scholarly journals Low-Cost Printed Flexible Antenna by Using an Office Printer for Conformal Applications

2018 ◽  
Vol 2018 ◽  
pp. 1-7 ◽  
Author(s):  
Kashif Nisar Paracha ◽  
Sharul Kamal Abdul Rahim ◽  
Hassan Tariq Chattha ◽  
Saqer Saleh Aljaafreh ◽  
Sabih ur Rehman ◽  
...  
Keyword(s):  
Silver Nanoparticle ◽  
Low Cost ◽  
Coplanar Waveguide ◽  
Single Layer ◽  
Nanoparticle Layer ◽  
Layer Deposition ◽  
5G Network ◽  
Flexible Antenna ◽  
Nanoparticle Ink ◽  
Pet Substrate

A low-cost inkjet printing method for antenna fabrication on a polyethylene terephthalate (PET) substrate is presented in this paper. An office inkjet printer is used to have desired patterns of silver nanoparticle ink on the PET substrate without any postprocessing. Silver nanoparticle ink cures instantly as soon as it is ejected from the printer on a chemically treated PET substrate. The thickness of the silver nanoparticle layer was measured to be 300 nm with a sheet resistance of as low as 0.3 Ω/sq and a conductivity around 1.11 × 107 S/m with single layer deposition. A coplanar waveguide- (CPW-) fed Z-shape planar antenna on the PET substrate achieved the measured radiation efficiency of 62% and the IEEE gain of 1.44 dBi at 2.45 GHz. The printed antenna is also tested in bending conditions to ascertain its performance for the Internet of things (IoT) conformal applications for the future 5G network.

scholarly journals A single layer deposition of Li-doped mesoporous TiO2 beads for low-cost and efficient dye-sensitized solar cells

2021 ◽  
Vol 45 (5) ◽  
pp. 2470-2477
Author(s):  
P. Golvari ◽  
E. Nouri ◽  
N. Mohsenzadegan ◽  
M. R. Mohammadi ◽  
S. O. Martinez-Chapa
Keyword(s):  
Light Scattering ◽  
Low Cost ◽  
Dye Sensitized Solar Cells ◽  
Single Layer ◽  
Cost Effective ◽  
Mesoporous Tio2 ◽  
Trap States ◽  
Dye Sensitized ◽  
Layer Deposition ◽  
Sensitized Solar Cells

Cost-effective DSCs with superior electronic properties are gained by a reduction in electronic trap states and outstanding light scattering and harvesting.

Effect of silver nanoparticle ink drop spacing on the characteristics of coplanar waveguide monopole antennas printed on flexible substrates

2017 ◽  
Vol 11 (11) ◽  
pp. 1572-1577 ◽  
Author(s):  
S.A. Mohassieb ◽  
Khaled Kirah ◽  
Edgar Dörsam ◽  
Ahmed S.G. Khalil ◽  
Hadia M. El‐Hennawy
Keyword(s):  
Silver Nanoparticle ◽  
Coplanar Waveguide ◽  
Flexible Substrates ◽  
Monopole Antennas ◽  
Nanoparticle Ink

scholarly journals Effects of Thermal Undercooling and Thermal Cycles on the Grain and Microstructure Evolution of TC17 Titanium Alloy Repaired by Wire Arc Additive Manufacturing

2021 ◽  
Author(s):  
Yimin Zhuo ◽  
Chunli Yang ◽  
Chenglei Fan ◽  
Sanbao Lin
Keyword(s):  
Titanium Alloy ◽  
Additive Manufacturing ◽  
High Efficiency ◽  
Low Cost ◽  
Single Layer ◽  
Element Model ◽  
Maximum Effect ◽  
Thermal Cycles ◽  
Layer Deposition ◽  
Wire Arc Additive Manufacturing

Abstract Wire arc additive manufacturing (WAAM) can be used to repair blades or blisk made of titanium alloy with the advantage of high efficiency and low-cost. In this work, the finite element model of repairing the blade based on the arc heat source was established to investigate it. Results showed that the maximum effect of thermal undercooling appears when the peak current transforms to the base current (1Hz or 5Hz), which will promote the grains refinement with the combination of sufficient constitutional supercooling. Compared to the single-layer deposition, the microstructure in the near-heat affected zone (near-HAZ) of multi-layer deposition changes from the metastable β phases to the extremely fine α phases, which was caused by the repeated thermal cycles.

