scholarly journals Microfluidic Sample Preparation Methods for the Analysis of Milk Contaminants

2016 ◽  
Vol 2016 ◽  
pp. 1-9 ◽  
Author(s):  
Andrea Adami ◽  
Alessia Mortari ◽  
Elisa Morganti ◽  
Leandro Lorenzelli
Keyword(s):  
Phase Separation ◽  
Sample Preparation ◽  
Food Contamination ◽  
Preparation Methods ◽  
Complex Chemical ◽  
Efficient Detection ◽  
Physical Composition ◽  
Specific Species ◽  
Sample Preparation Methods

In systems for food analysis, one of the major challenges is related to the quantification of specific species into the complex chemical and physical composition of foods, that is, the effect of “matrix”; the sample preparation is often the key to a successful application of biosensors to real measurements but little attention is traditionally paid to such aspects in sensor research. In this critical review, we discuss several microfluidic concepts that can play a significant role in sample preparation, highlighting the importance of sample preparation for efficient detection of food contamination. As a case study, we focus on the challenges related to the detection of aflatoxinM1in milk and we evaluate possible approaches based on inertial microfluidics, electrophoresis, and acoustic separation, compared with traditional laboratory and industrial methods for phase separation as a baseline of thrust and well-established techniques.

Failure Analysis of Advanced Microprocessors through Backside Approaches

1998 ◽  
Author(s):  
D. Davis ◽  
O. Diaz de Leon ◽  
L. Hughes ◽  
S. V. Pabbisetty ◽  
R. Parker ◽  
...  
Keyword(s):  
Sample Preparation ◽  
Failure Analysis ◽  
Flip Chip ◽  
Preparation Methods ◽  
Analysis Techniques ◽  
Analytical Approaches ◽  
Sample Preparation Methods ◽  
New Devices

Abstract The advent of Flip Chip and other complex package configurations and process technologies have made conventional failure analysis techniques inapplicable. This paper covers the ways in which conventional techniques have been modified to meet the FA challenges presented by these new devices – specifically, by forcing analysis to be done from the backside of the device. Modifications to the traditional FA process steps, including new sample preparation methods, changes in hardware, and alterations to physical failure analysis processes are described. To demonstrate the use of backside analytical approaches, some examples of applications and a case study are also included.

Recent technical progress in sample preparation and liquid-phase separation-mass spectrometry for proteomic analysis of mass-limited samples

2021 ◽  
Vol 13 (10) ◽  
pp. 1214-1225
Author(s):  
Zhichang Yang ◽  
Liangliang Sun
Keyword(s):  
Mass Spectrometry ◽  
Phase Separation ◽  
Liquid Phase ◽  
Sample Preparation ◽  
Technical Progress ◽  
Proteomic Analysis ◽  
Liquid Phase Separation ◽  
Preparation Methods ◽  
Sample Preparation Methods

Recent development of sample preparation methods with nanoliter processing volumes, ultrasensitive LC-MS/MS and CZE-MS/MS systems for proteomics of mass-limited samples.

Improving Sample Preparation Methods For Cannabis-Infused Edible And Topical Products

Planta Medica ◽  
2016 ◽  
Vol 82 (05) ◽  
Author(s):  
M Wilcox ◽  
M Jacyno ◽  
J Marcu ◽  
J Neal-Kababick
Keyword(s):  
Sample Preparation ◽  
Preparation Methods ◽  
Sample Preparation Methods

Thin-Die Flip Chip Physical-FA Process Flow

2002 ◽  
Author(s):  
Andrew J. Komrowski ◽  
N. S. Somcio ◽  
Daniel J. D. Sullivan ◽  
Charles R. Silvis ◽  
Luis Curiel ◽  
...  
Keyword(s):  
Sample Preparation ◽  
Failure Analysis ◽  
Flip Chip ◽  
Semiconductor Industry ◽  
Organic Substrate ◽  
Fault Isolation ◽  
Preparation Methods ◽  
Chip Technology ◽  
Isolation Test ◽  
Sample Preparation Methods

Abstract The use of flip chip technology inside component packaging, so called flip chip in package (FCIP), is an increasingly common package type in the semiconductor industry because of high pin-counts, performance and reliability. Sample preparation methods and flows which enable physical failure analysis (PFA) of FCIP are thus in demand to characterize defects in die with these package types. As interconnect metallization schemes become more dense and complex, access to the backside silicon of a functional device also becomes important for fault isolation test purposes. To address these requirements, a detailed PFA flow is described which chronicles the sample preparation methods necessary to isolate a physical defect in the die of an organic-substrate FCIP.

scholarly journals Evaluation and Refinement of Sample Preparation Methods for Extracellular Matrix Proteome Coverage

2021 ◽  
Vol 20 ◽  
pp. 100079
Author(s):  
Maxwell C. McCabe ◽  
Lauren R. Schmitt ◽  
Ryan C. Hill ◽  
Monika Dzieciatkowska ◽  
Mark Maslanka ◽  
...  
Keyword(s):  
Extracellular Matrix ◽  
Sample Preparation ◽  
Preparation Methods ◽  
Proteome Coverage ◽  
Sample Preparation Methods
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