Effects of Organic Additives on the Residual Stress of Ni and Ni Alloys Electrodeposited from the Sulfamate Bath

2019 ◽  
Vol 16 (45) ◽  
pp. 167-175 ◽  
Author(s):  
Hyoung Chan Kim ◽  
Young Seok Kim ◽  
Sang Joon Lee ◽  
Ju Dong Lee ◽  
Man Sig Lee ◽  
...  
Keyword(s):  
Residual Stress ◽  
Organic Additives ◽  
Ni Alloys ◽  
Sulfamate Bath

Effect of Plating Condition on the Mechanical Properties and Residual Stress of Electroplated Copper Film

2007 ◽  
Vol 26-28 ◽  
pp. 637-640 ◽  
Author(s):  
Yoo Min Ahn ◽  
Yong Jun Ko ◽  
Hyun Joon Kim ◽  
Dong Ho Lee ◽  
Su Kei Lee ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Residual Stress ◽  
Silicon Oxide ◽  
Copper Film ◽  
Organic Additives ◽  
Electro Deposition ◽  
Cu Film ◽  
Plating Solution ◽  
Electroplated Copper ◽  
Copper Structure

This paper discusses the effect of plating condition on the mechanical properties and residual stress of electroplated Cu film. The inlaid copper structure was fabricated on silicon wafer where silicon oxide was thermally grown. Seed layer was deposited by sputtering method followed by copper electro-deposition. Copper was electrodeposited with IBM paddle type electroplating machine Residual stress, hardness, elastic modulus, and surface roughness of electroplated copper film were investigated at various organic additives in plating solution and current types with a nanoindenter and a surface profilometer. The dishing amounts in chemical mechanical polishing (CMP) was also investigated at various additives. The results show that, in the case of residual stress, the copper film deposited at higher additive or PC current result in lower residual stress. The additives do not significantly affect the mechanical properties of Cu deposit.

Formation of Multiple Twinned Structural Units in Electrodeposited Nickel after Annealing

2014 ◽  
Vol 783-786 ◽  
pp. 2573-2578 ◽  
Author(s):  
Alexander Kahrimanidis ◽  
Uta Klement
Keyword(s):  
Grain Growth ◽  
Growth Direction ◽  
Zone Axis ◽  
Organic Additives ◽  
Free Standing ◽  
Structural Units ◽  
Ni Alloys ◽  
Orientation Change ◽  
Control Film ◽  
Electrodeposited Nickel

Electrodeposition is an advanced synthesis technique which involves the creation of a coating or free-standing material through an electrolytic process. Organic additives such as saccharin have been frequently used in electroplating operations to moderate deposit growth rates and to control film quality. In the present study, plating of Nickel without additives has resulted in a sub-microcrystalline microstructure and a <110>-fibre texture in growth direction. Structural units in form of groups of grains possessing a common <110>-zone axis in growth direction and low-Σ relationships between them have been found in the microstructure by use of EBSD. Upon annealing, grain growth sets in. However, the structural units and the texture are preserved up to 550°C. This means that the structural units stabilize the microstructure; there is no orientation change when grain growth occurs (e.g. by twinning). The low-Σ boundaries of the structural units are described in detail and texture development upon annealing is discussed in connection with results from previous studies on Ni and Ni-alloys of different initial texture.

Tensile Properties of Bulk Nanocrystalline Ni and Ni-W Fabricated by Sulfamate Bath

2010 ◽  
Vol 654-656 ◽  
pp. 1114-1117 ◽  
Author(s):  
Isao Matsui ◽  
Yorinobu Takigawa ◽  
Tokuteru Uesugi ◽  
Kenji Higashi
Keyword(s):  
Grain Size ◽  
Tensile Strength ◽  
High Strength ◽  
Brittle Behavior ◽  
Ni Alloys ◽  
Large Numbers ◽  
Plastic Deformation Behavior ◽  
Bulk Nanocrystalline ◽  
Reported Data ◽  
Sulfamate Bath

Nanocrystalline materials with high strength have been reported in large numbers. In particular, there has been considerable research on electrodeposited nanocrystalline Ni (nc-Ni) and nc-Ni alloys. However, reported data vary widely especially in ductility. Therefore, it is necessary to obtain the true characteristic value of nc-Ni and nc-Ni alloys. In the present study, nc-Ni and nc-Ni-W was electrodeposited under different conditions in order to obtained bulk nc-Ni and nc-Ni-W with high tensile strength and good ductility. At first, bulk nc-Ni-W was fabricated using a sulfamate bath. Although the resulting bulk nc-Ni-W had inhomogeneous grain size and W-concentration, this sample exhibited plastic deformation behavior. Then, nc-Ni was fabiricated by four types of sulfamate baths. As a result, the nc-Ni obtained from a sulfamate bath containg added saccharine and 2-butyne-1,4-diol exhibited brittle behavior. In contrast, bulk nc-Ni obtained from sulfamate bath with a grain size of about 60 nm exhibited a tensile strength of about 1000 MPa and ductility of 8.8 %.

scholarly journals Electrodeposition of Re-Ni alloys from aqueous solutions with organic additives

2016 ◽  
Vol 616 ◽  
pp. 828-837 ◽  
Author(s):  
Wangping Wu ◽  
Noam Eliaz ◽  
Eliezer Gileadi
Keyword(s):  
Aqueous Solutions ◽  
Organic Additives ◽  
Ni Alloys

Microstructures of Ti-1.5 w/o Ni Alloys with Mo and A1 Additions

1975 ◽  
Vol 33 ◽  
pp. 54-55
Author(s):  
Anna C. Fraker
Keyword(s):  
Corrosion Resistance ◽  
Beneficial Effect ◽  
Crevice Corrosion ◽  
Local Corrosion ◽  
Precipitate Size ◽  
Ni Alloys

Small amounts of nickel are added to titanium to improve the crevice corrosion resistance but this results in an alloy which has sheet fabrication difficulties and is subject to the formation of large Ti2Ni precipitates. These large precipitates can serve as local corrosion sites; but in a smaller more widely dispersed form, they can have a beneficial effect on crevice corrosion resistance. The purpose of the present work is to show that the addition of a small amount of Mo to the Ti-1.5Ni alloy reduces the Ti2Ni precipitate size and produces a more elongated grained microstructure. It has recently been reported that small additions of Mo to Ti-0.8 to lw/o Ni alloys produce good crevice corrosion resistance and improved fabrication properties.

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