scholarly journals Application of Thermal Network Model to Transient Thermal Analysis of Power Electronic Package Substrate

2011 ◽  
Vol 2011 ◽  
pp. 1-8 ◽  
Author(s):  
Masaru Ishizuka ◽  
Tomoyuki Hatakeyama ◽  
Yuichi Funawatashi ◽  
katsuhiro Koizumi
Keyword(s):  
Thermal Analysis ◽  
Transport Model ◽  
Design Tool ◽  
Thermal Design ◽  
Multichip Modules ◽  
Transient Thermal Analysis ◽  
Thermal Network ◽  
Network Method ◽  
Thermal Network Method ◽  
Transient Thermal

In recent years, there is a growing demand to have smaller and lighter electronic circuits which have greater complexity, multifunctionality, and reliability. High-density multichip packaging technology has been used in order to meet these requirements. The higher the density scale is, the larger the power dissipation per unit area becomes. Therefore, in the designing process, it has become very important to carry out the thermal analysis. However, the heat transport model in multichip modules is very complex, and its treatment is tedious and time consuming. This paper describes an application of the thermal network method to the transient thermal analysis of multichip modules and proposes a simple model for the thermal analysis of multichip modules as a preliminary thermal design tool. On the basis of the result of transient thermal analysis, the validity of the thermal network method and the simple thermal analysis model is confirmed.

Practical Study of Application of Thermal Network Method to Thermal Design of Electronic Equipment: An Example for the Thermal Design of a Compact Self-Ballasted Fluorescent Lamp

2006 ◽  
Author(s):  
Masaru Ishizuka ◽  
Shinji Nakagawa ◽  
Katsuhiro Koizumi
Keyword(s):  
Network Model ◽  
Simulation Method ◽  
Thermal Design ◽  
Fluorescent Lamp ◽  
Simulated Model ◽  
Thermal Network ◽  
Fluorescent Lamps ◽  
Network Method ◽  
Thermal Network Method ◽  
Good Agreement

Thermal design is one of the most important issues in the development of compact self—ballasted fluorescent lamps as the demand for small yet powerful lamps is mounting. This paper proposes a simulation method that is based on a thermal network model for which a set of equations are developed. Some of the coefficients of the thermal network equations were determined experimentally using a simulated model lamp. The calculated temperatures are in good agreement with the measured temperatures. The work illustrates the usefulness of the proposed methodology in the design of compact self—ballasted fluorescent lamps.

A Temperature Field Model of Complicated Thermal Analysis System Based on Thermal Network Method

2013 ◽  
Vol 694-697 ◽  
pp. 695-698 ◽  
Author(s):  
Ze Jin Lin ◽  
Jie Hong Yuan ◽  
Yuan Li ◽  
Xi Jie Yan ◽  
Shi Ming Zhou ◽  
...  
Keyword(s):  
Thermal Analysis ◽  
Temperature Field ◽  
Transient Temperature ◽  
Thermal Network ◽  
Heat Transfer Theory ◽  
Steady State Temperature ◽  
Network Method ◽  
Temperature Field Model ◽  
Thermal Network Method ◽  
Analysis System

Based on the thermal network method and heat transfer theory, a temperature field simulation model of complicated thermal analysis system was established by Matlab Simulink. Based on the model, a steady-state temperature field of a helicopter tail reducer was calculated in the normal lubrication. The model is more accurate and reliable than the traditional algorithm. Meanwhile, the model can calculate the time-varying process of the temperature field, corresponding to the transient temperature field.

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