scholarly journals Nanosphere Lithography: A Powerful Method for the Controlled Manufacturing of Nanomaterials

2013 ◽  
Vol 2013 ◽  
pp. 1-19 ◽  
Author(s):  
Pierre Colson ◽  
Catherine Henrist ◽  
Rudi Cloots
Keyword(s):  
Colloidal Crystal ◽  
Three Dimensional ◽  
Nanosphere Lithography ◽  
Manufacturing Processes ◽  
Powerful Method ◽  
Polystyrene Nanospheres ◽  
Complex Architectures ◽  
Deposition Techniques ◽  
New Strategies

The never-ending race towards miniaturization of devices induced an intense research in the manufacturing processes of the components of those devices. However, the complexity of the process combined with high equipment costs makes the conventional lithographic techniques unfavorable for many researchers. Through years, nanosphere lithography (NSL) attracted growing interest due to its compatibility with wafer-scale processes as well as its potential to manufacture a wide variety of homogeneous one-, two-, or three-dimensional nanostructures. This method combines the advantages of both top-down and bottom-up approaches and is based on a two-step process: (1) the preparation of a colloidal crystal mask (CCM) made of nanospheres and (2) the deposition of the desired material through the mask. The mask is then removed and the layer keeps the ordered patterning of the mask interstices. Many groups have been working to improve the quality of the CCMs. Throughout this review, we compare the major deposition techniques to manufacture the CCMs (focusing on 2D polystyrene nanospheres lattices), with respect to their advantages and drawbacks. In traditional NSL, the pattern is usually limited to triangular structures. However, new strategies have been developed to build up more complex architectures and will also be discussed.

scholarly journals 50 nm Scale Alignment Method for Hybrid Manufacturing Processes for Full 3D Structuring

2020 ◽  
Vol 21 (12) ◽  
pp. 2407-2417
Author(s):  
Ki-Hwan Jang ◽  
Hae-Sung Yoon ◽  
Hyun-Taek Lee ◽  
Eunseob Kim ◽  
Sung-Hoon Ahn
Keyword(s):  
Focused Ion Beam ◽  
Ion Beam ◽  
Three Dimensional ◽  
Research Area ◽  
Manufacturing Processes ◽  
Alignment Error ◽  
Alignment Method ◽  
Major Research ◽  
Hybrid Processes

AbstractIn micro-/nano-scale, multi-material three-dimensional (3D), structuring has been a major research area for making various applications. To overcome dimensional and material limitations, several hybrid processes have been proposed. The hybrid processes were performed in the same or different numerically controlled stages. If the stages differed, the substrate was moved and locked to the stage before fabrication. During the locking, alignment error occurred. This error became problematic because this significantly compromised the quality of final structures. Here, an alignment method for a hybrid process consisted of a focused ion beam milling, aerodynamically focused nanoparticle printing, and micro-machining was developed. Two sets of collinear marks were placed at the edges of the substrate. Rotational and translational errors were calculated and compensated using the marks. Processes having different scales were bridged through this alignment method. Various materials were utilized, and accuracy was less than 50 nm when the length of the substrate was less than 13 mm. The alignment method was employed to fabricate a V-shaped structure and step-shaped structure using polymer, ceramic, and metal.

scholarly journals Multiscale Analysis of Mechanical Properties of 3D Orthogonal Woven Composites with Randomly Distributed Voids

Materials ◽  
2021 ◽  
Vol 14 (18) ◽  
pp. 5247
Author(s):  
Yaohua Gong ◽  
Tao Huang ◽  
Xun’an Zhang ◽  
Yongyong Suo ◽  
Purong Jia ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Multiscale Analysis ◽  
Three Dimensional ◽  
Woven Composites ◽  
Manufacturing Processes ◽  
Design Basis ◽  
Void Defects ◽  
3D Woven Composites ◽  
3D Orthogonal Woven

Voids are common defects in 3D woven composites because of the complicated manufacturing processes of the composites. In this study, a micro–meso multiscale analysis was conducted to evaluate the influence of voids on the mechanical properties of three-dimensional orthogonal woven composites. Statistical analysis was implemented to calculate the outputs of models under the different scales. A method is proposed to generate the reasonable mechanical properties of the microscale models considering randomly distributed voids and fiber filaments. The distributions of the generated properties agree well with the calculated results. These properties were utilized as inputs for the mesoscale models, in which void defects were also considered. The effects of these defects were calculated and investigated. The results indicate that tensile and shear strengths were more sensitive to the microscale voids, while the compressive strength was more influenced by mesoscale voids. The results of this study can provide a design basis for evaluating the quality of 3D woven composites with void defects.

