An Analytic Expression of Thermal Diffusion Coefficient for the Hydrodynamic Simulation of Semiconductor Devices

A new analytical expression of thermal diffusion coefficient DT is derived. To the firstorder approximation, it is given by (1+η)-1(D/Tn) rather than (1–η)(D/Tn) where η=–(Tn/η*)(∂η*/∂Tn ) and η* represents the temperature-dependent bulk mobility. This new transport coefficient is implemented in our 2-D hydrodynamic device simulator and it seems to produce more reasonable results.