Consideration of Gold Thickness in ENIG UBM Application

2019 ◽  
Vol 18 (1) ◽  
pp. 787-792
Author(s):  
Masahiro Nozu ◽  
Tishiaki Shibata ◽  
Kazuki Yoshikawa ◽  
S. Hashimoto
Keyword(s):  
Gold Thickness

Effects of the gold thickness of the surface finish on the interfacial reactions in flip-chip solder joints

2004 ◽  
Vol 33 (10) ◽  
pp. 1092-1097 ◽  
Author(s):  
Y. L. Lin ◽  
W. C. Luo ◽  
Y. H. Lin ◽  
C. E. Ho ◽  
C. R. Kao
Keyword(s):  
Surface Finish ◽  
Flip Chip ◽  
Solder Joints ◽  
Interfacial Reactions ◽  
Gold Thickness

Mammographic calcification cluster detection and threshold gold thickness measurements

2012 ◽  
Author(s):  
L. M. Warren ◽  
A. Mackenzie ◽  
J. Cooke ◽  
R. Given-Wilson ◽  
M. G. Wallis ◽  
...  
Keyword(s):  
Cluster Detection ◽  
Gold Thickness ◽  
Thickness Measurements

“Au (lll)—Cysteine” Complex and its Application in Electro-Less Deposition

2012 ◽  
Vol 550-553 ◽  
pp. 1991-1994
Author(s):  
Wen Tao Jin ◽  
Le Li ◽  
De Liang Li ◽  
Neng Qing Feng ◽  
Ke Lin Li ◽  
...  
Keyword(s):  
Quality Inspection ◽  
Gold Thickness ◽  
Related Quality ◽  
Modern Industry

Auric-cysteine complex[MAu(Cys)4.xH2O,M=K,NH4,Na] was reported in this paper ,and its application in the electro-less plating was studied . By using single factor’s experiments the optimal plating index has been gotten and they are: pH=7~9,[Au]=1.5~3.5 g/L , temperature 40~60 Ċ, supporting ligand 0.1~0.15M and plating time 6~8minutes respectively. Related quality inspection of the plated panels show that the appearance, adhesion power and gold thickness can meet the standard of the modern industry .

Electroless Plating of Gold by Using “Au—Amino Acid” Complex

2011 ◽  
Vol 396-398 ◽  
pp. 1914-1917
Author(s):  
De Liang Li ◽  
Jie Luo ◽  
Li Lu Han ◽  
Yun Peng ◽  
Di Yuan Zhong
Keyword(s):  
Amino Acid ◽  
Chemical Deposition ◽  
Deposition Process ◽  
Quality Inspection ◽  
Cyanide Complex ◽  
Gold Cyanide ◽  
Acid Complex ◽  
Amino Acid Complex ◽  
Orthogonal Experiments ◽  
Gold Thickness

A novel chemical deposition process based on aurous-glycine complex was reported in this paper. By using single factor’s and orthogonal experiments the optimal plating index has been gotten and they are: pH=4~6,[Au]=1.5~2.5 g/L , temperature 40~55 Ċ and plating time 6~8min respectively. Deposition results and quality inspection of the plated panels show that its plating rate is as fast as that of the gold-cyanide complex and reaches 0.020~0.025 um/min, and the quality related parameters including appearance, adhesion power and gold thickness can meet the standard of the modern PCB products.

Optimizing gold thickness of land grid array pads for cost, performance and reliability of connectors

2014 ◽  
Author(s):  
Karumbu Meyyappan ◽  
Anil Kurella ◽  
Balu Pathangey ◽  
Alan McAllister ◽  
Amit Abraham ◽  
...  
Keyword(s):  
Cost Performance ◽  
Gold Thickness
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