Effect of Convection-Dependent Adsorption of Additives on Microvia Filling in an Acidic Copper Plating Solution

2012 ◽  
Vol 159 (3) ◽  
pp. D135-D141 ◽  
Author(s):  
Su-Mei Huang ◽  
Cheng-Wei Liu ◽  
Wei-Ping Dow
Keyword(s):  
Copper Plating ◽  
Plating Solution

Synergistic Effect of Different Additives on Microvia Filling in an Acidic Copper Plating Solution

2016 ◽  
Vol 163 (8) ◽  
pp. D379-D384 ◽  
Author(s):  
Zhihua Tao ◽  
Wei He ◽  
Shouxu Wang ◽  
Xuemei He ◽  
Cheng Jiao ◽  
...  
Keyword(s):  
Synergistic Effect ◽  
Copper Plating ◽  
Plating Solution

The Research about EDTA Plating Solutions of Non-Cyanide Copper Plating

2012 ◽  
Vol 472-475 ◽  
pp. 2795-2800
Author(s):  
Ren Chun Fu ◽  
Zhong Cheng Guo ◽  
Wei Min Zhou ◽  
Zhen Chen
Keyword(s):  
Current Efficiency ◽  
Complexing Agent ◽  
Copper Plating ◽  
Cathodic Current ◽  
Throwing Power ◽  
Cathodic Current Efficiency ◽  
Plating Solution ◽  
Better Than ◽  
Covering Power

Six formulae of plating solution were studyed in the experiment. The first formula was cyanide plating solutions. The others formulae based on the EDTA as primary complexing agent, C6H5O7K3•H2O and KNaC4H4O6•4H2O as auxiliary complexing agent. Bath quality of the six formulae were examined and Compared. The results show that the EDTA system improve the ability of throwing power, covering power, current efficiency and reduce the bath voltage. In some ways, the performance of EDTA system were better than cyanide plating solutions, such as the deep plating ability, dispersing power, cathodic current efficiency.

scholarly journals Applying Copper-Ball Dissolution for Prolonging Life of Electroless-Copper-Plating Solution

2016 ◽  
Vol 9 (0) ◽  
pp. E16-001-1-E16-001-10
Author(s):  
Hiroshi Kanemoto ◽  
Toshinori Kawamura ◽  
Takeyuki Itabashi ◽  
Tomoyuki Miyazaki ◽  
Yoshihisa Kaneko
Keyword(s):  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper ◽  
Plating Solution

scholarly journals Determination of formaldehyde in electroless copper plating solution by potentiometric titration.

1990 ◽  
Vol 41 (4) ◽  
pp. 412-416
Author(s):  
Shozo MIZUMOTO ◽  
Hidemi NAWAFUNE ◽  
Motoo KAWASAKI ◽  
Akemi KINOSHITA ◽  
Ken ARAKI
Keyword(s):  
Potentiometric Titration ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper ◽  
Plating Solution
Sign in / Sign up

Export Citation Format

Share Document