CARBonCHIP: Carbon Nanotubes Technology on Silicon Integrated Circuits; Some Key Results

2019 ◽  
Vol 25 (10) ◽  
pp. 63-71
Author(s):  
Paolo Rapposelli ◽  
Bernard Capraro ◽  
Jean Dijon ◽  
Guido Groeseneken ◽  
Daire Cott ◽  
...  
Author(s):  
Robert Chivas ◽  
Scott Silverman ◽  
Michael DiBattista ◽  
Ulrike Kindereit

Abstract Anticipating the end of life for IR-based failure analysis techniques, a method of global backside preparation to ultra-thin remaining silicon thickness (RST) has been developed. When the remaining silicon is reduced, some redistribution of stress is expected, possibly altering the performance (timing) of integrated circuits in addition to electron-hole pair generation. In this work, a study of the electrical invasiveness due to grinding and polishing silicon integrated circuits to ultra-thin (< 5 um global, ~ 1 um local) remaining thickness is presented.


1991 ◽  
Vol 59 (2) ◽  
pp. 146-148 ◽  
Author(s):  
Michael S. Heutmaker ◽  
George T. Harvey ◽  
Philip F. Bechtold

Author(s):  
Rafael Vargas-Bernal ◽  
Gabriel Herrera-Pérez ◽  
Margarita Tecpoyotl-Torres

Since its discovery in 1991 and 2004, carbon nanotubes (CNTs) by Sumio Iijima, and graphene by Andre Geim and Konstantin Novoselov in 2004, these materials have been extensively studied around the world. Both materials have electronic, thermal, magnetic, optical, chemical, and mechanical extraordinary properties. International Technology Roadmap for Semiconductors (ITRS) has predicted that these nanomaterials are potential replacements of the conventional materials used in the manufacture of integrated circuits. Two of the technological aspects that both materials share and have reduced their extensive use are processing and dispersion required to homogenize the electrical properties of the materials based on them. Fortunately, these problems are being solved thanks to the ongoing investigation, and in a short time the materials used in today's electronics industry will be replaced by devices based on these novel materials. The impact of the applications of both materials in the electronics industry, as well as future trends in the following decades are discussed in this paper.


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