Development of Silver Nanoparticle Ink for Printed Electronics

2012 ◽  
Vol 2012 (1) ◽  
pp. 000935-000939
Author(s):  
Yiliang Wu ◽  
Ping Liu ◽  
Tony Wigglesworth
Keyword(s):  
Silver Nanoparticles ◽  
Silver Nanoparticle ◽  
Self Assembly ◽  
High Performance ◽  
Printed Electronics ◽  
Low Cost ◽  
High Conductivity ◽  
Large Area ◽  
Electrical Stability ◽  
Nanoparticle Ink

Printable conductors with high conductivity would be critical for low-cost printed electronics. In view of printability, conductivity, and electrical stability, metal such as gold or silver derived from solution-deposited precursor compositions would be an ideal candidate. Xerox has been exploring the use of silver nanoparticles as conductor precursor composition for printed electronics. This paper reviews our research in the development of alkylamine-stabilized silver nanoparticles that can be sintered at low temperature (∼ 120 °C) for high conductivity (>10000 S/cm). Silver nanoparticle ink formulations based on these silver nanoparticles exhibit surface-energy independent printability which enables the fabrication of high-performance top-contact transistor devices, and self-assembly characteristic when printed on hydrophilic substrates which allows for large-area, defect-free source drain arrays to be printed with a narrow and uniform channel length.

Development of Silver Nanoparticle Ink for Printed Electronics

2013 ◽  
Vol 10 (2) ◽  
pp. 49-53 ◽  
Author(s):  
Yiliang Wu ◽  
Ping Liu ◽  
Tony Wigglesworth
Keyword(s):  
Silver Nanoparticles ◽  
Silver Nanoparticle ◽  
Self Assembly ◽  
High Performance ◽  
Printed Electronics ◽  
Low Cost ◽  
High Conductivity ◽  
Large Area ◽  
Electrical Stability ◽  
Nanoparticle Ink

Printable conductors with high conductivity are critical for low-cost printed electronics. From the view of printability, conductivity, and electrical stability, an ideal candidate would be a metal such as gold or silver derived from solution-deposited precursor compositions. We have been exploring the use of silver nanoparticles as the conductor precursor for printed electronics. This paper reviews our research in the development of alkylamine-stabilized silver nanoparticles that can be sintered at a low temperature (∼120°C) for high conductivity (>10,000 S/cm). Silver nanoparticle ink formulations based on these silver nanoparticles exhibit surface-energy independent printability, which enables the fabrication of high-performance top-contact transistor devices, and self-assembly characteristic when printed on hydrophilic substrates, which allows for large-area, defect-free source/drain arrays to be printed with a narrow and uniform channel length.

Fabrication of 3D Temperature Sensor Using Magnetostrictive Inkjet Printhead

2020 ◽  
Vol 64 (5) ◽  
pp. 50405-1-50405-5
Author(s):  
Young-Woo Park ◽  
Myounggyu Noh
Keyword(s):  
Flexible Electronics ◽  
Inkjet Printing ◽  
Temperature Sensor ◽  
Computer Aided Design ◽  
Low Cost ◽  
Three Dimensional ◽  
Drop On Demand ◽  
Aided Design ◽  
Nanoparticle Ink ◽  
Inkjet Printhead

Abstract Recently, the three-dimensional (3D) printing technique has attracted much attention for creating objects of arbitrary shape and manufacturing. For the first time, in this work, we present the fabrication of an inkjet printed low-cost 3D temperature sensor on a 3D-shaped thermoplastic substrate suitable for packaging, flexible electronics, and other printed applications. The design, fabrication, and testing of a 3D printed temperature sensor are presented. The sensor pattern is designed using a computer-aided design program and fabricated by drop-on-demand inkjet printing using a magnetostrictive inkjet printhead at room temperature. The sensor pattern is printed using commercially available conductive silver nanoparticle ink. A moving speed of 90 mm/min is chosen to print the sensor pattern. The inkjet printed temperature sensor is demonstrated, and it is characterized by good electrical properties, exhibiting good sensitivity and linearity. The results indicate that 3D inkjet printing technology may have great potential for applications in sensor fabrication.

