Improvement in Thermal Stability of Nickel Silicides Using NiN[sub x] Films

2010 ◽  
Vol 157 (3) ◽  
pp. H231 ◽  
Author(s):  
Sun Il Kim ◽  
Seung Ryul Lee ◽  
Kyung Min Ahn ◽  
Byung Tae Ahn
Keyword(s):  
Thermal Stability ◽  
Nickel Silicides ◽  
Thermal Stability Of

scholarly journals Phase formation and thermal stability of ultrathin nickel-silicides on Si(100)

2010 ◽  
Vol 96 (17) ◽  
pp. 173503 ◽  
Author(s):  
K. De Keyser ◽  
C. Van Bockstael ◽  
R. L. Van Meirhaeghe ◽  
C. Detavernier ◽  
E. Verleysen ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Phase Formation ◽  
Nickel Silicides ◽  
Thermal Stability Of

Influence of Al addition on phase transformation and thermal stability of nickel silicides on Si(001)

2014 ◽  
Vol 586 ◽  
pp. S362-S367 ◽  
Author(s):  
Shih-Hsien Huang ◽  
Sheng-Chen Twan ◽  
Shao-Liang Cheng ◽  
Tu Lee ◽  
Jung-Chih Hu ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Phase Transformation ◽  
Nickel Silicides ◽  
Al Addition ◽  
Thermal Stability Of

Thermal stability of cobalt and nickel silicides

1998 ◽  
Vol 38 (9) ◽  
pp. 1495-1498 ◽  
Author(s):  
M.C Poon ◽  
C.H Ho ◽  
F Deng ◽  
S.S Lau ◽  
H Wong
Keyword(s):  
Thermal Stability ◽  
Nickel Silicides ◽  
Thermal Stability Of ◽  
Cobalt And Nickel

Enhancement of the Thermal Stability of TiNx Capping Layer on the Nickel Silicides

2011 ◽  
Vol 3 (2) ◽  
pp. 272-275
Author(s):  
Chi-Ting Wu ◽  
Wen-Hsi Lee ◽  
Shih-Chieh Chang ◽  
Yi-Lung Cheng ◽  
Ying-Lang Wang
Keyword(s):  
Thermal Stability ◽  
Capping Layer ◽  
Nickel Silicides ◽  
Thermal Stability Of

The Ordered Phase Formation in Ti-Al-Ga Alloys

1970 ◽  
Vol 28 ◽  
pp. 440-441
Author(s):  
Shiro Fujishiro ◽  
Harold L. Gegel
Keyword(s):  
Thermal Stability ◽  
High Temperature ◽  
Titanium Alloys ◽  
Growth Kinetics ◽  
Stoichiometric Composition ◽  
Good Potential ◽  
Alpha Titanium ◽  
Cold Rolled ◽  
Kinetics Of ◽  
Thermal Stability Of

Ordered-alpha titanium alloys having a DO19 type structure have good potential for high temperature (600°C) applications, due to the thermal stability of the ordered phase and the inherent resistance to recrystallization of these alloys. Five different Ti-Al-Ga alloys consisting of equal atomic percents of aluminum and gallium solute additions up to the stoichiometric composition, Ti3(Al, Ga), were used to study the growth kinetics of the ordered phase and the nature of its interface.The alloys were homogenized in the beta region in a vacuum of about 5×10-7 torr, furnace cooled; reheated in air to 50°C below the alpha transus for hot working. The alloys were subsequently acid cleaned, annealed in vacuo, and cold rolled to about. 050 inch prior to additional homogenization

Microstructure studies of tungsten silicide schottky contacts on Gaas

1987 ◽  
Vol 45 ◽  
pp. 328-329
Author(s):  
Yih-Cheng Shih ◽  
E. L. Wilkie
Keyword(s):  
Thermal Stability ◽  
Field Effect Transistors ◽  
Schottky Contact ◽  
Schottky Contacts ◽  
Excellent Thermal Stability ◽  
Barrier Heights ◽  
Gaas Substrates ◽  
Film Adhesion ◽  
Threshold Voltages ◽  
Thermal Stability Of

Tungsten silicides (WSix) have been successfully used as the gate materials in self-aligned GaAs metal-semiconductor-field- effect transistors (MESFET). Thermal stability of the WSix/GaAs Schottky contact is of major concern since the n+ implanted source/drain regions must be annealed at high temperatures (∼ 800°C). WSi0.6 was considered the best composition to achieve good device performance due to its low stress and excellent thermal stability of the WSix/GaAs interface. The film adhesion and the uniformity in barrier heights and ideality factors of the WSi0.6 films have been improved by depositing a thin layer of pure W as the first layer on GaAs prior to WSi0.6 deposition. Recently WSi0.1 has been used successfully as the gate material in 1x10 μm GaAs FET's on the GaAs substrates which were sputter-cleaned prior to deposition. These GaAs FET's exhibited uniform threshold voltages across a 51 mm wafer with good film adhesion after annealing at 800°C for 10 min.

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