Copper Rich Cu1-xNix Alloys (0.05 < x < 0.15) Electrodeposited from Acid Sulfate-Based Electrolyte with Benzotriazole Additive for Microbump Metallization for 3D Stacked Integrated Circuits
2012 ◽
Vol 28
(1)
◽
pp. 13-14
◽
An effective and efficient numerical method for thermal management in 3D stacked integrated circuits
2017 ◽
Vol 121
◽
pp. 200-209
◽
Keyword(s):
Keyword(s):