scholarly journals Comparative Study of the Thermal Shock Resistance of an Industrial Tableware Porcelain

2013 ◽  
Vol 2013 ◽  
pp. 1-7
Author(s):  
Habib Sahlaoui ◽  
Kamel Makhlouf ◽  
Habib Sidhom
Keyword(s):  
Low Temperature ◽  
Thermal Shock ◽  
Thermal Shock Resistance ◽  
Mechanical Resistance ◽  
Firing Cycle ◽  
Bending Tests ◽  
Three Point Bending ◽  
Shock Resistance ◽  
Silica Ratio ◽  
Thermal Shocks

The effect of the glazed layer and firing conditions (temperature and duration) on the thermal shocks behavior of tableware porcelains has been studied. Two types of glazed layers and three firing conditions, used industrially in the commercial porcelains manufacture, are used in this investigation. Repeated thermal shock tests showed that the glazed layer with higher alumina/silica ratio is more resistant to thermal shocks and that the slow firing cycle, even at a relatively low temperature, is very beneficial for the thermal shock resistance of the porcelain matrix. Three-point bending tests showed that the crazing phenomenon, which affects the glazed layers as well as the porcelain matrix, does not affect significantly the mechanical resistance of these materials.

Mechanical properties of low-temperature sintered ceria-stabilized tetragonal zirconia phase Part III Thermal shock resistance

1993 ◽  
Vol 12 (9) ◽  
pp. 684-686 ◽  
Author(s):  
R. Ponraj ◽  
V. E. Annamalai ◽  
S. Ramakrishna Iyer ◽  
C. V. Gokularathnam ◽  
R. Krishnamurthy
Keyword(s):  
Mechanical Properties ◽  
Low Temperature ◽  
Thermal Shock ◽  
Thermal Shock Resistance ◽  
Tetragonal Zirconia ◽  
Shock Resistance ◽  
Zirconia Phase

The Thermal Shock Resistance of Mg-PSZ/LaPO4 Ceramics

2013 ◽  
Vol 785-786 ◽  
pp. 187-190
Author(s):  
Zhong Qiu Li ◽  
Li Jie Ci ◽  
Tie Cheng Feng ◽  
Shao Yan Zhang
Keyword(s):  
Mechanical Properties ◽  
Flexural Strength ◽  
Thermal Shock ◽  
Thermal Shock Resistance ◽  
Strength Degradation ◽  
Water Quenching ◽  
Bending Test ◽  
Three Point Bending ◽  
Shock Resistance ◽  
Thermal Shock Behavior

The mechanical properties and thermal shock behavior of Mg-PSZ/LaPO4 ceramics was investigated. The thermal shock resistance of the materials was evaluated by water quenching and a subsequent three-point bending test to determine the flexural strength degradation. Mg-PSZ/15LaPO4 composite showed a higher thermal shock resistance and behaved as a typical refractory. The calculation of thermal shock resistance parameters for the composites and the monolith had indicated possible explanations for the differences in thermal shock behavior.

Microstructure and Thermal Shock Resistance of LaPO4-ZrO2

2008 ◽  
Vol 368-372 ◽  
pp. 1633-1635 ◽  
Author(s):  
Zhong Qiu Li ◽  
Jia Chen Liu ◽  
Shun Li ◽  
Bing Zhou ◽  
Wei Jing
Keyword(s):  
Thermal Shock ◽  
Thermal Shock Resistance ◽  
Room Temperature ◽  
Slip Casting ◽  
Strength Degradation ◽  
Bending Test ◽  
Three Point Bending ◽  
Shock Resistance

LaPO4-ZrO2 composites were prepared by slip casting and pressureless-sintered in air. The effects of LaPO4 addition on microstructure and thermal shock resistance were addressed. The thermal shock resistance of the composites was evaluated by air quenching and a subsequent three-point bending test to determine the strength degradation. Comparisons were made with results from parallel experiments conducted using a ZrO2 ceramic without LaPO4 additions. The reference ZrO2 ceramic showed the expected substantial strength losses when thermally quenched from 470oC above room temperature. By contrast, the LaPO4-ZrO2 ceramics, while displaying reduced strength relative to the reference ZrO2 ceramics, exhibited minimal strength degradation under severe thermal shock conditions.

Study on Thermal Shock Resistance of Insulated Metal Substrate

2005 ◽  
Vol 475-479 ◽  
pp. 1737-1742
Author(s):  
Liquan Guo ◽  
Yang Liu ◽  
Ju Sheng Ma
Keyword(s):  
Thermal Conductivity ◽  
Thermal Shock ◽  
Thermal Shock Resistance ◽  
Room Temperature ◽  
Metal Substrate ◽  
Anodic Film ◽  
Excellent Performance ◽  
Insulating Layer ◽  
Shock Resistance ◽  
Thermal Shocks

Anodizing technique was applied to prepare insulated metal substrates (IMS) for BGA packaging. “Ideal” IMS used anodic film of aluminum as the insulating layer instead of epoxy, which led to higher thermal conductivity. But the thermal shock resistance of IMS is poor because of the great difference of thermal expansion coefficient between aluminum and its anodic film. In this study, different anodizing processes of aluminum were analyzed. The parameters, which can affect the thermal shock resistance of IMS, especially the surface temperature of Al substrate, were studied. The anodic film obtained with the optimized parameters of anodizing process had excellent performance, such as the resistivity was over 1013Ω·cm, the breakdown voltage was higher than 600V, and the most important thing was that it could resist thermal shocks between room temperature and 300°C. Then BGA packaging was successfully performed based on this IMS.

Thermal shock resistance of Ti3SiC2 ceramic under extremely rapid thermal cycling

2021 ◽  
Vol 866 ◽  
pp. 158985
Author(s):  
Xiaojia Su ◽  
Yiwang Bao ◽  
Detian Wan ◽  
Haibin Zhang ◽  
Ludi Xu ◽  
...  
Keyword(s):  
Thermal Cycling ◽  
Thermal Shock ◽  
Thermal Shock Resistance ◽  
Shock Resistance ◽  
Rapid Thermal Cycling
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