scholarly journals A Dual Band Slotted Patch Antenna on Dielectric Material Substrate

2014 ◽  
Vol 2014 ◽  
pp. 1-7 ◽  
Author(s):  
M. Habib Ullah ◽  
M. T. Islam ◽  
M. R. Ahsan ◽  
J. S. Mandeep ◽  
N. Misran
Keyword(s):  
Patch Antenna ◽  
Printed Circuit Board ◽  
Dielectric Material ◽  
Circuit Board ◽  
Dual Band ◽  
Polymer Resin ◽  
Full Wave ◽  
Low Profile ◽  
Gain Variation ◽  
Satellite Applications

A low profile, compact dual band slotted patch antenna has been designed using finite element method-based high frequency full-wave electromagnetic simulator. The proposed antenna fabricated using LPKF printed circuit board (PCB) fabrication machine on fiberglass reinforced epoxy polymer resin material substrate and the performance of the prototype has been measured in a standard far-field anechoic measurement chamber. The measured impedance bandwidths of (reflection coefficient<-10 dB) 12.26% (14.3–16.2 GHZ), 8.24% (17.4–18.9 GHz), and 3.08% (19.2–19.8) have been achieved through the proposed antenna prototype. 5.9 dBi, 3.37 dBi, and 3.32 dBi peak gains have been measured and simulated radiation efficiencies of 80.3%, 81.9%, and 82.5% have been achieved at three resonant frequencies of 15.15 GHz, 18.2 GHz, and 19.5 GHz, respectively. Minimum gain variation, symmetric, and almost steady measured radiation pattern shows that the proposed antenna is suitable for Ku and K band satellite applications.

scholarly journals Low-Cost Dielectric Substrate for Designing Low Profile Multiband Monopole Microstrip Antenna

2014 ◽  
Vol 2014 ◽  
pp. 1-10 ◽  
Author(s):  
M. R. Ahsan ◽  
M. T. Islam ◽  
M. Habib Ullah ◽  
H. Arshad ◽  
M. F. Mansor
Keyword(s):  
Microstrip Antenna ◽  
Dielectric Material ◽  
Low Cost ◽  
Cost Effective ◽  
Dielectric Substrate ◽  
The Finite Element Method ◽  
Radiation Patterns ◽  
Polymer Resin ◽  
Full Wave ◽  
Low Profile

This paper proposes a small sized, low-cost multiband monopole antenna which can cover the WiMAX bands and C-band. The proposed antenna of 20 × 20 mm2radiating patch is printed on cost effective 1.6 mm thick fiberglass polymer resin dielectric material substrate and fed by 4 mm long microstrip line. The finite element method based, full wave electromagnetic simulator HFSS is efficiently utilized for designing and analyzing the proposed antenna and the antenna parameters are measured in a standard far-field anechoic chamber. The experimental results show that the prototype of the antenna has achieved operating bandwidths (voltage stand wave ratio (VSWR) less than 2) 360 MHz (2.53–2.89 GHz) and 440 MHz (3.47–3.91 GHz) for WiMAX and 1550 MHz (6.28–7.83 GHz) for C-band. The simulated and measured results for VSWR, radiation patterns, and gain are well matched. Nearly omnidirectional radiation patterns are achieved and the peak gains are of 3.62 dBi, 3.67 dBi, and 5.7 dBi at 2.66 GHz, 3.65 GHz, and 6.58 GHz, respectively.

scholarly journals A Double Inverted F-Shape Patch Antenna for Dual-Band Operation

2014 ◽  
Vol 2014 ◽  
pp. 1-8 ◽  
Author(s):  
M. M. Islam ◽  
M. R. I. Faruque ◽  
W. Hueyshin ◽  
J. S. Mandeep ◽  
T. Islam
Keyword(s):  
Finite Element Method ◽  
Patch Antenna ◽  
High Frequency ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Dual Band ◽  
The Finite Element Method ◽  
Microstrip Transmission Line ◽  
Printed Circuit ◽  
Measured Impedance

