scholarly journals New Type Far IR and THz Schottky Barrier Detectors for Scientific and Civil Application

2011 ◽  
Vol 2011 ◽  
pp. 1-6 ◽  
Author(s):  
V. G. Ivanov ◽  
G. V. Ivanov

The results of an experimental investigation into a new type of VLWIR detector based on hot electron gas emission and architecture of the detector are presented and discussed. The detectors (further referred to as HEGED) take advantage of the thermionic emission current change effect in a semiconductor diode with a Schottky barrier (SB) as a result of the direct transfer of the absorbed radiation energy to the system of electronic gas in the quasimetallic layer of the barrier. The possibility of detecting radiation having the energy of quantums less than the height of the Schottky diode potential barrier and of obtaining a substantial improvement of a cutoff wavelength to VLWIR of the PtSi/Si detector has been demonstrated. The complementary contribution of two physical mechanisms of emanation detection—“quantum” and hot electrons gas emission—has allowed the creation of a superwideband IR detector using standard silicon technology.

2009 ◽  
Vol 23 (05) ◽  
pp. 765-771
Author(s):  
H. ESHGHI ◽  
M. MOHAMMADI

In this paper, the effect of porosity on reverse bias current–voltage characteristics of PtSi/por - Si (p-type) IR detector as a function of temperature is investigated. Our experimental data for two samples with different porosities (50% and 10%) at 300 K and 77 K are reported by Raissi et al.1 These data indicates a breakdown-like behavior. Our analytical model is based on hole thermionic emission with large ideality factor (n ≈ 200). Our calculations show that at each temperature, the Schottky barrier height, as well as the ideality factor, in sample with 10% porosity is bigger than that of 50%. These variations could be due to band gap variations of Si size effect using quantum dot model, and the presence of the relatively high (~1015 cm-2 eV-1) density of states at the silicide/por-silicon interface, respectively.


1996 ◽  
Author(s):  
Tietun Sun ◽  
Li Hui Guo
Keyword(s):  

2008 ◽  
Vol 22 (14) ◽  
pp. 2309-2319 ◽  
Author(s):  
K. ERTURK ◽  
M. C. HACIISMAILOGLU ◽  
Y. BEKTORE ◽  
M. AHMETOGLU

The electrical characteristics of Cr / p – Si (100) Schottky barrier diodes have been measured in the temperature range of 100–300 K. The I-V analysis based on thermionic emission (TE) theory has revealed an abnormal decrease of apparent barrier height and increase of ideality factor at low temperature. The conventional Richardson plot exhibits non-linearity below 200 K with the linear portion corresponding to activation energy 0.304 eV and Richardson constant (A*) value of 5.41×10-3 Acm-2 K -2 is determined from the intercept at the ordinate of this experimental plot, which is much lower than the known value of 32 Acm-2 K -2 for p-type Si . It is demonstrated that these anomalies result due to the barrier height inhomogeneities prevailing at the metal-semiconductor interface. Hence, it has been concluded that the temperature dependence of the I-V characteristics of the Cr/p – Si Schottky barrier diode can be successfully explained on the basis of TE mechanism with a Gaussian distribution of the barrier heights. Furthermore, the value of the Richardson constant found is much closer than that obtained without considering the inhomogeneous barrier heights.


1993 ◽  
Vol 300 ◽  
Author(s):  
Thomas Clausen ◽  
Otto Leistiko

ABSTRACTThe limiting transport processes for current flow across metal-semiconductor (MS) ohmic contacts to n- and p-type InP have been investigated for Au-based metallizations containing the doping elements Germanium and Zinc. It has been found that the Schottky barrier is lowered and in some cases vanishes during annealing. The current flow for an optimal ohmic contact is diffusion limited by a Fermi potential difference between the alloyed metallization and the bulk InP. For non-optimal ohmic contacts the current flow is also limited by thermionic emission across a low effective Schottky barrier.


2005 ◽  
Vol 886 ◽  
Author(s):  
Ali Shakouri ◽  
Z. Bian ◽  
R. Singh ◽  
Y. Zhang ◽  
D. Vashaee ◽  
...  

ABSTRACTA brief overview of the research activities at the Thermionic Energy Conversion (TEC) Center is given. The goal is to achieve direct thermal to electric energy conversion with >20% efficiency and >1W/cm2 power density at a hot side temperature of 300–650C. Thermionic emission in both vacuum and solid-state devices is investigated. In the case of solid-state devices, hot electron filtering using heterostructure barriers is used to increase the thermoelectric power factor. In order to study electron transport above the barriers and lateral momentum conservation in thermionic emission process, the current-voltage characteristic of ballistic transistor structures is investigated. Embedded ErAs nanoparticles and metal/semiconductor multilayers are used to reduce the lattice thermal conductivity. Cross-plane thermoelectric properties and the effective ZT of the thin film are analyzed using the transient Harman technique. Integrated circuit fabrication techniques are used to transfer the n- and p-type thin films on AlN substrates and make power generation modules with hundreds of thin film elements. For vacuum devices, nitrogen-doped diamond and carbon nanotubes are studied for emitters. Sb-doped highly oriented diamond and low electron affinity AlGaN are investigated for collectors. Work functions below 1.6eV and vacuum thermionic power generation at temperatures below 700C have been demonstrated.


