost-sensitive metrics, with an average of 33.32% shorter training time.

2008 ◽  
Vol 128 (11) ◽  
pp. 657-662 ◽  
Author(s):  
Tsuyoshi Maeno ◽  
Yukihiko Sakurai ◽  
Takanori Unou ◽  
Kouji Ichikawa ◽  
Osamu Fujiwara

2018 ◽  
Vol 23 (2) ◽  
pp. 141-148
Author(s):  
S.Sh. Rekhviashvili ◽  
◽  
M.O. Mamchuev ◽  
V.V. Narozhnov ◽  
M.M. Oshkhunov ◽  
...  

2013 ◽  
Vol 61 (3) ◽  
pp. 731-735
Author(s):  
A.W. Stadler ◽  
Z. Zawiślak ◽  
W. Stęplewski ◽  
A. Dziedzic

Abstract. Noise studies of planar thin-film Ni-P resistors made in/on Printed Circuit Boards, both covered with two different types of cladding or uncladded have been described. The resistors have been made of the resistive-conductive-material (Ohmega-Ply©) of 100 Ώ/sq. Noise of the selected pairs of samples has been measured in the DC resistance bridge with a transformer as the first stage in a signal path. 1/f noise caused by resistance fluctuations has been found to be the main noise component. Parameters describing noise properties of the resistors have been calculated and then compared with the parameters of other previously studied thin- and thick-film resistive materials.


2014 ◽  
Vol 13 (10) ◽  
pp. 2601-2607 ◽  
Author(s):  
Jae-chun Lee ◽  
Manoj Kumar ◽  
Min-Seuk Kim ◽  
Jinki Jeong ◽  
Kyoungkeun Yoo

Author(s):  
Bhanu Sood ◽  
Michael Pecht

Abstract Failures in printed circuit boards account for a significant percentage of field returns in electronic products and systems. Conductive filament formation is an electrochemical process that requires the transport of a metal through or across a nonmetallic medium under the influence of an applied electric field. With the advent of lead-free initiatives, boards are being exposed to higher temperatures during lead-free solder processing. This can weaken the glass-fiber bonding, thus enhancing conductive filament formation. The effect of the inclusion of halogen-free flame retardants on conductive filament formation in printed circuit boards is also not completely understood. Previous studies, along with analysis and examinations conducted on printed circuit boards with failure sites that were due to conductive filament formation, have shown that the conductive path is typically formed along the delaminated fiber glass and epoxy resin interfaces. This paper is a result of a year-long study on the effects of reflow temperatures, halogen-free flame retardants, glass reinforcement weave style, and conductor spacing on times to failure due to conductive filament formation.


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