scholarly journals Synthesis and Characterization of Polyesteramide Hot Melt Adhesive from Low Purity Dimer Acid, Ethylenediamine, and Ethanolamine

2014 ◽  
Vol 2014 ◽  
pp. 1-8 ◽  
Author(s):  
Pravin G. Kadam ◽  
Parth Vaidya ◽  
Shashank T. Mhaske
Keyword(s):  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Acid Value ◽  
Peel Strength ◽  
Partial Replacement ◽  
Adhesion Properties ◽  
Dimer Acid ◽  
Lap Shear ◽  
Hot Melt

Polyesteramide hot melt adhesive (HMA) was synthesized using low purity dimer acid (composition: 3% linoleic acid, 75% dimer acid, and 22% trimer acid), ethanolamine, and ethylenediamine. Ethanolamine was added as a partial replacement (10, 20, and 30%) of ethylenediamine. Prepared HMAs were characterized for acid value, amine value, hydroxyl value, Fourier transform infrared spectroscopy, mechanical (tensile strength, percentage strain at brea, and shore D hardness), thermal (glass transition temperature, melting temperature, enthalpy of melting, crystallization temperature, and enthalpy of crystallization), rheological (viscosity versus shear rate and viscosity versus time), and adhesion properties (T-peel strength and lap shear strength). Replacement of ethylenediamine by ethanolamine replaced certain amide linkages by ester linkages, decreasing the intermolecular hydrogen bonding, leading to decrease in the crystallinity of the material, and thus the mechanical, thermal, adhesion, and rheological properties. However, HMAs prepared using ethanolamine will have better low temperature flexibility due to low glass transition temperature and better adhesion process due to the lower viscosity.

Hot-Melt Adhesives: Fundamentals, Formulations, and Applications: A Critical Review

2020 ◽  
Vol 8 (1) ◽  
pp. 1-28
Author(s):  
Swaroop Gharde ◽  
Gaurav Sharma ◽  
Balasubramanian Kandasubramanian
Keyword(s):  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Organic Compounds ◽  
Processing Speed ◽  
Critical Review ◽  
Volatile Organic ◽  
Industrial Use ◽  
Melt Adhesives ◽  
Hot Melt

Hot-Melt Adhesives (HMAs) are typically used in applications where instant sealing is critically required. HMAs are generally preferred for those applications where processing speed is critical. These materials are widely used in various engineering applications, mainly as sealants in leakages and crack filling of walls and roofs. The industrial use of HMAs is most common in glassware and automobiles for gluing glasses in buildings and bonding heavy motor parts. The formulation of HMAs contains a polymer of suitable nature that makes the base for a strong adhesive, and waxes are added to increase the settling time of adhesive. The tackifiers are used to dilute the polymer to adjust the Glass Transition Temperature (Tg) and to reduce the viscosity for proper flow of hot-melt. This review intends to comprehensively discuss the preparation and formulations of HMAs using various polymer matrices, along with their applications and mechanics. The designing of green HMAs has been discussed in the literature and have been promoted over conventional solvent-based HMAs due to their functionality without Volatile Organic Compounds (VOCs). Various measures, challenges, and resolutions for making hazard-free HMAs have been discussed in the present review.

Tissue Scaffold Engineering by Micro-Stamping

2014 ◽  
Vol 1626 ◽  
Author(s):  
Eric C. Schmitt ◽  
Robert D. White ◽  
Amrit Sagar ◽  
Thomas P. James
Keyword(s):  
Tissue Engineering ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Room Temperature ◽  
Polymer Membranes ◽  
Tissue Scaffold ◽  
Brittle Behavior ◽  
Excessive Strain ◽  
Hot Melt

ABSTRACTA hand operated benchtop stamping press was developed to conduct research on microscale hole fabrication in polymer membranes for applications as scaffolds in tissue engineering. A biocompatible and biodegradable polymer, poly(ε-caprolactone), was selected for micropunching. Membranes between 30 μm and 50 μm thick were fabricated by hot melt extrusion, but could not be stamped with a 200 μm circular punch at room temperature, regardless of die clearance due to excessive strain to fracture. This problem was overcome by cooling the membrane and die sets with liquid nitrogen to take advantage of induced brittle behavior below the polymer’s glass transition temperature. While cooled, 203 μm hole patterns were successfully punched in 33 μm thick poly(ε-caprolactone) membranes with 11% die clearance, achieving 71% porosity.

Study on Preparation and Properties of Pressure Sensitive Adhesive of Acrylate Prepared by Miniemulsion

2011 ◽  
Vol 183-185 ◽  
pp. 1938-1941
Author(s):  
Jiu Yin Pang ◽  
Chuan Sun ◽  
Shi Cheng Zhang ◽  
Zhen Xing
Keyword(s):  
Molecular Weight ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Vinyl Acetate ◽  
Butyl Acrylate ◽  
Peel Strength ◽  
Excellent Performance ◽  
Pressure Sensitive Adhesive ◽  
Pressure Sensitive

Miniemulsion was prepared by means of different ratio of butyl acrylate with vinyl acetate emulsion pressure sensitive adhesive excellent performance. Focused on acrylic acid and vinyl acetate copolymers of different proportions of the glass transition temperature, molecular weight and molecular weight distribution of micro-factors, and build the macroscopic properties of the copolymer glass transition temperature and molecular weight between contacts. The use of APS as initiator under the conditions of the experiment found that with the increase of acrylic, PVC-floor, 180 peel strength composite materials decreased. While the molecular weight of butyl acrylate with the increase of the amount did not change significantly, the initial viscosity of the polymer and 180 º peel strength is improved, but the adhesive holding down quickly.

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