Bamboo Waste-based Bio-composite Substance: An application for Low-cost Construction Materials

2020 ◽  
Vol 4 (1) ◽  
pp. 41-48
Author(s):  
Teodoro Astorga Amatosa ◽  
Michael E. Loretero
Keyword(s):  
Composite Materials ◽  
Sea Water ◽  
Raw Materials ◽  
Low Cost ◽  
Construction Materials ◽  
Single Layer ◽  
High Strength ◽  
Green Technology ◽  
Experimental Medium ◽  
Natural Treatment

Bamboo is a lightweight and high-strength raw materials that encouraged researchers to investigate and explore, especially in the field of biocomposite and declared as one of the green-technology on the environment as fully accountable as eco-products. This research was to assess the technical feasibility of making single-layer experimental Medium-Density Particleboard panels from the bamboo waste of a three-year-old (Dendrocalamus asper). Waste materials were performed to produce composite materials using epoxy resin (C21H25C105) from a natural treatment by soaking with an average of pH 7.6 level of sea-water. Three different types of MDP produced, i.e., bamboo waste strip MDP (SMDP), bamboo waste chips MDP (CMDP) and bamboo waste mixed strip-chips MDP (MMDP) by following the same process. The experimental panels tested for their physical-mechanical properties according to the procedures defined by ASTM D1037-12. Conclusively, even the present study shows properties of MDP with higher and comparable to other composite materials; further research must be given better attention as potential substitute to be used as hardwood materials, especially in the production, design, and construction usage.

A Novel Wideband transition from Substrate Integrated Waveguide to Rectangular Waveguide

2020 ◽  
Vol 10 ◽  
Author(s):  
Keyur Mahant ◽  
Hiren Mewada ◽  
Amit Patel ◽  
Alpesh Vala ◽  
Jitendra Chaudhari
Keyword(s):  
Rectangular Waveguide ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Single Layer ◽  
Circuit Board ◽  
Substrate Integrated Waveguide ◽  
Ka Band ◽  
Better Than ◽  
Millimeter Wave Circuits ◽  
Wideband Transition

Aim: In this article, wideband substrate integrated waveguide (SIW) and rectangular waveguide (RWG) transition operating in Ka-band is proposed Objective: In this article, wideband substrate integrated waveguide (SIW) and rectangular waveguide (RWG) transition operating in Ka-band is proposed. Method: Coupling patch etched on the SIW cavity to couple the electromagnetic energy from SIW to RWG. Moreover, metasurface is introduced into the radiating patch to enhance bandwidth. To verify the functionality of the proposed structure back to back transition is designed and fabricated on a single layer substrate using standard printed circuit board (PCB) fabrication technology. Results: Measured results matches with the simulation results, measured insertion loss is less than 1.2 dB and return loss is better than 3 dB for the frequency range of 28.8 to 36.3 GHz. By fabricating transition with 35 SRRs bandwidth of the proposed transition can be improved. Conclusion: The proposed transition has advantages like compact in size, easy to fabricate, low cost and wide bandwidth. Proposed structure is a good candidate for millimeter wave circuits and systems.

scholarly journals Single-Layer Line-Fed Broadband Microstrip Patch Antenna on Thin Substrates

Electronics ◽  
2020 ◽  
Vol 10 (1) ◽  
pp. 37
Author(s):  
Roberto Vincenti Gatti ◽  
Riccardo Rossi ◽  
Marco Dionigi
Keyword(s):  
Patch Antenna ◽  
State Of The Art ◽  
Low Cost ◽  
Single Layer ◽  
Microstrip Antennas ◽  
Microstrip Patch Antenna ◽  
Layer Line ◽  
Limited Bandwidth ◽  
Microstrip Patch ◽  
Effective Design

In this work, the issue of limited bandwidth typical of microstrip antennas realized on a single thin substrate is addressed. A simple yet effective design approach is proposed based on the combination of traditional single-resonance patch geometries. Two novel shaped microstrip patch antenna elements with an inset feed are presented. Despite being printed on a single-layer substrate with reduced thickness, both radiators are characterized by a broadband behavior. The antennas are prototyped with a low-cost and fast manufacturing process, and measured results validate the simulations. State-of-the-art performance is obtained when compared to the existing literature, with measured fractional bandwidths of 3.71% and 6.12% around 10 GHz on a 0.508-mm-thick Teflon-based substrate. The small feeding line width could be an appealing feature whenever such radiating elements are to be used in array configurations.

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