Ultrathin (AlCrTaTiZr)N[sub x]/AlCrTaTiZr Bilayer Structures with High Diffusion Resistance for Cu Interconnects

2010 ◽  
Vol 157 (6) ◽  
pp. G154 ◽  
Author(s):  
Shou-Yi Chang ◽  
Dao-Sheng Chen
Keyword(s):  
Diffusion Resistance ◽  
Cu Interconnects ◽  
High Diffusion

scholarly journals Applications of High Diffusion Resistance Multi‐component AlCrTaTiZrRu/(AlCrTaTiZrRu)N 0.7 Film in Cu Interconnects

2020 ◽  
Vol 22 (11) ◽  
pp. 2000557
Author(s):  
Rongbin Li ◽  
Tongtong Chen ◽  
Chunxia Jiang ◽  
Jing Zhang ◽  
Yong Zhang ◽  
...  
Keyword(s):  
Diffusion Resistance ◽  
Cu Interconnects ◽  
High Diffusion

Characteristics of a 10nm-thick (TiVCr)N multi-component diffusion barrier layer with high diffusion resistance for Cu interconnects

2011 ◽  
Vol 205 (21-22) ◽  
pp. 5064-5067 ◽  
Author(s):  
Du-Cheng Tsai ◽  
Yen-Lin Huang ◽  
Sheng-Ru Lin ◽  
De-Ru Jung ◽  
Shou-Yi Chang ◽  
...  
Keyword(s):  
Barrier Layer ◽  
Diffusion Barrier ◽  
Diffusion Resistance ◽  
Cu Interconnects ◽  
High Diffusion ◽  
Diffusion Barrier Layer

Macromolecular Nutriend Limitations of Encapsulated Cells

1993 ◽  
Vol 331 ◽  
Author(s):  
Erik Einar Hancock ◽  
Linda Griffith Cima
Keyword(s):  
Diffusion Resistance ◽  
Encapsulated Cells ◽  
Term Function ◽  
High Diffusion

AbstractEncapsulated cells are likely to encounter transport limitations of trace nutrients carried by macromolecules due to a high diffusion resistance in the encapsulating membrane. We modeled the transport of transferrin to encapsulated cells and found that the transport limitation of transferrin is potentially significant in comparison to oxygen, which is limiting in unencapsulated tissue. Since transferrin is the primary biological iron carrier, deprivation of transferrin to encapsulated cells may limit long term function and viability in vivo.

Multi-component AlCrTaTiZrMo-nitride film with high diffusion resistance in copper metallization

2018 ◽  
Vol 748 ◽  
pp. 258-264 ◽  
Author(s):  
Rongbin Li ◽  
Bangwei Qiao ◽  
Hailong Shang ◽  
Jing Zhang ◽  
Chunxia Jiang ◽  
...  
Keyword(s):  
Copper Metallization ◽  
Nitride Film ◽  
Diffusion Resistance ◽  
High Diffusion

EIS study of the corrosion behavior of an organic coating applied on Algerian oil tanker

2020 ◽  
Vol 117 (6) ◽  
pp. 610
Author(s):  
Nadia Hammouda ◽  
Kamel Belmokre
Keyword(s):  
Corrosion Protection ◽  
Electrochemical Impedance ◽  
Paint Film ◽  
Organic Coating ◽  
Diffusion Resistance ◽  
Double Layer Capacitance ◽  
Carbon Steel Surface ◽  
Chloride Environment ◽  
Oil Tanker ◽  
Epoxy Paint

Organic coatings are widely employed in the corrosion protection of most metal surfaces, particularly steel. They provide a barrier against corrosive species present in the environment, due to their high resistance to oxygen, water and ions transport. This study focuses on the evaluation of corrosion protection performance of epoxy paint on the carbon steel surface in chloride environment (3% NaCl) by Electrochemical Impedance Spectroscopy (EIS). The electrochemical behavior of painted surface was estimated by EIS parameters that contained paint film resistance, paint film capacitance and double layer capacitance. On the basis of calculation using EIS spectrums it was observed that pore resistance (Rpore) decreased with the appearance of doubled layer capacitance (Cdl) due to the electrolyte penetration through the film. This was further confirmed by the decrease of diffusion resistance (Rd) which was also the indicator of the deterioration of paint film protectiveness. Microscopic analyses have shown that oxidation dominates the corroded surfaces.

Untersuchungen zum Diffusionswiderstand von Holzwerkstoffen | Diffusion resistance of timber materials

2005 ◽  
Vol 156 (3-4) ◽  
pp. 100-103
Author(s):  
Rudolf Popper ◽  
Peter Niemz ◽  
Gerhild Eberle
Keyword(s):  
Relative Humidity ◽  
Water Vapour ◽  
Middle Lamella ◽  
Solid Wood ◽  
Diffusion Resistance ◽  
Water Vapour Diffusion ◽  
Wood Panels ◽  
Vapour Diffusion ◽  
Wet Climate ◽  
Panel Thickness

The water vapour diffusion resistance of timber materials were tested in a wet climate (relative humidity ranging from 100%to 65% at 20 °C) and in a dry climate (relative humidity ranging from 0% to 65% and from 0% to 35% at 20 °c) with variation by relative humidity and vapour pressure gradient. The diffusion resistance of multilayer solid wood panels lies under or within the range of the solid wood (spruce), tending even to a lower range. This can be attributed to the loosely inserted middle lamella of the used solid wood panels, which were not correctly glued by the manufacturer. The diffusion resistance of the solid wood panels increases with decreasing moisture content and decreasing panel thickness, as well as with increasing water vapour gradient from 818 to 1520 Pa. There were clear differences between the tested timber materials. The diffusion resistance of particle composites is strongly dependent on the specific gravity. Due to laminar particles OSBs(Oriented Strand Boards) have a larger diffusion resistance than chipboards. The water vapour diffusion resistance of OSBs lies within the range of plywood.

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