Scanning Electron Microscopy in Hybrid Microelectronics

1976 ◽  
Vol 34 ◽  
pp. 456-457
Author(s):  
S. Khadpe ◽  
R. Faryniak
Keyword(s):  
Integrated Circuits ◽  
Thick Film ◽  
Integrated Circuit ◽  
Failure Modes ◽  
Three Dimensional ◽  
Circuit Components ◽  
Hybrid Microcircuit ◽  
Electrical Connections ◽  
Scanning Electron

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.

Semi-automated methods for 3-D reconstruction of macromolecular complexes

1995 ◽  
Vol 53 ◽  
pp. 42-43
Author(s):  
B. Carragher ◽  
M. Whittaker
Keyword(s):  
Three Dimensional ◽  
Time Saving ◽  
Macromolecular Complexes ◽  
Symmetry Properties ◽  
Dimensional Reconstruction ◽  
Experienced Operator ◽  
Projection Images ◽  
The Individual ◽  
Natural Symmetry

Techniques for three-dimensional reconstruction of macromolecular complexes from electron micrographs have been successfully used for many years. These include methods which take advantage of the natural symmetry properties of the structure (for example helical or icosahedral) as well as those that use single axis or other tilting geometries to reconstruct from a set of projection images. These techniques have traditionally relied on a very experienced operator to manually perform the often numerous and time consuming steps required to obtain the final reconstruction. While the guidance and oversight of an experienced and critical operator will always be an essential component of these techniques, recent advances in computer technology, microprocessor controlled microscopes and the availability of high quality CCD cameras have provided the means to automate many of the individual steps.During the acquisition of data automation provides benefits not only in terms of convenience and time saving but also in circumstances where manual procedures limit the quality of the final reconstruction.

Towards Predicting Relative Belt Edge Endurance With the Finite Element Method

1990 ◽  
Vol 18 (4) ◽  
pp. 216-235 ◽  
Author(s):  
J. De Eskinazi ◽  
K. Ishihara ◽  
H. Volk ◽  
T. C. Warholic
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Three Dimensional ◽  
The Finite Element Method ◽  
Shear Deformations ◽  
Element Analysis ◽  
Vertical Loading ◽  
Predicted Values ◽  
Element Method

Abstract The paper describes the intention of the authors to determine whether it is possible to predict relative belt edge endurance for radial passenger car tires using the finite element method. Three groups of tires with different belt edge configurations were tested on a fleet test in an attempt to validate predictions from the finite element results. A two-dimensional, axisymmetric finite element analysis was first used to determine if the results from such an analysis, with emphasis on the shear deformations between the belts, could be used to predict a relative ranking for belt edge endurance. It is shown that such an analysis can lead to erroneous conclusions. A three-dimensional analysis in which tires are modeled under free rotation and static vertical loading was performed next. This approach resulted in an improvement in the quality of the correlations. The differences in the predicted values of various stress analysis parameters for the three belt edge configurations are studied and their implication on predicting belt edge endurance is discussed.

