Mixed Orientation Si-Si Interfaces by Hydrophilic Bonding and High Temperature Oxide Dissolution: Wafer Fabrication Technique and Device Applications
2008 ◽
Vol 155
(2)
◽
pp. H80
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1993 ◽
Vol 07
(16n17)
◽
pp. 3077-3093
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Keyword(s):
Keyword(s):
1997 ◽
Vol 36
(1-4)
◽
pp. 87-90
◽
2006 ◽
pp. 1-12
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