2009 ◽  
Vol 1230 ◽  
Author(s):  
Hyuk Park ◽  
J.M. Zuo

AbstractUnderstanding interaction of ultrafast pulsed laser with matter is critical for probing ultrafast processes in materials science, understanding the physics of laser ablation and the laser induced non-equilibrium carrier dynamics in metals and semiconductors, including plasmonics. When an intense laser pulse of femtoseconds (fs) in duration hits the surface of a targeted matter, it excites a hot electron gas. Part of the hot electrons is emitted from the surface in a way similar to thermionic emission. Electrons can also be emitted through multiphoton photoemission (MPPE) or thermally assisted MPPE. The emitted electrons travel at speeds that create transient electric fields (TEFs). To detect TEFs and study the dynamics of emitted electrons, we have developed a time resolved electron beam imaging technique that allows us to measure TEFs above a sample surface at picoseconds time resolution. We have also developed a model of the TEFs based on the propagation of emitted electrons and the percentage of electrons escaping from the surface. We examine the significance of TEFs for ultrafast reflection electron diffraction by examining anomalous effects in ultrafast reflection high energy electron diffraction (RHEED) of silicon surfaces.


2012 ◽  
Vol 90 (1) ◽  
pp. 73-81 ◽  
Author(s):  
V. Lakshmi Devi ◽  
I. Jyothi ◽  
V. Rajagopal Reddy

In this work, we have investigated the electrical characteristics of Au–Cu–n-InP Schottky contacts by current–voltage (I–V) and capacitance–voltage (C–V) measurements in the temperature range 260–420 K in steps of 20 K. The diode parameters, such as the ideality factor, n, and zero-bias barrier height, Φb0, have been found to be strongly temperature dependent. It has been found that the zero-bias barrier height, Φb0(I–V), increases and the ideality factor, n, decreases with an increase in temperature. The forward I–V characteristics are analyzed on the basis of standard thermionic emission (TE) theory and the assumption of gaussian distribution of barrier heights, due to barrier inhomogeneities that prevail at the metal–semiconductor interface. The zero-bias barrier height Φb0 versus 1/2kT plot has been drawn to obtain the evidence of a gaussian distribution of the barrier heights. The corresponding values are Φb0 = 1.16 eV and σ0 = 159 meV for the mean barrier height and standard deviation, respectively. The modified Richardson plot has given mean barrier height, Φb0, and Richardson constant, A**, as 1.15 eV and 7.34 Acm−2K−2, respectively, which is close to the theoretical value of 9.4 Acm−2K−2. Barrier heights obtained from C–V measurements are higher than those obtained from I–V measurements. This inconsistency between Schottky barrier heights (SBHs) obtained from I–V and C–V measurements was also interpreted. The temperature dependence of the I–V characteristics of the Au–Cu–n-InP Schottky diode has been explained on the basis of TE mechanism with gaussian distribution of the SBHs.


1995 ◽  
Vol 378 ◽  
Author(s):  
A. Singh ◽  
N. Marcano

AbstractAl/n-GaAs Schottky barrier type diode was fabricated by thermal deposition of Al on chemically etched polished surface of (100) n-GaAs at a pressure of 4×10−6 Torr. Back ohmic contact to n-GaAs was prepared by thermal deposition of In, followed by a 90 min. anneal in Ar atmosphere at 390° C. The C−2 vs V characteristics were quite linear for reverse bias voltages in the range 0-4 V. Over the temperature range 300–360 K, the values of the barrier height and the net carrier density (Nd-Na), obtained from the C−2-V data, were in the range 1.33–1.26 V and 4.3×l0−16-5.0×l0−16 cm−3, respectively. The forward I-V data over the temperature range 300–400 K, indicated that the electrical current across the Al/n-GaAs Schottky junction was transported by the mechanisms of generation-combination (GR) in the space charge, thermionic emission (TE) and ohmic leak current. A value of (1.20±0.04) V for the zero bias barrier height was deduced from the temperature dependence of the TE reverse saturation current. The barrier height deduced from the I-V data was practically independent of temperature. The 20% change in Nd-Na with temperature, obtained from the C-V data, and important contributions of the GR and leak currents to the total forward current, suggested the presence of defect levels in the surface space charge layer in n-GaAs, which may be responsible for the discrepancy in the values of the barrier height obtained from the I-V and C-V data.


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