Electroless Copper Deposition on Ruthenium for Damascene Interconnects

2019 ◽  
Vol 6 (8) ◽  
pp. 179-184 ◽  
Author(s):  
Qingyun Chen ◽  
Xuan Lin ◽  
C. Valvede ◽  
V. Paneccasio ◽  
R. Hurtubise ◽  
...  
Keyword(s):  
Copper Deposition ◽  
Electroless Copper ◽  
Damascene Interconnects

The Effect of the Microstructure of Diffusion Barriers on the Palladium Activation for Electroless Copper Deposition

2002 ◽  
Vol 716 ◽  
Author(s):  
Seok Woo Hong ◽  
Yong Sun Lee ◽  
Ki-Chul Park ◽  
Jong-Wan Park
Keyword(s):  
Electron Microscopy ◽  
Diffusion Barriers ◽  
Copper Deposition ◽  
X Ray Diffraction ◽  
Plan View ◽  
X Ray ◽  
Transmission Electron ◽  
Electroless Copper ◽  
Sheet Resistance Measurement ◽  
Scanning Electron

AbstractThe effect of microstructure of dc magnetron sputtered TiN and TaN diffusion barriers on the palladium activation for autocatalytic electroless copper deposition has been investigated by using X-ray diffraction, sheet resistance measurement, field emission scanning electron microscopy (FE-SEM) and plan view transmission electron microscopy (TEM). The density of palladium nuclei on TaN diffusion barrier increases as the grain size of TaN films decreases, which was caused by increasing nitrogen content in TaN films. Plan view TEM results of TiN and TaN diffusiton barriers showed that palladium nuclei formed mainly on the grain boundaries of the diffusion barriers.

Selective Electroless Copper Deposition within Block Copolymer Microdomains

2000 ◽  
Vol 12 (6) ◽  
pp. 1628-1633 ◽  
Author(s):  
Yot Boontongkong ◽  
Robert E. Cohen ◽  
Michael F. Rubner
Keyword(s):  
Block Copolymer ◽  
Copper Deposition ◽  
Electroless Copper

New plating bath for electroless copper deposition on sputtered barrier layers

2000 ◽  
Vol 50 (1-4) ◽  
pp. 441-447 ◽  
Author(s):  
Yuri Lantasov ◽  
Roger Palmans ◽  
Karen Maex
Keyword(s):  
Copper Deposition ◽  
Plating Bath ◽  
Barrier Layers ◽  
Electroless Copper

scholarly journals Electroless copper deposition on a Pt polyfaceted single crystal

1990 ◽  
Vol 281 (1-2) ◽  
pp. 273-277
Author(s):  
J.J. Podestá ◽  
J.C. Canullo ◽  
A.J. Arvia ◽  
A.G. Alvarez
Keyword(s):  
Single Crystal ◽  
Copper Deposition ◽  
Electroless Copper
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