A double inverted F-shape patch antenna is presented for dual-band operation. The proposed antenna is comprised of circular and rectangular slots on a printed circuit board of 40 mm × 40 mm × 1.6 mm with a 50 Ω microstrip transmission line. Commercially available high frequency structural simulator (HFSS) based on the finite element method (FEM) has been adopted in this investigation. It has a measured impedance bandwidths (2 : 1 VSWR) of 18.53% on the lower band and 7.8% on the upper band, respectively. It has achieved stable radiation efficiencies of 79.76% and 80.36% with average gains of 7.82 dBi and 5.66 dBi in the operating frequency bands. Moreover, numerical simulations have been indicated as an important uniformity with measured results.

scholarly journals Multiband Microstrip Patch Antenna for IoT Applications

2019 ◽  
Vol 9 (1) ◽  
pp. 2455-2457
Keyword(s):  
Patch Antenna ◽  
Return Loss ◽  
Printed Circuit Board ◽  
Dielectric Material ◽  
Ground Plane ◽  
Microstrip Patch Antenna ◽  
Circuit Board ◽  
Microstrip Patch ◽  
Resonance Frequencies ◽  
And Performance

In this paper, a planar multiband microstrip patch antenna is presented for narrow band internet of things (NBIoT) applications. The simple planar structure covers three of the approved bands (830-840 MHz), (850-890 MHz) and (1190-1200 MHz). The return loss at resonance frequencies is less than20dB and radiation pattern is omnidirectional as desired, for all the bands. Simple basic equations of microstrip patch antenna are used for design. The simulation and performance analysis is done using HFSS tool. The design considers simple, easily available printed circuit board (PCB) with FR4 dielectric material between the patch and ground plane. Which is inexpensive, fulfills the basic need of the application. The optimetrics of the HFSS simulation tool are handy, used extensively to find appropriate feed position, optimize return loss, gain and to tune the resonance frequencies.

scholarly journals A low-cost fiberglass polymer resin dielectric material-based microstrip patch antenna for multiband applications

2016 ◽  
Vol 23 (4) ◽  
pp. 447-452
Author(s):  
M. Habib Ullah ◽  
M. Tariqul Islam ◽  
M. Rezwanul Ahsan ◽  
Wan Nor Liza Mahadi ◽  
Tarik Abdul Latef ◽  
...  
Keyword(s):  
Patch Antenna ◽  
Dielectric Material ◽  
Resin Composite ◽  
Low Cost ◽  
Circuit Board ◽  
Performance Criteria ◽  
Optimized Design ◽  
Ieee 802.11B ◽  
Polymer Resin ◽  
Compact Size

AbstractThe design analysis and prototype of a compact 8×10-mm2 planar microstrip line-fed patch antenna on a readily available, low-cost, reinforced-fiberglass polymer resin composite material substrate is presented in this article. The proposed compact-size antenna has been configured and numerically analyzed using the finite element method-based three-dimensional full-wave electromagnetic field simulator. The optimized design of the antenna has been fabricated on a printed circuit board (PCB), and experimental results have been collected for further analysis. The measurement results affirm the fractional impedance bandwidths of (return loss of less than -10 dB) of 38.78% (2.03–2.98 GHZ) and 16.3% (5.38–6.35 GHz), with average gains of 2.52 and 3.94 dBi at both lower and upper bands, respectively. The proposed dual resonant antenna shows the radiation efficiencies of 91.3% at 2.45 GHz and 87.7% at 5.95 GHz. The stable and almost symmetric radiation patterns and performance criteria of the antenna can successfully cover IEEE 802.11b/g/n, Bluetooth, WLAN, and C-band telecommunication satellite uplinks.

scholarly journals A Dual-Band High-Gain Subwavelength Cavity Antenna with Artificial Magnetic Conductor Metamaterial Microstructures

Micromachines ◽  
2021 ◽  
Vol 13 (1) ◽  
pp. 58
Author(s):  
Guang Lu ◽  
Fabao Yan ◽  
Kaiyuan Zhang ◽  
Yunpeng Zhao ◽  
Lei Zhang ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
High Gain ◽  
Resonant Wavelength ◽  
Circuit Board ◽  
Dual Band ◽  
Dual Frequency ◽  
Magnetic Conductor ◽  
Artificial Magnetic Conductor ◽  
Low Profile ◽  
Unit Cells

