TiO2 Nanoparticles Role in NiB Films Formation with the Dynamic Chemical Plating Deposition Method

2019 ◽  
Vol 3 (21) ◽  
pp. 105-109 ◽  
Author(s):  
Guy Stremsdoerfer ◽  
Hamid Omidvar ◽  
Y. Meas
Keyword(s):  
Tio2 Nanoparticles ◽  
Deposition Method ◽  
Chemical Plating

Preparation of Thin Films of TiO2 Nanoparticles using Electrophoresis Deposition Method

2009 ◽  
Vol 129 (9) ◽  
pp. 620-626
Author(s):  
Kazuatsu Ito ◽  
Yuuki Sato ◽  
Motonari Adachi ◽  
Shinzo Yoshikado
Keyword(s):  
Thin Films ◽  
Tio2 Nanoparticles ◽  
Deposition Method ◽  
Electrophoresis Deposition

Preparation of Thin Films of TiO2-Nanoparticles Using Electrophoresis Deposition Method

2009 ◽  
Vol 421-422 ◽  
pp. 173-176 ◽  
Author(s):  
Kazuatsu Ito ◽  
Yuuki Sato ◽  
Motonari Adachi ◽  
Shinzo Yoshikado
Keyword(s):  
Thin Film ◽  
Tio2 Nanoparticles ◽  
Tio2 Thin Film ◽  
Deposition Time ◽  
Negative Electrode ◽  
Optical Transparency ◽  
Deposition Method ◽  
Ito Glass ◽  
Electrophoresis Deposition ◽  
Positively Charged

TiO2-nanoparticles of anatase-type were synthesized and deposited using the electrophoresis depo-sition method. All of TiO2-nanoparticles were positively charged in colloidal aqueous solution and were attracted toward ITO glass as the negative electrode as same as nanoparticles (P25) whose diameter is larger than that of TiO2-nanoparticles. Many of the TiO2-nanoparticles were connected with each other and formed clusters, although single TiO2-nanoparticles were also observed. The cracks generated in the thin film with increasing the deposition time and thin film was flaked off from substrate. High optical transparency TiO2-nanoparticles-thin film without cracks was deposited when the deposition time was short. Moreover, the thickness of TiO2-thin film, which has high optical transparency and no cracks, could be increased using mixture of TiO2-nanoparticles and P25.

Electrochemical and photoelectrochemical water splitting with a CoOx catalyst prepared by flame assisted deposition

2020 ◽  
Vol 49 (3) ◽  
pp. 588-592 ◽  
Author(s):  
Fusheng Li ◽  
Ziqi Zhao ◽  
Hao Yang ◽  
Dinghua Zhou ◽  
Yilong Zhao ◽  
...  
Keyword(s):  
Cobalt Oxide ◽  
Water Splitting ◽  
Water Oxidation ◽  
Oxide Catalyst ◽  
Photoelectrochemical Water Splitting ◽  
Deposition Method ◽  
Photoelectrochemical Water Oxidation

A cobalt oxide catalyst prepared by a flame-assisted deposition method on the surface of FTO and hematite for electrochemical and photoelectrochemical water oxidation, respectively.

Anelastic Study of Nanocrystalline Gold Prepared by Gas Deposition Method

1996 ◽  
Vol 06 (C8) ◽  
pp. C8-199-C8-202
Author(s):  
H. Tanimoto ◽  
H. Mizubayashi ◽  
H. Fujita ◽  
S. Okuda
Keyword(s):  
Deposition Method

Anisotropic Plasma ChemicalVapor Deposition of Copper Films in Trenches

2003 ◽  
Vol 766 ◽  
Author(s):  
Kosuke Takenaka ◽  
Masao Onishi ◽  
Manabu Takenshita ◽  
Toshio Kinoshita ◽  
Kazunori Koga ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Deposition Rate ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Anisotropic Plasma ◽  
Bottom Surface ◽  
Chemical Vapor Deposition Method ◽  
Copper Films ◽  
Deposition Method ◽  
Via Holes

AbstractAn ion-assisted chemical vapor deposition method by which Cu is deposited preferentially from the bottom of trenches (anisotropic CVD) has been proposed in order to fill small via holes and trenches. By using Ar + H2 + C2H5OH[Cu(hfac)2] discharges with a ratio H2 / (H2 + Ar) = 83%, Cu is filled preferentially from the bottom of trenches without deposition on the sidewall and top surfaces. The deposition rate on the bottom surface of trenches is experimentally found to increase with decreasing its width.

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