X-ray diffraction is used in combination with tensile testing for measuring elastic properties of metallic thin films. Size effect, elastic anisotropy and grain morphologies are considered in all these experiments and supported by different kind of numerical simulations operating at different length scales. Such instrumental studies are time consuming even if synchrotron sources are used. New experiments are under progress for reducing acquisition data and improving precision on strain measurements. After introducing briefly the main principles and results of our techniques, first promising measurements on nanometric W/Cu multilayers using 2D CCD detectors and high monochromatic flux at the Advanced Light Source Berkeley (USA) on beam line 11.3.1 are presented. In addition, simulation experiments for analyzing elasticity in textured gold film are discussed.
Abstract
We present a MEMS-based technique for in-situ uniaxial tensile testing of freestanding thin films inside SEM and TEM. It integrates a freestanding thin film specimen with MEMS force sensors and structures to produce an on-chip tensile testing facility. Cofabrication of the specimen with force and displacement measuring mechanisms produces the following unique features: 1) Quantitative experimentation can be carried out in both SEM and TEM, 2) No extra gripping mechanism is required, 3) Specimen misalignment can be eliminated, 4) Pre-stress in specimen can be determined, and 5) Specimens with micrometer to nanometer thickness can be tested. We demonstrate the technique by testing a 200-nanometer thick Aluminum specimen in-situ in SEM. Significant strengthening and anelasticity were observed at this size scale.
Strains, Stresses and Elastic Properties in Polycrystalline Metallic Thin Films: In Situ Deformation Combined with X-Ray Diffraction and Simulation Experiments