This paper presents dual-band high-gain subwavelength cavity antennas with artificial magnetic conductor (AMC) metamaterial microstructures. We developed an AMC metamaterial plate that can be equivalent to mu-negative metamaterials (MNMs) at two frequencies using periodic microstructure unit cells. A cavity antenna was constructed using the dual-band AMC metamaterial plate as the covering layer and utilizing a feed patch antenna with slot loading as the radiation source. The antenna was fabricated with a printed circuit board (PCB) process and measured in an anechoic chamber. The |S11| of the antenna was −26.8 dB and −23.2 dB at 3.75 GHz and 5.66 GHz, respectively, and the realized gain was 15.2 dBi and 18.8 dBi at two resonant frequencies. The thickness of the cavity, a sub-wavelength thickness cavity, was 15 mm, less than one fifth of the long resonant wavelength and less than one third of the short resonant wavelength. This new antenna has the advantages of low profile, light weight, dual-frequency capability, high gain, and easy processing.

scholarly journals Highly Compact Through-Wire Microstrip to Empty Substrate Integrated Coaxial Line Transition

2021 ◽  
Vol 11 (15) ◽  
pp. 6885
Author(s):  
Marcos D. Fernandez ◽  
José A. Ballesteros ◽  
Angel Belenguer
Keyword(s):  
Printed Circuit Board ◽  
Low Cost ◽  
Coaxial Line ◽  
Circuit Board ◽  
Central Layer ◽  
Printed Circuit ◽  
Integrated Technology ◽  
Low Profile ◽  
The Many ◽  
High Degree

Empty substrate integrated coaxial line (ESICL) technology preserves the many advantages of the substrate integrated technology waveguides, such as low cost, low profile, or integration in a printed circuit board (PCB); in addition, ESICL is non-dispersive and has low radiation. To date, only two transitions have been proposed in the literature that connect the ESICL to classical planar lines such as grounded coplanar and microstrip. In both transitions, the feeding planar lines and the ESICL are built in the same substrate layer and they are based on transformed structures in the planar line, which must be in the central layer of the ESICL. These transitions also combine a lot of metallized and non-metallized parts, which increases the complexity of the manufacturing process. In this work, a new through-wire microstrip-to-ESICL transition is proposed. The feeding lines and the ESICL are implemented in different layers, so that the height of the ESICL can be independently chosen. In addition, it is a highly compact transition that does not require a transformer and can be freely rotated in its plane. This simplicity provides a high degree of versatility in the design phase, where there are only four variables that control the performance of the transition.

scholarly journals A compact low-noise frontend for interleaved Rx/Tx arrays at K-/Ka-Band

2021 ◽  
pp. 1-7
Author(s):  
Anton Sieganschin ◽  
Thomas Jaschke ◽  
Arne F. Jacob
Keyword(s):  
Insertion Loss ◽  
Printed Circuit Board ◽  
Noise Figure ◽  
Low Noise ◽  
Single Band ◽  
Circuit Board ◽  
Dual Band ◽  
Ka Band ◽  
Compression Properties ◽  
The Individual

Abstract This contribution deals with a frontend for interleaved receive (Rx)-/transmit (Tx)-integrated phased arrays at K-/Ka-band. The circuit is realized in printed circuit board technology and feeds dual-band Rx/Tx- and single-band Tx-antenna elements. The dual-band element feed is composed of a substrate-integrated waveguide (SIW) diplexer with low insertion loss, a low-noise amplifier (LNA), a bandpass filter, and several passive transitions. The compression properties of the LNA are identified through two-tone measurements. The results dictate the maximum allowable output power of the power amplifier. The single band feed consists of a SIW with several transitions. Simulation and measurement results of the individual components are presented. The frontend is assembled and measured. It exhibits an Rx noise figure of 2 dB, a Tx insertion loss of ~ 2.9 dB, and an Rx/Tx-isolation of 70 dB. The setup represents the unit cell of a full array and thus complies with the required half-wave spacing at both Rx and Tx.

Sign in / Sign up

Export Citation Format

Share Document