Measurement of Anodic Oxide Film Thickness by Electroreflectance Interferometry

1969 ◽  
Vol 116 (2) ◽  
pp. 280 ◽  
Author(s):  
B. J. Holden ◽  
F. G. Ullman
2010 ◽  
Vol 60 (11) ◽  
pp. 602-607 ◽  
Author(s):  
Tomoharu Yamamoto ◽  
Hiroomi Tanaka ◽  
Masahiro Fujita ◽  
Hidetaka Asoh ◽  
Sachiko Ono

2006 ◽  
Vol 510-511 ◽  
pp. 686-689
Author(s):  
Seong Jong Kim ◽  
Jeong Il Kim

This paper investigated the effects of anodizing time on the formation of anodic oxide films on a Mg-Al alloy in alkaline solution. The thickness of the anodic oxide film was increased by increasing the time required to generate the active dissolution reaction. When anodizing at various anodizing time, the potential after passivity increased with time, which implies growth in film thickness. When the anodizing time was varied, the quantity of oxygen increased with time in the white areas (the film), i.e., more film was observed in the SEM and EDX analyses.


Author(s):  
Michio Ashida ◽  
Yasukiyo Ueda

An anodic oxide film is formed on aluminum in an acidic elecrolyte during anodizing. The structure of the oxide film was observed directly by carbon replica method(l) and ultra-thin sectioning method(2). The oxide film consists of barrier layer and porous layer constructed with fine hexagonal cellular structure. The diameter of micro pores and the thickness of barrier layer depend on the applying voltage and electrolyte. Because the dimension of the pore corresponds to that of colloidal particles, many metals deposit in the pores. When the oxide film is treated as anode in emulsion of polyelectrolyte, the emulsion particles migrate onto the film and deposit on it. We investigated the behavior of the emulsion particles during electrodeposition.Aluminum foils (99.3%) were anodized in either 0.25M oxalic acid solution at 30°C or 3M sulfuric acid solution at 20°C. After washing with distilled water, the oxide films used as anode were coated with emulsion particles by applying voltage of 200V and then they were cured at 190°C for 30 minutes.


Vacuum ◽  
2021 ◽  
pp. 110265
Author(s):  
Munenori Yoshida ◽  
Hiromi Yamanaka ◽  
Kenta Tomori ◽  
Sergei Kulinich ◽  
Syuuichi Maeda ◽  
...  

2021 ◽  
Vol 118 (21) ◽  
pp. 212101
Author(s):  
Alena Nikolskaya ◽  
Alexey Belov ◽  
Alexey Mikhaylov ◽  
Anton Konakov ◽  
David Tetelbaum ◽  
...  

Wear ◽  
1996 ◽  
Vol 196 (1-2) ◽  
pp. 214-218 ◽  
Author(s):  
Xu Tao ◽  
Chen Jianmin ◽  
Zhao Jiazheng ◽  
Dang Hongxin

1991 ◽  
Vol 226 ◽  
Author(s):  
Hideo Miura ◽  
Hiroshi Sakata ◽  
Shinji Sakata Merl

AbstractThe residual stress in silicon substrates after local thermal oxidation is discussed experimentally using microscopic Raman spectroscopy. The stress distribution in the silicon substrate is determined by three main factors: volume expansion of newly grown silicon–dioxide, deflection of the silicon–nitride film used as an oxidation barrier, and mismatch in thermal expansion coefficients between silicon and silicon dioxide.Tensile stress increases with the increase of oxide film thickness near the surface of the silicon substrate under the oxide film without nitride film on it. The tensile stress is sometimes more than 100 MPa. On the other hand, a complicated stress change is observed near the surface of the silicon substrate under the nitride film. The tensile stress increases initially, as it does in the area without nitride film on it. However, it decreases with the increase of oxide film thickness, then the compressive stress increases in the area up to 170 MPa. This stress change is explained by considering the drastic structural change of the oxide film under the nitride film edge during oxidation.


ChemInform ◽  
2010 ◽  
Vol 26 (29) ◽  
pp. no-no
Author(s):  
J. L. ORD ◽  
D. J. DE SMET

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