An Overview of 300 mm SOI Starting Wafer Quality and Its Yield Detractors

2005 ◽  
Author(s):  
Pei Y. Tsai ◽  
Junedong Lee ◽  
Paul Ronsheim ◽  
Lindsay Burns ◽  
Richard Murphy ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Device Fabrication ◽  
Sampling Plan ◽  
Silicon On Insulator ◽  
Manufacturing Processes ◽  
Circuit Performance ◽  
Characterization Techniques ◽  
Wafer Manufacturing

Abstract A stringent sampling plan is developed to monitor and improve the quality of 300mm SOI (silicon on insulator) starting wafers procured from the suppliers. The ultimate goal is to obtain the defect free wafers for device fabrication and increase yield and circuit performance of the semiconductor integrated circuits. This paper presents various characterization techniques for QC monitor and examples of the typical defects attributed to wafer manufacturing processes.

scholarly journals New Orthophoto Generation Strategies from UAV and Ground Remote Sensing Platforms for High-Throughput Phenotyping

2021 ◽  
Vol 13 (5) ◽  
pp. 860
Author(s):  
Yi-Chun Lin ◽  
Tian Zhou ◽  
Taojun Wang ◽  
Melba Crawford ◽  
Ayman Habib
Keyword(s):  
Remote Sensing ◽  
Control Strategies ◽  
Target Function ◽  
Canopy Cover ◽  
Surface Model ◽  
Flowering Date ◽  
Sensing Platforms ◽  
Geolocation Accuracy ◽  
New Strategies

Remote sensing platforms have become an effective data acquisition tool for digital agriculture. Imaging sensors onboard unmanned aerial vehicles (UAVs) and tractors are providing unprecedented high-geometric-resolution data for several crop phenotyping activities (e.g., canopy cover estimation, plant localization, and flowering date identification). Among potential products, orthophotos play an important role in agricultural management. Traditional orthophoto generation strategies suffer from several artifacts (e.g., double mapping, excessive pixilation, and seamline distortions). The above problems are more pronounced when dealing with mid- to late-season imagery, which is often used for establishing flowering date (e.g., tassel and panicle detection for maize and sorghum crops, respectively). In response to these challenges, this paper introduces new strategies for generating orthophotos that are conducive to the straightforward detection of tassels and panicles. The orthophoto generation strategies are valid for both frame and push-broom imaging systems. The target function of these strategies is striking a balance between the improved visual appearance of tassels/panicles and their geolocation accuracy. The new strategies are based on generating a smooth digital surface model (DSM) that maintains the geolocation quality along the plant rows while reducing double mapping and pixilation artifacts. Moreover, seamline control strategies are applied to avoid having seamline distortions at locations where the tassels and panicles are expected. The quality of generated orthophotos is evaluated through visual inspection as well as quantitative assessment of the degree of similarity between the generated orthophotos and original images. Several experimental results from both UAV and ground platforms show that the proposed strategies do improve the visual quality of derived orthophotos while maintaining the geolocation accuracy at tassel/panicle locations.

Effect of post‐processing treatments on the quality of three‐dimensional printed rice starch constructs

2021 ◽  
Author(s):  
Radhika Theagarajan ◽  
Shubham Nimbkar ◽  
Jeyan Arthur Moses ◽  
Chinnaswamy Anandharamakrishnan
Keyword(s):  
Three Dimensional ◽  
Rice Starch ◽  
Post Processing

Research on the Reliability of Box for Gear Test Bed

2011 ◽  
Vol 121-126 ◽  
pp. 1744-1748
Author(s):  
Xiang Yang Jin ◽  
Tie Feng Zhang ◽  
Li Li Zhao ◽  
He Teng Wang ◽  
Xiang Yi Guan
Keyword(s):  
Power Flow ◽  
Dynamic Performance ◽  
Three Dimensional ◽  
Design Parameters ◽  
The Finite Element Method ◽  
Test Bed ◽  
Kinematics Simulation ◽  
Beveloid Gears ◽  
Overall Performance

To determine the efficiency, load-bearing capacity and fatigue life of beveloid gears with intersecting axes, we design a mechanical gear test bed with closed power flow. To test the quality of its structure and predict its overall performance, we establish a three-dimensional solid model for various components based on the design parameters and adopt the technology of virtual prototyping simulation to conduct kinematics simulation on it. Then observe and verify the interactive kinematic situation of each component. Moreover, the finite element method is also utilized to carry out structural mechanics and dynamics analysis on some key components. The results indicate that the test bed can achieve the desired functionality, and the static and dynamic performance of some key components can also satisfy us.

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