Cleaning and Passivation of Copper Surface Using N2H4, and Self-Assembled Monolayers for Area-Selective Atomic Layer Deposition (AS-ALD) Applications
2016 ◽
Vol 3
(21)
◽
pp. 1600464
◽
2016 ◽
Vol 34
(1)
◽
pp. 01A107
◽