Thermal Expansion and Thermal Stress Behavior of Electroless-Plated Fe–Ni–B Alloy Thin Film for High-Density Packaging

2018 ◽  
Vol 166 (1) ◽  
pp. D3238-D3245 ◽  
Author(s):  
Takayo Yamamoto ◽  
Tomio Nagayama ◽  
Toshihiro Nakamura
Keyword(s):  
Thin Film ◽  
Thermal Expansion ◽  
Thermal Stress ◽  
High Density ◽  
Alloy Thin Film ◽  
Stress Behavior ◽  
High Density Packaging

Development of Ag Alloy Thin Film With Both High Reflectance and Adhesion for High Density Opt-Electronic Module

2007 ◽  
Vol 30 (2) ◽  
pp. 302-308 ◽  
Author(s):  
Akihiro Kuroda ◽  
Ryohei Satoh ◽  
Yoshiharu Iwata ◽  
Koichi Yokota ◽  
Kozo Fujimoto ◽  
...  
Keyword(s):  
Thin Film ◽  
High Density ◽  
Alloy Thin Film ◽  
High Reflectance

Significant reduction in thermal expansion of a low-carbon steel sheet by depositing a Fe–Ni alloy thin film

2000 ◽  
Vol 15 (1) ◽  
pp. 14-16
Author(s):  
Sang Sub Kim ◽  
Yong Bum Park
Keyword(s):  
Thin Film ◽  
Thermal Expansion ◽  
Carbon Steel ◽  
Steel Sheet ◽  
Low Carbon Steel ◽  
Image Resolution ◽  
Alloy Thin Film ◽  
Low Carbon ◽  
Ni Alloy ◽  
Carbon Steel Sheet

A 3-μm-thick Fe–Ni alloy thin film was deposited on a 0.2-mm-thick low-carbon steel substrate by radio-frequency magnetron sputtering, and the properties of the film were investigated. The film exhibits a columnar growth structure and a fiber texture with the relationship of (110)film//(111)substrate. A thermal cycle test showed good adhesion between the film and the substrate. Most importantly, the Fe–Ni alloy deposition results in a significant reduction in thermal expansion of the whole specimen. These results suggest that a properly deposited Fe–Ni alloy film could be applied to a low-carbon steel sheet to significantly reduce its thermal expansion. Such reduced thermal expansion would enhance the image resolution of a shadow mask made of a low-carbon steel sheet.

A Technique for Deducing In-Plane Modulus and Coefficient of Thermal Expansion of a Supported Thin Film

2002 ◽  
Vol 124 (2) ◽  
pp. 274-277 ◽  
Author(s):  
Martin Y. M. Chiang ◽  
Chwan K. Chiang ◽  
Wen-li Wu
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Thermal Expansion ◽  
Thermal Stress ◽  
Elastic Modulus ◽  
Coefficient Of Thermal Expansion ◽  
Thermal And Mechanical Properties ◽  
Reduction Scheme ◽  
Coupled Equations

A technique for determining the in-plane modulus and the coefficient of thermal expansion (CTE) of supported thin films has been developed. The modulus and CTE are calculated by solving two coupled equations that relate the curvature of film samples deposited on two different substrates to the thermal and mechanical properties of the constituents. In contrast with the conventional method used to calculate modulus and CTE, which involves differentiation of the thermal stress in the film, this new technique does not require the differentiation of the thermal stress, and can also provide the temperature-dependence of the in-plane CTE and elastic modulus of supported thin films. The data reduction scheme used for deducing CTE and elastic modulus is direct and reliable.

Fabrication and Performance Investigation of Karma Alloy Thin Film Strain Gauge

2021 ◽  
Author(s):  
Peng Lei ◽  
Congchun Zhang ◽  
Yawen Pang ◽  
Shenyong Yang ◽  
Meiju Zhang
Keyword(s):  
Thin Film ◽  
Strain Gauge ◽  
Alloy Thin Film ◽  
And Performance

scholarly journals Out-of-Plane Thermal Expansion Coefficient and Biaxial Young’s Modulus of Sputtered ITO Thin Films

Coatings ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 153
Author(s):  
Chuen-Lin Tien ◽  
Tsai-Wei Lin
Keyword(s):  
Thin Films ◽  
Thermal Expansion ◽  
Thermal Stress ◽  
Young’S Modulus ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Young's Modulus ◽  
Heating Temperature ◽  
Glass Substrates ◽  
Ito Thin Films

This paper proposes a measuring apparatus and method for simultaneous determination of the thermal expansion coefficient and biaxial Young’s modulus of indium tin oxide (ITO) thin films. ITO thin films simultaneously coated on N-BK7 and S-TIM35 glass substrates were prepared by direct current (DC) magnetron sputtering deposition. The thermo-mechanical parameters of ITO thin films were investigated experimentally. Thermal stress in sputtered ITO films was evaluated by an improved Twyman–Green interferometer associated with wavelet transform at different temperatures. When the heating temperature increased from 30 °C to 100 °C, the tensile thermal stress of ITO thin films increased. The increase in substrate temperature led to the decrease of total residual stress deposited on two glass substrates. A linear relationship between the thermal stress and substrate heating temperature was found. The thermal expansion coefficient and biaxial Young’s modulus of the films were measured by the double substrate method. The results show that the out of plane thermal expansion coefficient and biaxial Young’s modulus of the ITO film were 5.81 × 10−6 °C−1 and 475 GPa.

scholarly journals Unravelling thermal stress due to thermal expansion mismatch in metal–organic frameworks for methane storage

2021 ◽  
Author(s):  
Jelle Wieme ◽  
Veronique Van Speybroeck
Keyword(s):  
Thermal Expansion ◽  
Thermal Stress ◽  
Pressure Coefficient ◽  
Metal Organic Frameworks ◽  
Methane Storage ◽  
Thermal Expansion Mismatch ◽  
Thermal Pressure ◽  
Temperature Changes ◽  
Metal Organic ◽  
The Impact

Thermal stress is present in metal–organic frameworks undergoing temperature changes during adsorption and desorption. We computed the thermal pressure coefficient as a proxy for this phenomenon and discuss the impact of thermal expansion mismatch.

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