scholarly journals Corrigendum to “Background Radiance Estimation for Gas Plume Quantification for Airborne Hyperspectral Thermal Imaging”

2016 ◽  
Vol 2016 ◽  
pp. 1-4 ◽  
Author(s):  
Ramzi Idoughi ◽  
Thomas H. G. Vidal ◽  
Pierre-Yves Foucher ◽  
Marc-André Gagnon ◽  
Xavier Briottet
Keyword(s):  
Thermal Imaging ◽  
Radiance Estimation

Remote Investigation of Buildings' Heat Losses by Thermal Imaging Technique

2009 ◽  
Vol 5 (1) ◽  
pp. 31-35
Author(s):  
F.F. Sizov ◽  
◽  
V.V. Zabudsky ◽  
A.G. Golenkov ◽  
S.L. Kravchenko ◽  
...  
Keyword(s):  
Thermal Imaging ◽  
Imaging Technique ◽  
Heat Losses

Far-Infrared Fresnel Lens for Thermal Imaging

2013 ◽  
Vol 133 (7) ◽  
pp. 274-279
Author(s):  
Tomoyuki Takahata ◽  
Kiyoshi Matsumoto ◽  
Isao Shimoyama
Keyword(s):  
Thermal Imaging ◽  
Far Infrared ◽  
Fresnel Lens

Exposing Hidden Energy Transfer With Inexpensive Thermal Imaging Cameras

Science Scope ◽  
2016 ◽  
Vol 039 (07) ◽  
Author(s):  
Jeffrey Nordine ◽  
Susanne Wessnigk
Keyword(s):  
Energy Transfer ◽  
Thermal Imaging

MONITORING THE WORK ENVIRONMENT USING THERMAL IMAGING CAMERAS IN ORDER TO PREVENT THE SELF-IGNITION OF COAL

2017 ◽  
Vol 16 (6) ◽  
pp. 1389-1393 ◽  
Author(s):  
Cristian Tomescu ◽  
Maria Prodan ◽  
Niculina Vatavu ◽  
Emeric Chiuzan
Keyword(s):  
Work Environment ◽  
Thermal Imaging ◽  
The Self

Thermal Imaging Product Power-up: Metrology for Capturing Thermal Defects on Live Units Not Visible on Any Other Technique

2005 ◽  
Author(s):  
Nova T. Zamora ◽  
Kam Meng Chong ◽  
Ashish Gupta
Keyword(s):  
Thermal Imaging ◽  
Thermal Response ◽  
Recent Application ◽  
Ir Camera ◽  
Thermal Failure ◽  
Response Data ◽  
Startup Process ◽  
Customer Returns ◽  
Actual Computer ◽  
Detection Of Defects

Abstract This paper presented the recent application of die powerup in Thermal Imaging as applied to the detection of defects causing thermal failure on revenue products or units not being captured using other available techniques. Simulating the condition on an actual computer setup, the infrared (IR) camera should capture images simultaneously as the entire bootup process is being executed by the processor, thus revealing a series of images and thermal information on each and every step of the startup process. This metrology gives the failure analyst a better approach to acquire a set of information that substantiate in the conduct of rootcause analysis of thermal-related failure in revenue units, especially on customer returns. Defective units were intentionally engineered in order to collect the thermal response data and eventually come up with a plot of all known thermal-related defects.

Evaluation of Package Defects by Thermal Imaging Techniques

2002 ◽  
Author(s):  
Yongmei Liu ◽  
Rajen Dias
Keyword(s):  
Infrared Thermography ◽  
Thermal Imaging ◽  
High Speed ◽  
Imaging Techniques ◽  
Thermal Response ◽  
Analysis Tool ◽  
Nondestructive Analysis ◽  
Ir Camera ◽  
External Heating

Abstract Study presented here has shown that Infrared thermography has the potential to be a nondestructive analysis tool for evaluating package sublayer defects. Thermal imaging is achieved by applying pulsed external heating to the package surface and monitoring the surface thermal response as a function of time with a high-speed IR camera. Since the thermal response of the surface is affected by the defects such as voids and delamination below the package surface, the technique can be used to assist package defects detection and analysis.

Magnetic Current Imaging Power Short Localization

2015 ◽  
Author(s):  
J. Gaudestad ◽  
F. Rusli ◽  
A. Orozco ◽  
M.C. Pun
Keyword(s):  
Thermal Imaging ◽  
Flip Chip ◽  
Optical Microscope ◽  
Fault Isolation ◽  
Magnetic Current ◽  
Multiple Fault ◽  
Defect Location ◽  
Isolation Techniques ◽  
Chip Sample

Abstract A Flip Chip sample failed short between power and ground. The reference unit had 418Ω and the failed unit with the short had 16.4Ω. Multiple fault isolation techniques were used in an attempt to find the failure with thermal imaging and Magnetic Current Imaging being the only techniques capable of localizing the defect. To physically verify the defect location, the die was detached from the substrate and a die cracked was seen using a visible optical microscope.

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