Fabrication and Thermo-Mechanical Characterization of Fine Pitch All-Copper Interconnect

2012 ◽  
Vol 159 (9) ◽  
pp. D532-D537 ◽  
Author(s):  
Rajarshi Saha ◽  
Hyo-Chol Koo ◽  
Ping Nicole An ◽  
Paul A. Kohl
Keyword(s):  
Mechanical Characterization ◽  
Copper Interconnect ◽  
Fine Pitch

FEM Simulation of the Thermo-Mechanical Behavior of TSV 3D MEMS Structure

2013 ◽  
Vol 562-565 ◽  
pp. 108-113 ◽  
Author(s):  
Xin Gong ◽  
Jing Chen ◽  
Jong Ho Lee
Keyword(s):  
Mechanical Behavior ◽  
Mechanical Characteristics ◽  
Mechanical Characterization ◽  
Fem Simulation ◽  
Critical Issue ◽  
Fine Pitch

As pitch of TSV shrinks down, mechanical characteristics of TSVs become more complicated and the heat of chip becomes a critical issue. The objective of this paper is to study thermal mechanical characteristics of ultra-fine pitch TSV. The thermal-mechanical characterization of an ultra-fine pitch chip is simulated with FEA.

Experimental Characterization of the Reliability of 3-Terminal Dual-Damascene Copper Interconnect Trees

2002 ◽  
Vol 716 ◽  
Author(s):  
C. L. Gan ◽  
C. V. Thompson ◽  
K. L. Pey ◽  
W. K. Choi ◽  
F. Wei ◽  
...  
Keyword(s):  
Stress Conditions ◽  
Experimental Characterization ◽  
Contact Lines ◽  
Tree Structures ◽  
Similar Test ◽  
Dual Damascene ◽  
Copper Interconnect ◽  
Test Conditions

AbstractElectromigration experiments have been carried out on simple Cu dual-damascene interconnect tree structures consisting of straight via-to-via (or contact-to-contact) lines with an extra via in the middle of the line. As with Al-based interconnects, the reliability of a segment in this tree strongly depends on the stress conditions of the connected segment. Beyond this, there are important differences in the results obtained under similar test conditions for Al-based and Cu-based interconnect trees. These differences are thought to be associated with variations in the architectural schemes of the two metallizations. The absence of a conducting electromigrationresistant overlayer in Cu technology, and the possibility of liner rupture at stressed vias lead to significant differences in tree reliabilities in Cu compared to Al.

Spectro-mechanical Characterization of Aromaticity and Maturity of Kerogens in Oil Shale at 6 nm Spatial Resolution

2018 ◽  
Author(s):  
Devon Jakob ◽  
Le Wang ◽  
Haomin Wang ◽  
Xiaoji Xu
Keyword(s):  
Spatial Resolution ◽  
Oil Shale ◽  
Infrared Imaging ◽  
Mechanical Characterization ◽  
Optical Diffraction ◽  
Chemical Compositions ◽  
Valuable Insight ◽  
Eagle Ford Shale

<p>In situ measurements of the chemical compositions and mechanical properties of kerogen help understand the formation, transformation, and utilization of organic matter in the oil shale at the nanoscale. However, the optical diffraction limit prevents attainment of nanoscale resolution using conventional spectroscopy and microscopy. Here, we utilize peak force infrared (PFIR) microscopy for multimodal characterization of kerogen in oil shale. The PFIR provides correlative infrared imaging, mechanical mapping, and broadband infrared spectroscopy capability with 6 nm spatial resolution. We observed nanoscale heterogeneity in the chemical composition, aromaticity, and maturity of the kerogens from oil shales from Eagle Ford shale play in Texas. The kerogen aromaticity positively correlates with the local mechanical moduli of the surrounding inorganic matrix, manifesting the Le Chatelier’s principle. In situ spectro-mechanical characterization of oil shale will yield valuable insight for geochemical and geomechanical modeling on the origin and transformation of kerogen in the oil shale.</p>

MECHANICAL CHARACTERIZATION OF POLYMER MATERIALS UNDER LOW STRAIN RATE LOADING

2017 ◽  
Vol 5 (3) ◽  
pp. 8
Author(s):  
KUMAR DINESH ◽  
KAUR ARSHDEEP ◽  
AGGARWAL YUGAM KUMAR ◽  
UNIYAL PIYUSH ◽  
KUMAR NAVIN ◽  
...  
Keyword(s):  
Strain Rate ◽  
Mechanical Characterization ◽  
Polymer Materials ◽  
Strain Rate Loading ◽  
Low Strain Rate

MECHANICAL CHARACTERIZATION OF VEGETAL COMPOSITES USING DIC

2019 ◽  
Author(s):  
Alexandre Luiz Pereira ◽  
Rafael Oliveira Santos ◽  
DOINA BANEA ◽  
Álisson Lemos
Keyword(s):  
Mechanical Characterization
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