Publisher's Note: Electrically Benign Dry-Etching Method for Rutile TiO[sub 2] Thin-Film Capacitors with Ru Electrodes [Electrochem. Solid-State Lett., 13, G1 (2010)]

2010 ◽  
Vol 13 (3) ◽  
pp. S1
Author(s):  
Kyung Min Kim ◽  
Sang Young Lee ◽  
Gyu Jin Choi ◽  
Jeong Hwan Han ◽  
Cheol Seong Hwang
2010 ◽  
Vol 13 (1) ◽  
pp. G1 ◽  
Author(s):  
Kyung Min Kim ◽  
Sang Young Lee ◽  
Gyu Jin Choi ◽  
Jeong Hwan Han ◽  
Cheol Seong Hwang

1996 ◽  
Vol 433 ◽  
Author(s):  
G. E. Menk ◽  
S. B. Desu ◽  
W. Pan ◽  
D. P. Vijay

AbstractDry etching is an area that demands a great deal of attention in the large scale integration of ferroelectric thin film capacitors for nonvolatile random access memory applications. In this review, we discuss some of the issues relating to the etching of the ferroelectric films, patterning of the electrodes, device damage caused by the etch process and post-etch residue problems. An etch process that can provide high etch rates and good etch anisotropy for the current candidate ferroelectrics including Pb(Zr, Ti)O3 and layered structure SrBi2Ta2O9 thin films using environmentally benign gases such as hydrochlorofluorocarbons is presented. The etch mechanism for both of these materials was determined to rely substantially on ion bombardment effects. For example, PZT films were etched anisotropically at rates of up to 60 nm/min using CHCIFCF3 gas under high rf power and low gas pressure conditions. Problems remain with respect to the acrosswafer differential etch rates observed when more than one phase is present in the material (e.g., amorphous/pyrochlore + perovskite phases in PZT). Damage caused by the etch process which can lead to changes in device characteristics, including hysteresis and fatigue properties, and the underlying mechanism that causes the damage are discussed. O2 was found to be a suitable etch gas for etching the conductive oxide electrode material RuO2. However, an anomaly in the etch rate was detected upon introduction of a small amount of fluorine containing gas: addition of 2% of CF3CFH2 gas to the O2 plasma increases the etch rate by a factor of four. This can be taken advantage of in obtaining high etch selectivity between the electrode and ferroelectric layers.


Nanomaterials ◽  
2021 ◽  
Vol 11 (6) ◽  
pp. 1494
Author(s):  
Mustapha El Hariri El Nokab ◽  
Khaled O. Sebakhy

Solid-state NMR has proven to be a versatile technique for studying the chemical structure, 3D structure and dynamics of all sorts of chemical compounds. In nanotechnology and particularly in thin films, the study of chemical modification, molecular packing, end chain motion, distance determination and solvent-matrix interactions is essential for controlling the final product properties and applications. Despite its atomic-level research capabilities and recent technical advancements, solid-state NMR is still lacking behind other spectroscopic techniques in the field of thin films due to the underestimation of NMR capabilities, availability, great variety of nuclei and pulse sequences, lack of sensitivity for quadrupole nuclei and time-consuming experiments. This article will comprehensively and critically review the work done by solid-state NMR on different types of thin films and the most advanced NMR strategies, which are beyond conventional, and the hardware design used to overcome the technical issues in thin-film research.


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